公开(公告)号：US20210205951A1

公开(公告)日：2021-07-08

申请号：US17209137

申请日：2021-03-22

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Boyi FU ,  Ashwin CHOCKALINGAM ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Mahendra C. ORILALL ,  Hou T. NG ,  Jason G. FUNG ,  Mayu YAMAMURA

IPC: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B29C64/112 ,  B24D3/28 ,  B24D11/00 ,  B24D11/04 ,  B33Y10/00 ,  B33Y80/00 ,  B29C35/08 ,  C09D4/00 ,  C09G1/16

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US20200070302A1

公开(公告)日：2020-03-05

申请号：US16529884

申请日：2019-08-02

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Ankit VORA ,  Boyi FU ,  Venkat HARIHARAN ,  Mayu YAMAMURA ,  Mario CORNEJO ,  Igor ABRAMSON ,  Mo YANG ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Nag B. PATIBANDLA

IPC: B24B37/24 ,  C08F283/00 ,  B33Y10/00 ,  B33Y70/00 ,  B29C64/112

Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer. The resin precursor formulation further comprises a photoinitiator, wherein the precursor formulation has a viscosity that enables the precursor formulation to be dispensed to form a portion of a polishing article by an additive manufacturing process.

公开(公告)号：US20170136603A1

公开(公告)日：2017-05-18

申请号：US15352647

申请日：2016-11-16

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Boyi FU ,  Ashwin CHOCKALINGAM ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Mahendra C. ORILALL ,  Hou T. NG ,  Jason G. FUNG ,  Mayu YAMAMURA

IPC: B24B37/24 ,  B29C35/08 ,  C09G1/16 ,  B33Y80/00 ,  B24B37/26 ,  C09D4/00 ,  B29C67/00 ,  B33Y10/00

CPC classification number: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B24D3/28 ,  B24D11/001 ,  B24D11/04 ,  B24D2203/00 ,  B29C35/0805 ,  B29C64/112 ,  B29C2035/0827 ,  B29K2033/04 ,  B29K2995/0077 ,  B29K2995/0092 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C09D4/00 ,  C09G1/16

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US20170100817A1

公开(公告)日：2017-04-13

申请号：US15296015

申请日：2016-10-17

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Boyi FU ,  Ashwin CHOCKALINGAM ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Mahendra C. ORILALL ,  Hou T. NG ,  Jason G. FUNG ,  Mayu YAMAMURA

IPC: B24B37/22 ,  B24B37/24 ,  B24B37/26

CPC classification number: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B24D3/28 ,  B24D11/001 ,  B24D11/04 ,  B24D2203/00 ,  B29C35/0805 ,  B29C64/112 ,  B29C2035/0827 ,  B29K2033/04 ,  B29K2995/0077 ,  B29K2995/0092 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C09D4/00 ,  C09G1/16

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.