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公开(公告)号:US11368006B2
公开(公告)日:2022-06-21
申请号:US17063121
申请日:2020-10-05
Applicant: APTIV TECHNOLOGIES LIMITED
Inventor: David R. Peterson , Joseph Sudik, Jr.
Abstract: A clip includes first and second portions that are joined to one another by a living hinge. A snap includes first and second coupling elements that are respectively provided on the first and second portions. The first and second coupling elements are decoupled from one another in an open clip position and are coupled to one another in a closed clip position. Each of the first and second portions define an elongated slot that extends through a width of the clip that has an open end and a closed end. The open ends face a same direction. Each of the first and second portions include a first and second spring respectively. The first and second springs face one another. The first and second springs are configured to clamp about a wiring in the closed clip position.
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公开(公告)号:US11345084B2
公开(公告)日:2022-05-31
申请号:US16203703
申请日:2018-11-29
Applicant: Aptiv Technologies Limited
Inventor: David R. Peterson , Joseph Sudik, Jr. , Jonathan D. Weidner , Sean P. Krompegel , Jared Bilas
IPC: B29C64/393 , B33Y50/02 , B29C64/165 , B29C64/118 , B33Y10/00 , B33Y80/00 , H01B13/00 , H01B7/00 , H01B13/012 , H01B13/24 , B29L31/34
Abstract: A wiring harness assembly includes a plurality of electrical conductors having wires enclosed within insulative sheaths that are integrally formed of an electrically insulative material. The assembly also includes a lattice support structure that is attached to the insulative sheaths at multiple locations. The lattice support structure is configured to maintain a desired shape of the assembly. The lattice support structure is formed of filaments that may be formed using an additive manufacturing process The filaments may be arranged such that lattice support structure defines a plurality of hexagonally shaped apertures. A process for manufacturing the wiring harness assembly and an apparatus configured to manufacture the wiring harness assembly is also presented.
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23.
公开(公告)号:US11069994B2
公开(公告)日:2021-07-20
申请号:US16363235
申请日:2019-03-25
Applicant: Aptiv Technologies Limited
Inventor: David R. Peterson , Jared Bilas , Joseph Sudik, Jr. , Jonathan D. Weidner , Sean P. Krompegel , Jesse Braun
IPC: H01R12/77 , H01B7/08 , H01B13/00 , H01R4/02 , H01R4/2429 , H01R13/424 , H01R43/02 , H01R43/20 , H01R43/28
Abstract: An electrical cable assembly is presented herein. The electrical cable assembly includes a multiconductor flat cable including a first and second electrically conductive wire arranged in a coplanar fashion with each other and encased within a planar dielectric structure. A slot is defined in the planar dielectric structure intermediate the first and second wires, thereby forming first wing features in the dielectric structure extending from the first wire and second wing features extending from the second wire. Exposed portions of the first and second wires extend beyond the first and second wing features. A method of forming the electrical cable assembly, an apparatus for forming the electrical cable assembly, and an electrical terminal configured for use in the electrical cable assembly is also presented. The wing features may include holes and the terminals may include prongs to be received in the holes.
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