公开(公告)号：US20220037290A1

公开(公告)日：2022-02-03

申请号：US17499646

申请日：2021-10-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： You-Lung YEN ,  Bernd Karl APPELT ,  Kay Stefan ESSIG

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00

Abstract: A semiconductor device package includes a substrate, a stacked structure and an encapsulation layer. The substrate includes a circuit layer, a first surface and a second surface opposite to the first surface. The substrate defines at least one cavity through the substrate. The stacked structure includes a first semiconductor die disposed on the first surface and electrically connected on the circuit layer, and at least one second semiconductor die stacked on the first semiconductor die and electrically connected to the first semiconductor die. The second semiconductor die is at least partially inserted into the cavity. The encapsulation layer is disposed in the cavity and at least entirely encapsulating the second semiconductor die.

公开(公告)号：US20210183787A1

公开(公告)日：2021-06-17

申请号：US16717948

申请日：2019-12-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： You-Lung YEN ,  Bernd Karl APPELT

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/31

Abstract: A semiconductor device package includes an electronic component, an infrared blocking layer, an upper protection layer and a side protection layer. The infrared blocking layer includes a first portion disposed over the electronic component. The infrared blocking layer includes a second portion surrounding the electronic component. The first portion is integral with the second portion. The upper protection layer is disposed on the first portion of the infrared blocking layer. The side protection layer is disposed on the second portion of the infrared blocking layer. The upper protection layer and the side protection layer are formed of different materials.

公开(公告)号：US20210166993A1

公开(公告)日：2021-06-03

申请号：US16700761

申请日：2019-12-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： You-Lung YEN ,  Bernd Karl APPELT

IPC: H01L23/48 ,  H01L23/482 ,  H01L23/31 ,  H01L21/56 ,  H01L21/762 ,  H01L23/00

Abstract: A semiconductor device package includes a substrate, a first semiconductor die, a conductive via, a first contact pad and a second contact pad. The substrate includes a first surface, and a second surface opposite to the first surface, the substrate defines a cavity through the substrate. The first semiconductor die is disposed in the cavity, wherein the first semiconductor die includes an active surface adjacent to the first surface, and an inactive surface. The conductive via penetrates through the substrate. The first contact pad is exposed from the active surface of the first semiconductor die and adjacent to the first surface of the substrate. The second contact pad is disposed on the first surface of the substrate, wherein the second contact pad is connected to a first end of the conductive via.

公开(公告)号：US20180019175A1

公开(公告)日：2018-01-18

申请号：US15649543

申请日：2017-07-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Bernd Karl APPELT ,  Kay Stefan ESSIG

IPC: H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L21/48 ,  H01L23/00 ,  H01L21/56

Abstract: A semiconductor package device includes a first die having a first surface and a second surface opposite to the first surface, and a first adhesive layer disposed on the first surface of the first die. The semiconductor package device further includes an encapsulant layer encapsulating the first die and the first adhesive layer, and a first conductive via disposed in the first adhesive layer and electrically connected to the first die.

公开(公告)号：US20240355793A1

公开(公告)日：2024-10-24

申请号：US18137392

申请日：2023-04-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kay Stefan ESSIG ,  You-Lung YEN ,  Bernd Karl APPELT ,  Jean Marc YANNOU

IPC: H01L25/10 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L25/105 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L2225/1058

Abstract: A semiconductor package structure and a method of manufacturing a semiconductor package structure is provided. The semiconductor package structure includes a carrier and a component. The carrier includes a first part and a second part separated from the first part. The component is disposed under the first part and electrically connected to the second part. The first part is configured to be electrically connected to a device disposed over the first part.

公开(公告)号：US20230097299A1

公开(公告)日：2023-03-30

申请号：US17477238

申请日：2021-09-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： You-Lung YEN ,  Bernd Karl APPELT

IPC: H01L23/31 ,  H01L23/29

Abstract: An electronic package includes a carrier, a protection layer and an electronic component. The carrier includes a dielectric layer and a pad in contact with the dielectric layer. The protection layer at least partially covers the pad. The electronic component is located over the protection layer and electrically connected to the pad. At least one portion of the protection layer under the electronic component is substantially conformal with a profile of the pad or with a profile of the dielectric layer.

公开(公告)号：US20230039430A1

公开(公告)日：2023-02-09

申请号：US17395215

申请日：2021-08-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： You-Lung YEN ,  Bernd Karl APPELT ,  Kay Stefan ESSIG

IPC: H01L23/495 ,  H01L25/065 ,  H01L23/31 ,  H01L25/00

Abstract: An electronic package includes a patterned conductive layer and at least one conductive protrusion on the patterned conductive layer. The at least one conductive protrusion has a first top surface. The patterned conductive layer and the at least one conductive protrusion define a space. The electronic package further includes a first electronic component disposed in the space and a plurality of conductive pillars on the first electronic component. The conductive pillars have a second top surface. The first top surface is substantially level with the second top surface.

公开(公告)号：US20220359363A1

公开(公告)日：2022-11-10

申请号：US17315067

申请日：2021-05-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： You-Lung YEN ,  Bernd Karl APPELT ,  Kay Stefan ESSIG

IPC: H01L23/498 ,  H01L21/48

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first package and a second package. The first package includes a first substrate, an electronic component, a trace layer, and a first conductive structure. The first substrate has a first surface and a second surface opposite to the first surface. The electronic component is embedded in the first substrate. The trace layer has an uppermost conductive layer embedded in the first substrate and exposed from the first surface of the first substrate. The first conductive structure electrically connects the trace layer to the second surface of the first substrate. The second package is disposed on the first surface of the first substrate of the first package.

公开(公告)号：US20220319972A1

公开(公告)日：2022-10-06

申请号：US17223932

申请日：2021-04-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： You-Lung YEN ,  Bernd Karl APPELT

IPC: H01L23/498 ,  H01L23/66 ,  H01L21/56 ,  H01L21/48 ,  H01L23/552 ,  H01Q1/22

Abstract: A semiconductor device package and method for manufacturing the same are provided. The semiconductor device package includes a dielectric layer, an electronic component, a first conductive layer, and a conductive element. The dielectric layer has a first surface and a second surface opposite to the first surface. The electronic component is embedded in the dielectric layer. The first conductive layer is embedded in the dielectric layer and adjacent to the first surface of the dielectric layer. The conductive element is disposed on the first surface of the dielectric layer and in contact with the first conductive layer.

公开(公告)号：US20220302008A1

公开(公告)日：2022-09-22

申请号：US17209055

申请日：2021-03-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： You-Lung YEN ,  Bernd Karl APPELT

IPC: H01L23/498 ,  H01L23/538 ,  H01L23/00

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate, a first module disposed on the substrate, a second module disposed on the substrate and spaced apart from the first module, and a conductive element disposed outside of the substrate and configured to provide a signal transmission path between the first module and the second module.