Dental Tools for Photo-Curing of Dental Fillings
    21.
    发明申请
    Dental Tools for Photo-Curing of Dental Fillings 审中-公开
    用于牙科填充物的光固化牙科工具

    公开(公告)号:US20110256498A1

    公开(公告)日:2011-10-20

    申请号:US13086057

    申请日:2011-04-13

    IPC分类号: A61C5/04

    摘要: A dental tool for use in photo-cured filling processes. The dental tool includes a tool tip formed from a material that allows the transmission of ultraviolet and visible light wavelengths through the tool tip without significant distortion or reflection. The material is also relatively high strength so not to shatter or break during use. The fill material will also not easily adhere to the tool. The material of a preferred embodiment is sapphire. The tool is able to continue to compact and shape the fill material while the composite polymer fill material is undergoing photo-curing. The light beam used for photo-curing is able to safely pass through the tool without the risk of damage to the surrounding tissue from reflection or distortion of the light beam.

    摘要翻译: 用于光固化灌装工艺的牙科工具。 该牙科工具包括由能够透过工具尖端的紫外线和可见光波长透过而不会发生明显变形或反射的材料形成的工具尖端。 该材料的强度也相对较高,因此在使用过程中不会破裂或破裂。 填充材料也不会轻易粘附在工具上。 优选实施例的材料是蓝宝石。 当复合聚合物填充材料经历光固化时,该工具能够继续压缩和成形填充材料。 用于光固化的光束能够安全地通过工具,而不会损坏周围组织以避免光束的反射或变形。

    Dental Tools for Photo-Curing of Dental Fillings
    22.
    发明申请
    Dental Tools for Photo-Curing of Dental Fillings 审中-公开
    用于牙科填充物的光固化牙科工具

    公开(公告)号:US20110256497A1

    公开(公告)日:2011-10-20

    申请号:US12763159

    申请日:2010-04-19

    IPC分类号: A61C19/00 A61C5/04

    摘要: A dental tool for use in photo-cured filling processes. The dental tool includes a tool tip formed from a material that allows the transmission of ultraviolet and visible light wavelengths through the tool tip without significant distortion or reflection. The material is also relatively high strength so not to shatter or break during use. The fill material will also not adhere to the tool. The material of a preferred embodiment is sapphire. The tool is able to continue to compact and shape the fill material while the composite polymer fill material is undergoing photo-curing. The light beam used for photo-curing is able to safely pass through the tool without the risk of damage to the surrounding tissue from reflection or distortion of the light beam.

    摘要翻译: 用于光固化灌装工艺的牙科工具。 该牙科工具包括由能够透过工具尖端的紫外线和可见光波长透过而不会发生明显变形或反射的材料形成的工具尖端。 该材料的强度也相对较高,因此在使用过程中不会破裂或破裂。 填充材料也不会粘附在工具上。 优选实施例的材料是蓝宝石。 当复合聚合物填充材料经历光固化时,该工具能够继续压缩和成形填充材料。 用于光固化的光束能够安全地通过工具,而不会损坏周围组织以避免光束的反射或变形。

    Device having etched feature with shrinkage carryover
    23.
    发明授权
    Device having etched feature with shrinkage carryover 有权
    具有减缩残留的蚀刻特征的装置

    公开(公告)号:US07829852B2

    公开(公告)日:2010-11-09

    申请号:US11864761

    申请日:2007-09-28

    CPC分类号: G01N23/225

    摘要: In an embodiment of the present invention, a device includes a first etched feature located in a critical dimension scanning electron microscope (CD-SEM) characterization location, the first etched feature having an upper section, a middle section, and a lower section wherein the middle section is severely shrunk relative to a corresponding middle section of a second etched feature having similar dimensions and composition that is not located in a CD-SEM characterization location. In another embodiment of the present invention, the middle section of the first etched feature has a shrinkage carryover exceeding a threshold. In still another embodiment of the present invention, the middle section of the first etched feature exhibits a line edge roughness.

    摘要翻译: 在本发明的一个实施例中,一种器件包括位于临界尺寸扫描电子显微镜(CD-SEM)表征位置的第一蚀刻特征,第一蚀刻特征具有上部,中间部分和下部,其中 中间部分相对于具有类似尺寸和组成的第二蚀刻特征的相应中间部分而严重缩小,该尺寸和组成不位于CD-SEM表征位置。 在本发明的另一个实施例中,第一蚀刻特征的中间部分具有超过阈值的收缩滞留。 在本发明的另一个实施例中,第一蚀刻特征的中间部分呈现线边缘粗糙度。

    Dynamic sampling with efficient model for overlay
    24.
    发明授权
    Dynamic sampling with efficient model for overlay 失效
    动态采样与高效模型的叠加

    公开(公告)号:US07571420B2

    公开(公告)日:2009-08-04

    申请号:US11676258

    申请日:2007-02-16

    IPC分类号: G06F17/50

    摘要: The present invention describes a method including: determining field-clustering scheme; selecting initial sample plan; establishing initial model of overlay, the initial model of overlay comprising components; and establishing efficient model of overlay from the initial model of overlay including: constructing matrices; identifying redundant components and eliminating the redundant components; and identifying highly-correlated components and determining whether to eliminate the highly-correlated components.

