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公开(公告)号:US11523205B2
公开(公告)日:2022-12-06
申请号:US17234441
申请日:2021-04-19
Applicant: Apple Inc.
Inventor: Dustin A. Hatfield , Shota Aoyagi , Timothy E. Emmott , Ethan L. Huwe , Mitchell R. Lerner , Sean T. McIntosh , Yi-Fang D. Tsai , Jason C. Della Rosa , Patrick W. Sheppard , Samuel G. Parker , David J. Feathers , Brian R. Twehues , Daniel Strongwater
IPC: H04R1/10
Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and including an inner eartip body and an outer eartip body. The inner eartip body has a sidewall that extends between the interfacing end and the attachment end, and includes a groove formed in an outer surface of the sidewall. The outer eartip body is sized and shaped to be inserted into an ear canal and extends from the interfacing end toward the attachment end of the eartip.
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公开(公告)号:US11159869B2
公开(公告)日:2021-10-26
申请号:US16584914
申请日:2019-09-26
Applicant: Apple Inc.
Inventor: Scott C. Grinker , Esge Andersen , Ethan L. Huwe , Benjamin A. Cousins , Samuel G. Parker , Sean T. McIntosh , Jason C. Della Rosa , Craig M. Stanley , Edward Siahaan , Ethan W. Juhnke
IPC: H04R1/10 , G01V3/08 , A45C11/00 , A45C13/00 , E05F1/12 , E05F3/20 , H01F7/02 , H05K5/00 , H05K5/02 , H05K5/03 , H04R1/02 , H04B1/38 , H04B1/3827
Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and an attachment structure coupled to the inner eartip body at the attachment end. The eartip body can include: an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end; and an outer eartip body sized and shaped to be inserted into an ear canal and extending from the interfacing end, the outer eartip body extending toward the attachment end of the eartip. The attachment structure including a sidewall extending around a periphery of the attachment structure and defining an opening extending through the sidewall that fluidly couples the channel to an ambient environment.
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公开(公告)号:US10771890B2
公开(公告)日:2020-09-08
申请号:US15613066
申请日:2017-06-02
Applicant: Apple Inc.
Inventor: Craig M. Stanley , Jason C. Della Rosa , Samuel G. Parker , Ethan L. Huwe , Glenn K. Trainer , Javier Mendez , Sean T. McIntosh
IPC: H04R9/06 , H04R1/28 , G06F3/01 , H04R1/02 , H04R1/26 , H04R1/30 , H04R5/02 , H04R31/00 , H03K17/96 , H05K1/02 , G06F3/02 , G06F3/041 , G06F3/0354 , H04R3/00 , H04R7/12 , H04R7/18 , H04R9/02 , H04R1/40 , H04R3/12 , G06F3/16 , F21V3/00 , F21V5/00 , F21V23/04 , F21V33/00 , G06F3/044 , H01H13/02 , H05K1/14
Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.
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公开(公告)号:US20180091879A1
公开(公告)日:2018-03-29
申请号:US15613066
申请日:2017-06-02
Applicant: Apple Inc.
Inventor: Craig M. Stanley , Jason C. Della Rosa , Samuel G. Parker , Ethan L. Huwe , Glenn K. Trainer , Javier Mendez , Sean T. McIntosh
Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.
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公开(公告)号:US11979703B2
公开(公告)日:2024-05-07
申请号:US17992332
申请日:2022-11-22
Applicant: APPLE INC.
Inventor: Sean T. McIntosh , Jason C. Della Rosa , Samuel G. Parker , Benjamin A. Cousins , Ethan L. Huwe
IPC: H04R1/10 , A45C11/00 , A45C13/00 , E05F1/12 , E05F3/20 , G01V3/08 , H01F7/02 , H04B1/38 , H04B1/3827 , H04R1/02 , H05K5/00 , H05K5/02 , H05K5/03
CPC classification number: H04R1/1016 , A45C11/00 , A45C13/005 , E05F1/1261 , E05F3/20 , G01V3/081 , H01F7/02 , H04R1/023 , H04R1/1041 , H04R1/1058 , H04R1/1091 , H05K5/0086 , H05K5/0217 , H05K5/0226 , H05K5/03 , A45C2011/001 , E05Y2201/224 , E05Y2900/602 , H04B1/38 , H04B2001/3866 , H04R1/1025 , H04R2400/11 , H04R2420/07 , H04R2460/11
Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.
