公开(公告)号：US20190025084A1

公开(公告)日：2019-01-24

申请号：US15655400

申请日：2017-07-20

Applicant: Allegro MicroSystems, LLC

Inventor： Michael C. Doogue ,  P. Karl Scheller

IPC: G01D5/14 ,  G01P3/487 ,  G01R33/07 ,  G01D5/165 ,  G01R33/09

CPC classification number: G01D5/145 ,  G01D3/08 ,  G01D5/165 ,  G01P3/487 ,  G01P13/045 ,  G01R33/072 ,  G01R33/091

Abstract: In one aspect, an integrated circuit (IC) includes a magnetic field sensor to detect speed and direction of angular rotation of a rotating magnetic structure. The magnetic field sensor includes at least two magnetic field sensing elements configured to sense changes in a magnetic field caused by rotation of the magnetic structure. The IC also includes an output port configured to provide an output signal of the magnetic field sensor. The frequency of the output signal indicates the speed and the direction or indicates a fault.

公开(公告)号：US20180088184A1

公开(公告)日：2018-03-29

申请号：US15816045

申请日：2017-11-17

Applicant: Allegro MicroSystems, LLC

Inventor： P. Karl Scheller ,  James E. Burgess ,  Steven E. Snyder ,  Kristann L. Moody ,  Devon Fernandez ,  Andrea Foletto

IPC: G01R33/00 ,  G01D5/244 ,  G01R23/00 ,  G01P21/02 ,  G01P3/488 ,  G01P3/44 ,  G01R33/06 ,  G01P13/00 ,  G01P3/487

Abstract: Systems, methods, and apparatuses for magnetic field sensors with self-test include a detection circuit to detect speed and direction of a target. One or more circuits to test accuracy of the detected speed and direction may be included. One or more circuits to test accuracy of an oscillator may also be included. One or more circuits to test the accuracy of an analog-to-digital converter may also be included. Additionally, one or more IDDQ and/or built-in-self test (BIST) circuits may be included.

公开(公告)号：US20170117801A1

公开(公告)日：2017-04-27

申请号：US15269097

申请日：2016-09-19

Applicant: Allegro MicroSystems, LLC

Inventor： Eric G. Shoemaker ,  P. Karl Scheller ,  Devon Fernandez

IPC: H02M3/07 ,  H02M1/088 ,  H01L23/495 ,  G01D11/00

CPC classification number: H02J7/345 ,  G01D11/00 ,  H01L23/49589

Abstract: A sensor integrated circuit includes an energy storage device having a first terminal coupled to a functional circuit and a blocking circuit coupled between a power supply pin and the first terminal of the energy storage device. The blocking circuit permits the energy storage device to store energy from an external power supply coupled to the power pin. The first terminal of the energy storage device is inaccessible from outside of the sensor IC. Additional features of the sensor IC can include a high regulator, a low regulator, and a low power circuit.

公开(公告)号：US09523742B2

公开(公告)日：2016-12-20

申请号：US14696674

申请日：2015-04-27

Applicant: ALLEGRO MICROSYSTEMS, LLC

Inventor： Jay M. Towne ,  P. Karl Scheller ,  Eric G. Shoemaker

IPC: G01R33/06 ,  G01R33/07 ,  G01R33/09 ,  G01R33/00 ,  H03F1/02 ,  H03G1/00 ,  G01D5/14

CPC classification number: G01R33/0041 ,  G01D5/145 ,  G01R33/0029 ,  G01R33/07 ,  G01R33/09 ,  H03F1/0216 ,  H03G1/0035

Abstract: A circuit includes a current source having at least first terminal and a second, control terminal. The current source is configured to receive a current control signal at the control terminal and in response thereto generates a first current signal at the first terminal. The current control signal controls a current level of the first current signal. The circuit also includes at least one sensing element responsive to one or more sense parameters and having an input adapted to couple to the first terminal of said current source. The sensing element is configured to receive one or more current signals comprising at least the first current signal and in response thereto generates a sensed output signal at an output thereof. A corresponding method for operating the circuit is also provided.

Abstract translation: 电路包括至少具有第一端子和第二控制端子的电流源。 电流源被配置为在控制终端处接收电流控制信号，并响应于此，在第一终端产生第一电流信号。 电流控制信号控制第一电流信号的电流电平。 电路还包括响应于一个或多个感测参数并且具有适于耦合到所述电流源的第一端子的输入的至少一个感测元件。 感测元件被配置为接收包括至少第一电流信号的一个或多个电流信号，并且作为响应，感测元件在其输出处产生感测的输出信号。 还提供了用于操作电路的相应方法。

公开(公告)号：US09494660B2

公开(公告)日：2016-11-15

申请号：US13749776

申请日：2013-01-25

Applicant: Allegro Microsystems, LLC

Inventor： Paul David ,  William P. Taylor ,  P. Karl Scheller ,  Ravi Vig ,  Andreas P. Friedrich

IPC: G01R33/00 ,  H01L23/495

CPC classification number: G01R33/00 ,  G01R33/0011 ,  G01R33/0047 ,  H01L23/49562 ,  H01L23/49589 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A magnetic field sensor includes a lead frame having a plurality of leads, at least two of which have a connection portion and a die attach portion. A semiconductor die is attached to the die attach portion of the at least two leads. In some embodiments, at least one passive component is attached to the die attach portion of at least two leads.