    摘要翻译: 本发明描述了一种方法,包括:确定场聚类方案; 选择初始样本计划; 建立覆盖的初始模型,包含组件的覆盖的初始模型; 并从覆盖的初始模型建立覆盖层的有效模型,包括:构造矩阵; 识别冗余组件并消除冗余组件; 并识别高度相关的组件并确定是否消除高度相关的组件。

    DEVICE HAVING ETCHED FEATURE WITH SHRINKAGE CARRYOVER
    25.
    发明申请
    DEVICE HAVING ETCHED FEATURE WITH SHRINKAGE CARRYOVER 有权
    具有收缩特征的设备

    公开(公告)号:US20080020302A1

    公开(公告)日:2008-01-24

    申请号:US11864761

    申请日:2007-09-28

    IPC分类号: G03C5/00

    CPC分类号: G01N23/225

    摘要: In an embodiment of the present invention, a device includes a first etched feature located in a critical dimension scanning electron microscope (CD-SEM) characterization location, the first etched feature having an upper section, a middle section, and a lower section wherein the middle section is severely shrunk relative to a corresponding middle section of a second etched feature having similar dimensions and composition that is not located in a CD-SEM characterization location. In another embodiment of the present invention, the middle section of the first etched feature has a shrinkage carryover exceeding a threshold. In still another embodiment of the present invention, the middle section of the first etched feature exhibits a line edge roughness.

    摘要翻译: 在本发明的一个实施例中,一种器件包括位于临界尺寸扫描电子显微镜(CD-SEM)表征位置的第一蚀刻特征,第一蚀刻特征具有上部,中间部分和下部,其中 中间部分相对于具有类似尺寸和组成的第二蚀刻特征的相应中间部分而严重缩小,该尺寸和组成不位于CD-SEM表征位置。 在本发明的另一个实施例中,第一蚀刻特征的中间部分具有超过阈值的收缩滞留。 在本发明的另一个实施例中,第一蚀刻特征的中间部分呈现线边缘粗糙度。

    System, method, and computer program for assessing risk within a predefined market
    26.
    发明申请
    System, method, and computer program for assessing risk within a predefined market 审中-公开
    用于在预定义市场中评估风险的系统,方法和计算机程序

    公开(公告)号:US20060085325A1

    公开(公告)日:2006-04-20

    申请号:US11293247

    申请日:2005-12-05

    IPC分类号: G06Q40/00

    CPC分类号: G06Q40/08 G06Q40/025

    摘要: A system and method for measuring or quantifying the probability of default of a borrower. Credit factors from companies that banks have extended loans to are inputted and collected into a processor. The method employs a process utilizing an optimization function and a standard multivariate nonlinear regression to process client information and to provide an output value whose value is indicative of the likelihood or risk of default by a particular borrower.

    摘要翻译: 用于衡量或量化借款人违约概率的系统和方法。 来自银行贷款的公司的信用因素被输入并收集到处理器中。 该方法采用利用优化函数和标准多元非线性回归处理客户信息的过程,并提供其值表示特定借款人的可能性或风险的输出值。

    Characterization of induced shift on an overlay target using post-etch artifact wafers
    27.
    发明授权
    Characterization of induced shift on an overlay target using post-etch artifact wafers 失效
    使用后蚀刻伪像晶片对覆盖目标上的诱导位移进行表征

    公开(公告)号:US06809420B1

    公开(公告)日:2004-10-26

    申请号:US09514967

    申请日:2000-02-29

    申请人: Alan Wong

    发明人: Alan Wong

    IPC分类号: H01L2348

    CPC分类号: G03F7/70633 H01L22/34

    摘要: The invention relates to an overlay that allows for the characterization of wafer-induced shift without the added risk of low wafer yield. The present invention also relates to a method of quanitifying both wafer-induced shift and tool-induced shift in the field of photolithgraphy. By chararacterizing wafer-induced shift in an artifact wafer, tool-induced shift may be determined by use of the characterized wafer.

    摘要翻译: 本发明涉及一种覆盖层,其允许表征晶片诱导的位移,而没有增加低晶片产量的风险。 本发明还涉及在光致成像领域中晶片诱发的移位和工具引起的移位两者的方法。 通过将伪影晶片中晶片诱发的位移特征化,可以通过使用表征的晶片来确定工具引起的位移。