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公开(公告)号:US20230088030A1
公开(公告)日:2023-03-23
申请号:US17992332
申请日:2022-11-22
Applicant: APPLE INC.
Inventor: Sean T. McIntosh , Jason C. Della Rosa , Samuel G. Parker , Benjamin A. Cousins , Ethan L. Huwe
IPC: H04R1/10 , G01V3/08 , A45C11/00 , A45C13/00 , E05F1/12 , E05F3/20 , H01F7/02 , H05K5/00 , H05K5/02 , H05K5/03 , H04R1/02
Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.
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公开(公告)号:US20210211796A1
公开(公告)日:2021-07-08
申请号:US17207497
申请日:2021-03-19
Applicant: Apple Inc.
Inventor: Sean T. McIntosh , Jason C. Della Rosa , Samuel G. Parker , Benjamin A. Cousins , Ethan L. Huwe
IPC: H04R1/10 , G01V3/08 , A45C11/00 , A45C13/00 , E05F1/12 , E05F3/20 , H01F7/02 , H05K5/00 , H05K5/02 , H05K5/03 , H04R1/02
Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.
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公开(公告)号:US10944156B2
公开(公告)日:2021-03-09
申请号:US15721532
申请日:2017-09-29
Applicant: Apple Inc.
Inventor: Benjamin A. Cousins , Carlo Di Nallo , Ethan L. Huwe , Jerzy S. Guterman , Joachim S. Hammerschmidt , Mattia Pascolini , Ruben Caballero , Samuel G. Parker
Abstract: An electronic device such as a wireless earbud may have antenna structures that are configured to form one or more antenna portions or antennas for transmitting and receiving wireless signals. The device may include control circuitry that is configured to selectively activate one or more antennas or antenna portions to transmit and receive wireless signals for the device. The device may include sensor circuitry that provide sensor data to the control circuitry. The control circuitry may use the sensor data to select and activate an optimal antenna based on the orientation of the earbud or the environment of the device. The antennas may be formed on opposing sides of a housing for the device. By providing configurable antenna structures, the device may be configured to adapt to the current environment and efficiently perform communications operations.
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公开(公告)号:US20200314519A1
公开(公告)日:2020-10-01
申请号:US16584940
申请日:2019-09-26
Applicant: Apple Inc.
Inventor: Dustin A. Hatfield , Shota Aoyagi , Timothy E. Emmott , Ethan L. Huwe , Mitchell R. Lerner , Sean T. McIntosh , Yi-Fang D. Tsai , Jason C. Della Rosa , Patrick W. Sheppard , Samuel G. Parker , David J. Feathers , Brian R. Twehues , Daniel Strongwater
IPC: H04R1/10
Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and including an inner eartip body and an outer eartip body. The inner eartip body has a sidewall that extends between the interfacing end and the attachment end, and includes a groove formed in an outer surface of the sidewall. The outer eartip body is sized and shaped to be inserted into an ear canal and extends from the interfacing end toward the attachment end of the eartip.
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公开(公告)号:US20190103661A1
公开(公告)日:2019-04-04
申请号:US15721532
申请日:2017-09-29
Applicant: Apple Inc.
Inventor: Benjamin A. Cousins , Carlo Di Nallo , Ethan L. Huwe , Jerzy S. Guterman , Joachim S. Hammerschmidt , Mattia Pascolini , Ruben Caballero , Samuel G. Parker
IPC: H01Q1/27 , H01Q9/04 , H04B1/3827 , H04R1/10
Abstract: An electronic device such as a wireless earbud may have antenna structures that are configured to form one or more antenna portions or antennas for transmitting and receiving wireless signals. The device may include control circuitry that is configured to selectively activate one or more antennas or antenna portions to transmit and receive wireless signals for the device. The device may include sensor circuitry that provide sensor data to the control circuitry. The control circuitry may use the sensor data to select and activate an optimal antenna based on the orientation of the earbud or the environment of the device. The antennas may be formed on opposing sides of a housing for the device. By providing configurable antenna structures, the device may be configured to adapt to the current environment and efficiently perform communications operations.
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