公开(公告)号：US10168463B1

公开(公告)日：2019-01-01

申请号：US15083704

申请日：2016-03-29

Applicant: AUTOMATED ASSEMBLY CORPORATION

Inventor： David Neuman ,  Scott Lindblad

IPC: G02B6/00 ,  F21V8/00

Abstract: The disclosure describes a lighting apparatus that includes a light-diffusive panel having opposing first and second faces and two or more side portions. A side portion has a curved surface and a third surface. Solid-state lighting (SSL) elements are disposed proximate the third surface of the side portion and are arranged to emit light at the third surface. A first reflector is disposed on the curved surface of the side portion and has a reflective surface to reflect light from the SSL elements into the light-diffusive panel. A plurality of disruptions are formed on the second face of the light-diffusive panel and are arranged to disperse internally reflected light. A second reflector is disposed on the second face of the light-diffusive panel and is arranged to reflect light emitted from the second surface into the light-diffusive panel.

公开(公告)号：US09814142B1

公开(公告)日：2017-11-07

申请号：US14749214

申请日：2015-06-24

Applicant: AUTOMATED ASSEMBLY CORPORATION

Inventor： David Neuman ,  Scott Lindblad

IPC: H05K1/18 ,  H05K1/03 ,  H05K3/30 ,  H05K3/34 ,  H05K3/00

CPC classification number: H05K1/189 ,  H05K1/118 ,  H05K1/186 ,  H05K3/0029 ,  H05K2201/09472 ,  H05K2201/10098 ,  H05K2201/10106

Abstract: A disclosed circuit arrangement includes a substrate having first bond pads coupled to a pattern of conductors. The first bond pads and the pattern of conductors are disposed on a first surface of the substrate. A first layer of adhesive is directly disposed on the first surface of the substrate and the pattern of conductors and has openings at the first bond pads. An electronic device has opposing first and second surfaces and is attached to the first surface of the substrate by the first surface of the electronic device in contact with the first layer of adhesive. The second surface of the electronic device has second bond pads. Bond wires are connected at the first bond pads through the openings in the first layer of adhesive and connected at the second bond pads.

公开(公告)号：US09379289B1

公开(公告)日：2016-06-28

申请号：US14067556

申请日：2013-10-30

Applicant: AUTOMATED ASSEMBLY CORPORATION

Inventor： Scott Lindblad ,  David Neuman ,  Robert Neuman

IPC: H01L33/62 ,  H01L33/44

CPC classification number: H01L33/44 ,  F21K9/00 ,  F21S4/24 ,  F21V19/005 ,  F21Y2103/10 ,  F21Y2115/30 ,  H01L24/00 ,  H01L25/167 ,  H01L33/486

Abstract: The disclosed lighting arrangement includes adhesive transfer tape. The adhesive transfer tape has an adhesive layer disposed directly on a release liner, and the release liner is separable from the adhesive layer. Power wires are adhered directly to the adhesive layer, and one or more light-emitting diodes (LEDs) are disposed on the adhesive layer and coupled to the power wires.

Abstract translation: 所公开的照明装置包括粘合剂转移带。 粘合剂转移带具有直接设置在剥离衬垫上的粘合剂层，并且剥离衬垫可与粘合剂层分离。 电源线直接粘附到粘合剂层上，并且一个或多个发光二极管（LED）设置在粘合剂层上并且耦合到电源线。