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公开(公告)号：US11940390B2
公开(公告)日：2024-03-26
申请号：US17829593
申请日：2022-06-01
发明人： Yotam Sofer , Shaul Engler , Boaz Cohen , Saar Shabtay , Amir Bar , Marcelo Gabriel Bacher
CPC分类号： G01N21/8851 , G06F18/00 , G06F30/27 , G06V10/70 , G06V10/993 , G06V20/69 , G01N2021/8854
摘要： A system, method and computer readable medium for examining a specimen, the method comprising: obtaining defects of interest (DOIs) and false alarms (FAs) from a review subset selected from a group of potential defects received from an inspection tool, each potential defect is associated with attribute values defining a location of the potential defect in an attribute space; generating a representative subset of the group, comprising potential defects selected in accordance with a distribution of the potential defects within the attribute space, and indicating the potential defects in the representative subset as FA; and training a classifier using data informative of the attribute values of the DOIs, the potential defects of the representative subset, and respective indications thereof as DOIs or FAs, wherein the trained classifier is to be applied to at least some of the potential defects to obtain an estimation of a number of expected DOIs.
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公开(公告)号：US20190012781A1
公开(公告)日：2019-01-10
申请号：US16102112
申请日：2018-08-13
发明人： Saar Shabtay , Idan Kaizerman , Amir Watchs
摘要： Data indicative of a group of defect candidates may be obtained. The data may be indicative of a group of defect candidates and may include values of attributes for each defect candidate of the group of defect candidates. Sub-groups of defect candidates may be iteratively selected for review using a review recipe to classify the defect candidates in each selected sub-group based on the values of attributes of respective defect candidates and classification results of previously reviewed defect candidates. The sub-groups may be selected until a sampling stop condition is fulfilled to obtain a classification output for the wafer. Instructions specifying at least one of the sampling stop condition, the inspection recipe, or the review recipe may be altered and additional defect candidates in a next wafer may be classified by using the altered instructions.
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公开(公告)号：US20210109029A1
公开(公告)日：2021-04-15
申请号：US17129745
申请日：2020-12-21
发明人： Saar Shabtay , Moshe Amzaleg , Zvi Goren
摘要： Inspection data that corresponds to potential defects of an object may be received. A first set of locations of first potential defects can be identified. The first set of locations of the first potential defects can be imaged with a review tool to obtain a first set of review images. The first potential defects can be classified based on the first set of review images to obtain first classification results of the first potential defects. An instruction can be determined for the review tool based on the first classification results, the instruction being associated with detecting potential defects. Using the instruction, a second set of locations of second potential defects of the plurality of potential defects to be imaged with the review tool can be identified.
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公开(公告)号：US10818000B2
公开(公告)日：2020-10-27
申请号：US16102112
申请日：2018-08-13
发明人： Saar Shabtay , Idan Kaizerman , Amir Watchs
摘要： Data indicative of a group of defect candidates may be obtained. The data may be indicative of a group of defect candidates and may include values of attributes for each defect candidate of the group of defect candidates. Sub-groups of defect candidates may be iteratively selected for review using a review recipe to classify the defect candidates in each selected sub-group based on the values of attributes of respective defect candidates and classification results of previously reviewed defect candidates. The sub-groups may be selected until a sampling stop condition is fulfilled to obtain a classification output for the wafer. Instructions specifying at least one of the sampling stop condition, the inspection recipe, or the review recipe may be altered and additional defect candidates in a next wafer may be classified by using the altered instructions.
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公开(公告)号：US10605745B2
公开(公告)日：2020-03-31
申请号：US16022566
申请日：2018-06-28
发明人： Yotam Sofer , Boaz Cohen , Saar Shabtay , Eli Buchman
IPC分类号： G01N21/95 , G01N21/956
摘要： A candidate defect may be identified at a semiconductor wafer. A determination may be made as to whether the candidate defect at the semiconductor wafer corresponds to a systematic defect or a random defect. In response to determining that the candidate defect at the semiconductor wafer corresponds to a systematic detect, the candidate defect at the semiconductor wafer may be provided to a defect review tool for review by the defect review tool.
