Abstract:
An anti-peep structure, a method for manufacturing an anti-peep structure, and a display device are provided. The anti-peep structure includes a substrate made of a first material having a first refractive index, the substrate including a light incident surface and a light outgoing surface disposed opposite to each other, where a plurality of grooves are disposed in the substrate at a side of the light incident surface or the light outgoing surface; a second material having a second refractive index disposed in the plurality of grooves; and a refractive index regulating component configured to control the second refractive index; where a viewing angle at the light outgoing surface is determined by a difference between the first refractive index and the second refractive index.
Abstract:
A chip encapsulating method includes: fixing a plurality of wafers to a first panel level substrate, the wafer including a plurality of chips; forming a re-distribution layer on the wafer for each of the chips; forming each individual chip and the re-distribution layer connected to the chip by cutting; fixing the chip and the re-distribution layer connected thereto to a second panel level substrate; and encapsulating the chip to form an encapsulating layer. A chip encapsulating structure is prepared by the above described chip encapsulating method.
Abstract:
The present application provides a display panel, a method for packaging the display panel and a display device. The present application provides a display panel including: a first substrate, a second substrate which is oppositely arranged with respect to the first substrate to form a cell. A sealant layer is arranged between the first substrate and the second substrate, and the first substrate and the second substrate are adhered together by the sealant layer. A first heat conducting pattern is arranged on the first substrate at a position corresponding to a position of the sealant layer, and the first heat conducting pattern is in contact with the sealant layer. The first heat conducting pattern is capable of conducting heat produced by laser during the process of heating the sealant by the laser to form a sealant layer.
Abstract:
The present invention provides a glass powder blend comprising glass powder and additives, wherein the additives comprise copper powder, and the copper powder accounts for 2-3 mass % based on the total amount of the glass powder blend in 100 mass %. The present invention also provides a glass powder paste and a photoelectric package. Due to the addition of copper powder to the glass powder, the melting point of the glass powder blend can be decreased, thereby lowering the temperature for melting the glass powder blend by using laser, and reducing the thermal stress generated during encapsulation.
Abstract:
A dimming unit, a backlight module group and a display device are disclosed in the disclosure. The dimming unit according to the disclosure includes a dimming body and a light source, a groove is provided on the dimming body, a cavity is provided on a first sidewall of the groove for accommodating the light source, and the cavity has a light outlet facing a second sidewall of the groove which is opposite to the first sidewall, so that a light ray is reflected by the second sidewall towards an opening of the groove. A backlight module group includes an optical film layer and a light source device provided on a side of a light incident surface of the optical film layer, the light source device includes the dimming unit according to the disclosure, and a light ray emitted by the dimming unit is emitted to the optical film layer.
Abstract:
A liquid crystal display device is disclosed. The LCD device includes a liquid crystal panel and a backlight module, wherein the liquid crystal panel is hung onto the backlight module when the LCD device is placed in a vertical state.
Abstract:
A light-emitting device comprises a first electrode, at least two light-emitting units and a second electrode which are sequentially stacked in a first direction. The at least two light-emitting units comprise a first light-emitting unit and a second light-emitting unit, the second light-emitting unit being located between the first light-emitting unit and the second electrode. At least one light-emitting unit comprises a light-emitting layer and an exciton blocking layer located on the side of the light-emitting layer close to the first electrode; the exciton blocking layer comprises a first sub-layer and a second sub-layer which are stacked in the first direction; the first sub-layer is located between the second sub-layer and the light-emitting layer; and in the first direction, the thickness of the first sub-layer is smaller than that of the second sub-layer, and the highest occupied molecular orbital energy level of the first sub-layer is higher than the highest occupied molecular orbital energy level of the second sub-layer. The light-emitting device provided by the present disclosure can enable exciton recombination regions of the light-emitting layer corresponding to each light-emitting unit to get close as much as possible, thereby improving light-emitting efficiency of the light-emitting device.
Abstract:
The present disclosure provides an organic electroluminescent diode, and belongs to the field of display technology. The organic electroluminescent diode includes an anode, a light emitting layer, a hole blocking layer, an electron transport layer, and a cathode, which are stacked in sequence; wherein the light emitting layer comprises a host material, a TADF material, and a fluorescent dopant material; the host material is selected from the compound represented by Chemical Formula 1, and the material of the hole blocking layer is selected from the compound represented by Chemical Formula 2: The organic electroluminescence diode can improve the lifetime of the diode.
Abstract:
The present disclosure provides a display substrate and a display panel. The display substrate comprises: a base substrate, a first electrode layer, a first light-emitting layer, a first common connection layer, a second light-emitting layer, a third light-emitting layer, and a second electrode layer. The first electrode layer is provided on a side of the base substrate; the first light-emitting layer is provided on a side of the first electrode layer away from the base substrate; the first common connection layer is provided on a side of the first light-emitting layer away from the first electrode layer, and comprises a plurality of first sub-common connection layers; each second sub-light-emitting layer of the second light-emitting layer is provided on a side of each first sub-common connection layer away from the first light-emitting layer in one-to-one correspondence.
Abstract:
A light-emitting substrate includes a substrate, a plurality of sub-pixels, a first light extraction layer and a second light extraction layer. Each sub-pixel includes a light-emitting element and a light conversion pattern disposed on a light-exit side of the light-emitting element. The plurality of sub-pixels include at least one first sub-pixel. The first light extraction layer is disposed on a side of the first sub-pixel away from the light-emitting element, and at least located in a region where the at least one first sub-pixel is located. The first light extraction layer includes first transparent substrate(s) and optically active substances added in each first transparent substrate. The second light extraction layer is disposed on a side of the first light extraction layer away from the light-emitting element. A refractive index of the second light extraction layer is smaller than a refractive index of the first light extraction layer.