Abstract translation: 磁场传感器包括具有多个引线的引线框架，其中至少两个引线框具有连接部分和管芯附接部分。 半导体管芯附接到至少两个引线的管芯附接部分。 在一些实施例中，至少一个无源部件附接到至少两个引线的管芯附接部分。

公开(公告)号：US20130249546A1

公开(公告)日：2013-09-26

申请号：US13749776

申请日：2013-01-25

Applicant: ALLEGRO MICROSYSTEMS, LLC

Inventor： Paul David ,  William P. Taylor ,  P. Karl Scheller ,  Ravi Vig ,  Andreas P. Friedrich

IPC: G01R33/00

CPC classification number: G01R33/00 ,  G01R33/0011 ,  G01R33/0047 ,  H01L23/49562 ,  H01L23/49589 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A magnetic field sensor includes a lead frame having a plurality of leads, at least two of which have a connection portion and a die attach portion. A semiconductor die is attached to the die attach portion of the at least two leads. In some embodiments, at least one passive component is attached to the die attach portion of at least two leads.

Abstract translation: 磁场传感器包括具有多个引线的引线框架，其中至少两个引线框具有连接部分和管芯附接部分。 半导体管芯附接到至少两个引线的管芯附接部分。 在一些实施例中，至少一个无源部件附接到至少两个引线的管芯附接部分。

公开(公告)号：US11961920B2

公开(公告)日：2024-04-16

申请号：US18307057

申请日：2023-04-26

Applicant: Allegro MicroSystems, LLC

Inventor： Ravi Vig ,  William P. Taylor ,  Paul A. David ,  P. Karl Scheller ,  Andreas P. Friedrich

IPC: G01R33/06 ,  G01D5/14 ,  G01R15/20 ,  G01R33/00 ,  H01L29/82

CPC classification number: H01L29/82 ,  G01D5/147 ,  G01R33/0047 ,  G01R33/0052 ,  G01R33/06 ,  G01R15/207 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2924/00011 ,  H01L2224/45147 ,  H01L2924/00 ,  H01L2924/00011 ,  H01L2924/01033

Abstract: An integrated circuit package and method of fabrication are described. The integrated circuit package includes a lead frame having a first surface and a second opposing surface and a semiconductor die having a first, active surface in which circuitry is disposed and a second opposing surface attached to the first surface of the lead frame. A magnet attached to the second surface of the lead frame has a non-contiguous central region and at least one channel extending laterally from the central region. An overmold material forms an enclosure surrounding the magnet, semiconductor die, and a portion of the lead frame.

公开(公告)号：US20230261118A1

公开(公告)日：2023-08-17

申请号：US18307057

申请日：2023-04-26

Applicant: Allegro MicroSystems, LLC

Inventor： Ravi Vig ,  William P. Taylor ,  Paul A. David ,  P. Karl Scheller ,  Andreas P. Friedrich

IPC: H01L29/82 ,  G01R33/06 ,  G01R33/00 ,  G01D5/14

CPC classification number: H01L29/82 ,  G01R33/06 ,  G01R33/0047 ,  G01R33/0052 ,  G01D5/147 ,  H01L2924/00011 ,  H01L2224/48247 ,  G01R15/207

Abstract: An integrated circuit package and method of fabrication are described. The integrated circuit package includes a lead frame having a first surface and a second opposing surface and a semiconductor die having a first, active surface in which circuitry is disposed and a second opposing surface attached to the first surface of the lead frame. A magnet attached to the second surface of the lead frame has a non-contiguous central region and at least one channel extending laterally from the central region. An overmold material forms an enclosure surrounding the magnet, semiconductor die, and a portion of the lead frame.

公开(公告)号：US11585868B2

公开(公告)日：2023-02-21

申请号：US16994864

申请日：2020-08-17

Applicant: Allegro MicroSystems, LLC

Inventor： P. Karl Scheller ,  James E. Burgess ,  Steven E. Snyder ,  Kristann L. Moody ,  Devon Fernandez ,  Andrea Foletto

IPC: G01R33/06 ,  G01R33/00 ,  G01D5/244 ,  G01P3/487 ,  G01P3/488 ,  G01P21/02 ,  G01R23/00 ,  G01P3/44 ,  G01P13/00

Abstract: Systems, methods, and apparatuses for magnetic field sensors with self-test include a detection circuit to detect speed and direction of a target. One or more circuits to test accuracy of the detected speed and direction may be included. One or more circuits to test accuracy of an oscillator may also be included. One or more circuits to test the accuracy of an analog-to-digital converter may also be included. Additionally, one or more IDDQ and/or built-in-self test (BIST) circuits may be included.

公开(公告)号：US20220310853A1

公开(公告)日：2022-09-29

申请号：US17806758

申请日：2022-06-14

Applicant: Allegro MicroSystems, LLC

Inventor： Ravi Vig ,  William P. Taylor ,  Paul A. David ,  P. Karl Scheller ,  Andreas P. Friedrich

IPC: H01L29/82 ,  G01R33/06 ,  G01R33/00 ,  G01D5/14

Abstract: A sensor includes a lead frame having a first surface, a second opposing surface, and a plurality of leads and a semiconductor die having a first surface attached to the first surface of the lead frame and a second, opposing surface. The sensor further includes a non-conductive mold material enclosing the die and at least a portion of the lead frame, a conductive coil secured to the non-conductive mold material, a mold material secured to the non-conductive mold material and enclosing the conductive coil, wherein the mold material has a central region and an element disposed in the central region of the mold material.