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公开(公告)号：US10230006B2
公开(公告)日：2019-03-12
申请号：US15618251
申请日：2017-06-09
Applicant: Allegro MicroSystems, LLC
Inventor： Ravi Vig , William P. Taylor , Paul A. David , P. Karl Scheller , Andreas P. Friedrich
Abstract: A magnetic field sensor includes a lead frame, a semiconductor die having a first surface in which a magnetic field sensing element is disposed and a second surface attached to the lead frame, and a non-conductive mold material enclosing the die and at least a portion of the lead frame. The sensor may include a ferromagnetic mold material secured to a portion of the non-conductive mold material. An electromagnetic suppressor comprising a ferromagnetic material encloses a passive device spaced from the non-conductive mold material and coupled to a plurality of leads.
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公开(公告)号：US09812588B2
公开(公告)日：2017-11-07
申请号：US13748999
申请日：2013-01-24
Applicant: Allegro Microsystems, LLC
Inventor： Ravi Vig , William P. Taylor , Paul David , P. Karl Scheller , Andreas P. Friedrich
CPC classification number: H01L29/82 , G01R33/0047 , G01R33/0052 , G01R33/06 , H01L2224/45147 , H01L2224/48247 , H01L2924/00011 , H01L2924/00 , H01L2924/01033
Abstract: A magnetic field sensor includes a lead frame, a semiconductor die having a first surface in which a magnetic field sensing element is disposed and a second surface attached to the lead frame, and a non-conductive mold material enclosing the die and at least a portion of the lead frame. The sensor may include a ferromagnetic mold material secured to a portion of the non-conductive mold material. Features include a multi-sloped taper to an inner surface of a non-contiguous central region of the ferromagnetic mold material, a separately formed element disposed in the non-contiguous central region, one or more slots in the lead frame, a molded ferromagnetic suppression device spaced from the non-conductive mold material and enclosing a portion of a lead, a passive device spaced from the non-conductive mold material and coupled to a plurality of leads, and a ferromagnetic bead coupled to a lead. Also described is a coil secured to the non-conductive mold material and a lead having at least two separated portions with a passive component coupled across the two portions.
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公开(公告)号：US09666788B2
公开(公告)日：2017-05-30
申请号：US13788210
申请日：2013-03-07
Applicant: Allegro Microsystems, LLC
Inventor： William P. Taylor , Paul David , Ravi Vig
CPC classification number: H01L43/02 , G01R33/0011 , G01R33/0047 , G01R33/0052 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/19105 , H01L2924/00014
Abstract: A magnetic field sensor includes a lead frame having a plurality of leads, at least two of which have a connection portion and a die attach portion. A semiconductor die is attached to the die attach portion of the at least two leads. The sensor further includes at least one wire bond coupled between the die and a first surface of the lead frame. The die is attached to a second, opposing surface of the lead frame in a lead on chip configuration. In some embodiments, at least one passive component is attached to the die attach portion of at least two leads.
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24.发明申请公开(公告)号：US20140312883A1
公开(公告)日：2014-10-23
申请号：US14321347
申请日：2014-07-01
Applicant: Allegro MicroSystems, LLC
Inventor： Andreas P. Friedrich , Andrea Foletto , Michael C. Doogue , William P. Taylor , Ravi Vig , P. Karl Scheller
CPC classification number: G01R33/0035 , G01R33/0023 , G01R35/005
Abstract: A magnetic field sensor includes built in self-test circuits that allow a self-test of most of, or all of, the circuitry of the magnetic field sensor, including self-test of a magnetic field sensing element used within the magnetic field sensor, while the magnetic field sensor is functioning in normal operation.
Abstract translation: 磁场传感器包括内置的自检电路，其允许对磁场传感器的电路的大部分或全部进行自检，包括在磁场传感器内使用的磁场感测元件的自检， 同时磁场传感器正常工作。
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25.发明授权公开(公告)号：US08818749B2
公开(公告)日：2014-08-26
申请号：US13743451
申请日：2013-01-17
Applicant: Allegro Microsystems, LLC
Inventor： Andreas P. Friedrich , Andrea Foletto , Michael C. Doogue , William P. Taylor , Ravi Vig , P. Karl Scheller
CPC classification number: G01R33/0035 , G01R33/0023 , G01R35/005
Abstract: A magnetic field sensor includes built in self-test circuits that allow a self-test of most of, or all of, the circuitry of the magnetic field sensor, including self-test of a magnetic field sensing element used within the magnetic field sensor, while the magnetic field sensor is functioning in normal operation.
Abstract translation: 磁场传感器包括内置的自检电路，其允许对磁场传感器的电路的大部分或全部进行自检，包括在磁场传感器内使用的磁场感测元件的自检， 同时磁场传感器正常工作。
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Patent Agency Ranking
26.发明申请公开(公告)号：US20130249029A1
公开(公告)日：2013-09-26
申请号：US13748999
申请日：2013-01-24
Applicant: ALLEGRO MICROSYSTEMS, LLC
Inventor： Ravi Vig , William P. Taylor , Paul David , P. Karl Scheller , Andreas P. Friedrich
IPC: H01L29/82
CPC classification number: H01L29/82 , G01R33/0047 , G01R33/0052 , G01R33/06 , H01L2224/45147 , H01L2224/48247 , H01L2924/00011 , H01L2924/00 , H01L2924/01033
Abstract: A magnetic field sensor includes a lead frame, a semiconductor die having a first surface in which a magnetic field sensing element is disposed and a second surface attached to the lead frame, and a non-conductive mold material enclosing the die and at least a portion of the lead frame. The sensor may include a ferromagnetic mold material secured to a portion of the non-conductive mold material. Features include a multi-sloped taper to an inner surface of a non-contiguous central region of the ferromagnetic mold material, a separately formed element disposed in the non-contiguous central region, one or more slots in the lead frame, a molded ferromagnetic suppression device spaced from the non-conductive mold material and enclosing a portion of a lead, a passive device spaced from the non-conductive mold material and coupled to a plurality of leads, and a ferromagnetic bead coupled to a lead. Also described is a coil secured to the non-conductive mold material and a lead having at least two separated portions with a passive component coupled across the two portions.