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公开(公告)号：US20200003700A1
公开(公告)日：2020-01-02
申请号：US16022566
申请日：2018-06-28
发明人： Yotam Sofer , Boaz Cohen , Saar Shabtay , Eli Buchman
IPC分类号： G01N21/95 , G01N21/956
摘要： A candidate defect may be identified at a semiconductor wafer. A determination may be made as to whether the candidate defect at the semiconductor wafer corresponds to a systematic defect or a random defect. In response to determining that the candidate defect at the semiconductor wafer corresponds to a systematic detect, the candidate defect at the semiconductor wafer may be provided to a defect review tool for review by the defect review tool.
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公开(公告)号：US10408764B2
公开(公告)日：2019-09-10
申请号：US15703937
申请日：2017-09-13
发明人： Saar Shabtay , Moshe Amzaleg , Zvi Goren
摘要： Examination system, method and computer-readable medium, the method comprising: processing by a processor using a first recipe at least one image comprised in images and metadata generated by an inspection tool and stored, to detect a first location set of first potential defects and attributes thereof; selecting and imaging part of the first location set with a review tool to obtain an image set; obtaining classification results of said first potential defects and determining a further recipe based thereon; processing the image using the further recipe for detecting a further location set of further defects; selecting part of the further location set; imaging the part with the review tool to obtain a further image set, and obtaining further classification results; and repeating determining the further recipe, processing the image, selecting and imaging part of the further location set, and obtaining further classification results, until a stopping criteria is met.
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公开(公告)号：US10049441B2
公开(公告)日：2018-08-14
申请号：US15019894
申请日：2016-02-09
发明人： Saar Shabtay , Idan Kaizerman , Amir Wachs
摘要： A method for classifying defects of a wafer, the method is executed by a computerized system, the method may include obtaining defect candidate information about a group of defect candidates, wherein the defect candidate information comprises values of attributes per each defect candidate of the group; selecting, by a processor of the computerized system, a selected sub-group of defect candidates in response to values of attributes of defect candidates that belong to at least the selected sub-group; classifying defect candidates of the selected sub-group to provide selected sub-group classification results; repeating, until fulfilling a stop condition: selecting an additional selected sub-group of defect candidates in response to (a) values of attributes of defect candidates that belong to at least the additional selected sub-group; and (b) classification results obtained from classifying at least one other selected sub-group; and classifying defect candidates of the additional selected sub-group to provide additional selected sub-group classification results.
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公开(公告)号：US11592400B2
公开(公告)日：2023-02-28
申请号：US17129745
申请日：2020-12-21
发明人： Saar Shabtay , Moshe Amzaleg , Zvi Goren
摘要： Inspection data that corresponds to potential defects of an object may be received. A first set of locations of first potential defects can be identified. The first set of locations of the first potential defects can be imaged with a review tool to obtain a first set of review images. The first potential defects can be classified based on the first set of review images to obtain first classification results of the first potential defects. An instruction can be determined for the review tool based on the first classification results, the instruction being associated with detecting potential defects. Using the instruction, a second set of locations of second potential defects of the plurality of potential defects to be imaged with the review tool can be identified.
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公开(公告)号：US20220291138A1
公开(公告)日：2022-09-15
申请号：US17829593
申请日：2022-06-01
发明人： Yotam Sofer , Shaul Engler , Boaz Cohen , Saar Shabtay , Amir Bar , Marcelo Gabriel Bacher
摘要： A system, method and computer readable medium for examining a specimen, the method comprising: obtaining defects of interest (DOIs) and false alarms (FAs) from a review subset selected from a group of potential defects received from an inspection tool, each potential defect is associated with attribute values defining a location of the potential defect in an attribute space; generating a representative subset of the group, comprising potential defects selected in accordance with a distribution of the potential defects within the attribute space, and indicating the potential defects in the representative subset as FA; and training a classifier using data informative of the attribute values of the DOIs, the potential defects of the representative subset, and respective indications thereof as DOIs or FAs, wherein the trained classifier is to be applied to at least some of the potential defects to obtain an estimation of a number of expected DOIs.
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