公开(公告)号：US20220020605A1

公开(公告)日：2022-01-20

申请号：US16933813

申请日：2020-07-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kay Stefan ESSIG ,  Jean Marc YANNOU ,  Bradford FACTOR

IPC: H01L21/56 ,  H01L23/492 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065 ,  H01L23/498

Abstract: A semiconductor package structure and a method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a conductive base, a first semiconductor die, a first conductive pillar, and a first encapsulant. The conductive base has a first surface. The first semiconductor die is disposed on the first surface of the conductive base. The first conductive pillar is disposed on the first semiconductor die. The first encapsulant is disposed on the first surface of the conductive base. The first encapsulant encapsulates the first semiconductor die. The first encapsulant includes an opening defined by the first conductive pillar.

公开(公告)号：US20240355793A1

公开(公告)日：2024-10-24

申请号：US18137392

申请日：2023-04-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kay Stefan ESSIG ,  You-Lung YEN ,  Bernd Karl APPELT ,  Jean Marc YANNOU

IPC: H01L25/10 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L25/105 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L2225/1058

Abstract: A semiconductor package structure and a method of manufacturing a semiconductor package structure is provided. The semiconductor package structure includes a carrier and a component. The carrier includes a first part and a second part separated from the first part. The component is disposed under the first part and electrically connected to the second part. The first part is configured to be electrically connected to a device disposed over the first part.