Abstract translation: 磁场传感器包括引线框架，具有其中设置有磁场感测元件的第一表面和附接到引线框架的第二表面的半导体管芯以及封装管芯的非导电模具材料和至少一部分 的引线框架。 传感器可以包括固定到非导电模具材料的一部分的铁磁模具材料。 特征包括到铁磁模具材料的不连续中心区域的内表面的多倾斜锥形，设置在不连续中心区域中的单独形成的元件，引线框架中的一个或多个槽，模制铁磁抑制 与非导电模具材料间隔开并且包围引线的一部分，与非导电模具材料间隔开并耦合到多个引线的无源器件以及耦合到引线的铁磁珠。 还描述了固定到非导电模具材料的线圈和具有至少两个分离部分的引线，其中被动元件跨越两个部分耦合。
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公开(公告)号：US11444209B2
公开(公告)日：2022-09-13
申请号：US17130085
申请日：2020-12-22
Applicant: Allegro MicroSystems, LLC
Inventor： Ravi Vig , William P. Taylor , Paul A. David , P. Karl Scheller , Andreas P. Friedrich
Abstract: A magnetic field sensor includes a lead frame, a semiconductor die, a conductive coil, a mandrel, and a non-conductive mold material. The lead frame has a first surface, a second opposing surface, at least one slot, and a plurality of leads. The semiconductor die has a first surface in which a magnetic field sensing element is disposed and a second opposing surface attached to the first surface of the lead frame. The conductive coil is secured to the second surface of the lead frame and configured to operate as a back bias magnet to provide a magnetic field used to detect movement of a target. The coil is would around the mandrel and the mandrel is comprised of a ferromagnetic material. The non-conductive mold material encloses the die, the conductive coil, the mandrel, and at least a portion of the lead frame.
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公开(公告)号：US20210111284A1
公开(公告)日：2021-04-15
申请号：US17130085
申请日：2020-12-22
Applicant: Allegro MicroSystems, LLC
Inventor： Ravi Vig , William P. Taylor , Paul A. David , P. Karl Scheller , Andreas P. Friedrich
Abstract: A magnetic field sensor includes a lead frame, a semiconductor die having a first surface in which a magnetic field sensing element is disposed and a second surface attached to the lead frame, and a non-conductive mold material enclosing the die and at least a portion of the lead frame. The sensor may include a ferromagnetic mold material secured to a portion of the non-conductive mold material. Features include a multi-sloped taper to an inner surface of a non-contiguous central region of the ferromagnetic mold material, a separately formed element disposed in the non-contiguous central region, one or more slots in the lead frame, a molded ferromagnetic suppression device spaced from the non-conductive mold material and enclosing a portion of a lead, a passive device spaced from the non-conductive mold material and coupled to a plurality of leads, and a ferromagnetic bead coupled to a lead. Also described is a coil secured to the non-conductive mold material and a lead having at least two separated portions with a passive component coupled across the two portions.
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公开(公告)号：US20190157465A1
公开(公告)日：2019-05-23
申请号：US16252789
申请日：2019-01-21
Applicant: Allegro MicroSystems, LLC
Inventor： Ravi Vig , William P. Taylor , Paul A. David , P. Karl Scheller , Andreas P. Friedrich
Abstract: A magnetic field sensor includes a lead frame, a semiconductor die having a first surface in which a magnetic field sensing element is disposed and a second surface attached to the lead frame, and a non-conductive mold material enclosing the die and at least a portion of the lead frame. The sensor may include a ferromagnetic mold material secured to a portion of the non-conductive mold material. Features include a multi-sloped taper to an inner surface of a non-contiguous central region of the ferromagnetic mold material, a separately formed element disposed in the non-contiguous central region, one or more slots in the lead frame, a molded ferromagnetic suppression device spaced from the non-conductive mold material and enclosing a portion of a lead, a passive device spaced from the non-conductive mold material and coupled to a plurality of leads, and a ferromagnetic bead coupled to a lead. Also described is a coil secured to the non-conductive mold material and a lead having at least two separated portions with a passive component coupled across the two portions.
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公开(公告)号：US10215590B2
公开(公告)日：2019-02-26
申请号：US15176668
申请日：2016-06-08
Applicant: Allegro MicroSystems, LLC
Inventor： Paul A. David , Ravi Vig
Abstract: A back-biased magnetic field sensor can have one or more vertical Hall effect elements arranged within a substrate region of a substrate, wherein magnetic fields are oriented substantially vertical to the substrate within the substrate region when a ferromagnetic object is not proximate. When the ferromagnetic object becomes proximate, the magnetic field sensor can sense at least the proximity, and, in some embodiments, can also localize a position of the ferromagnetic object relative to the magnetic field sensor.
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