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    EARTIPS FOR COUPLING VIA WIREFORM ATTACHMENT MECHANISMS
    22.
    发明申请
    EARTIPS FOR COUPLING VIA WIREFORM ATTACHMENT MECHANISMS 有权

    公开(公告)号：US20230088030A1

    公开(公告)日：2023-03-23

    申请号：US17992332

    申请日：2022-11-22

    Applicant: APPLE INC.

    Inventor： Sean T. McIntosh ,  Jason C. Della Rosa ,  Samuel G. Parker ,  Benjamin A. Cousins ,  Ethan L. Huwe

    IPC: H04R1/10 ,  G01V3/08 ,  A45C11/00 ,  A45C13/00 ,  E05F1/12 ,  E05F3/20 ,  H01F7/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H04R1/02

    Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.

    Compact speaker
    23.
    发明授权
    Compact speaker 有权

    公开(公告)号：US11310585B2

    公开(公告)日：2022-04-19

    申请号：US17067611

    申请日：2020-10-09

    Applicant: Apple Inc.

    Inventor： Jason C. Della Rosa ,  Alexander R. Gould ,  Ethan W. Juhnke ,  John H. Sheerin ,  Glenn K. Trainer ,  Ariel A. Massias ,  Edward V. Anderson ,  Pablo Seoane Vieites ,  Junyi Yang

    IPC: H04R1/28 ,  H04R5/02 ,  H04R1/02 ,  H04R9/06

    Abstract: An electronic speaker comprising: a device housing defining an interior cavity and including a sidewall extending around the interior cavity between an upper portion and a lower portion of the device housing; first and second sound channels formed at opposing locations along the sidewall, each of the first and second sound channels comprising a plurality of openings formed through the sidewall; a passive radiator array comprising first and second passive radiators disposed within the interior cavity, spaced apart from each other in an opposing relationship and aligned to project sound through the first and second sound channels; an active driver disposed in the device housing and configured to generate sound in response to an electrical signal, the active driver comprising driver housing disposed at least partially between the first and second passive radiators, a magnet disposed within the driver housing, a voice coil and a diaphragm facing downwards towards the lower surface of the device housing; and an annular sound channel disposed along the bottom portion of the device housing adjacent to the diaphragm of the active driver.

    EARTIPS FOR COUPLING VIA WIREFORM ATTACHMENT MECHANISMS
    24.
    发明申请
    EARTIPS FOR COUPLING VIA WIREFORM ATTACHMENT MECHANISMS 有权

    公开(公告)号：US20210211796A1

    公开(公告)日：2021-07-08

    申请号：US17207497

    申请日：2021-03-19

    Applicant: Apple Inc.

    Inventor： Sean T. McIntosh ,  Jason C. Della Rosa ,  Samuel G. Parker ,  Benjamin A. Cousins ,  Ethan L. Huwe

    IPC: H04R1/10 ,  G01V3/08 ,  A45C11/00 ,  A45C13/00 ,  E05F1/12 ,  E05F3/20 ,  H01F7/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H04R1/02

    Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.

    DUAL LOUDSPEAKER ENABLED COOLING
    25.
    发明申请
    DUAL LOUDSPEAKER ENABLED COOLING 有权

    公开(公告)号：US20210051411A1

    公开(公告)日：2021-02-18

    申请号：US17086716

    申请日：2020-11-02

    Applicant: Apple Inc.

    Inventor： Michael B. Nussbaum ,  Jason C. Della Rosa ,  Glenn K. Trainer

    IPC: H04R9/02 ,  H04R1/02 ,  H05K7/20

    Abstract: Electronics devices according to embodiments of the present technology may include a first loudspeaker and a second loudspeaker disposed in a housing. The housing may define a first internal volume between a first end of the housing and a backside of the first loudspeaker. The housing may define a second internal volume between a second end of the housing and a backside of the second loudspeaker. The first loudspeaker and the second loudspeaker may be positioned within the housing so a front side of the first loudspeaker faces a front side of the second loudspeaker. A duct may be defined by the housing, which may access the first internal volume at a first end and may access the second internal volume at a second end. The electronic device may also include a processor configured to deliver signals to the first loudspeaker and the second loudspeaker.

    DUAL LOUDSPEAKER ENABLED COOLING
    28.
    发明申请
    DUAL LOUDSPEAKER ENABLED COOLING 审中-公开

    公开(公告)号：US20200169812A1

    公开(公告)日：2020-05-28

    申请号：US16698136

    申请日：2019-11-27

    Applicant: Apple Inc.

    Inventor： Michael B. Nussbaum ,  Jason C. Della Rosa ,  Glenn K. Trainer

    IPC: H04R9/02 ,  H05K7/20 ,  H04R1/02

    Abstract: Electronics devices according to embodiments of the present technology may include a first loudspeaker and a second loudspeaker disposed in a housing. The housing may define a first internal volume between a first end of the housing and a backside of the first loudspeaker. The housing may define a second internal volume between a second end of the housing and a backside of the second loudspeaker. The first loudspeaker and the second loudspeaker may be positioned within the housing so a front side of the first loudspeaker faces a front side of the second loudspeaker. A duct may be defined by the housing, which may access the first internal volume at a first end and may access the second internal volume at a second end. The electronic device may also include a processor configured to deliver signals to the first loudspeaker and the second loudspeaker.

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