Dimming Unit, Backlight Module Group and Display Device
    3.
    发明申请
    Dimming Unit, Backlight Module Group and Display Device 审中-公开
    调光单元,背光模块组和显示设备

    公开(公告)号:US20150301406A1

    公开(公告)日:2015-10-22

    申请号:US14317091

    申请日:2014-06-27

    IPC分类号: G02F1/1335

    摘要: A dimming unit, a backlight module group and a display device are disclosed in the disclosure. The dimming unit according to the disclosure includes a dimming body and a light source, a groove is provided on the dimming body, a cavity is provided on a first sidewall of the groove for accommodating the light source, and the cavity has a light outlet facing a second sidewall of the groove which is opposite to the first sidewall, so that a light ray is reflected by the second sidewall towards an opening of the groove. A backlight module group includes an optical film layer and a light source device provided on a side of a light incident surface of the optical film layer, the light source device includes the dimming unit according to the disclosure, and a light ray emitted by the dimming unit is emitted to the optical film layer.

    摘要翻译: 在本公开中公开了调光单元,背光模块组和显示装置。 根据本发明的调光单元包括调光体和光源,在调光体上设置有凹槽,在凹槽的第一侧壁上设置有用于容纳光源的空腔,并且空腔具有面向 所述凹槽的与所述第一侧壁相对的第二侧壁,使得光线被所述第二侧壁朝向所述凹槽的开口反射。 背光模块组包括设置在光学膜层的光入射面一侧的光学膜层和光源装置,该光源装置包括根据本公开的调光单元,以及通过调光发出的光线 单元被发射到光学膜层。

    DRIVING BACKPLANE, MANUFACTURING METHOD THEREOF, AND DISPLAY APPARATUS

    公开(公告)号:US20210225901A1

    公开(公告)日:2021-07-22

    申请号:US17059501

    申请日:2020-03-11

    IPC分类号: H01L27/12 H01L25/16

    摘要: The manufacturing method of the driving backplane includes following steps. A first flexible base is formed on a surface of a rigid substrate. At least one type of conductive pattern is formed on a surface of the first flexible base. At least one type of first via is provided in the rigid substrate. At least one type of second via is provided in the first flexible base by using the rigid substrate as a mask and a conductive pillar is formed in the at least one type of second via, so that the conductive pillars are connected to respective types of conductive pattern in one-to-one correspondence. At least one type of driving chip is correspondingly bonded to the conductive pillar formed in the at least one type of second via from a side of the first flexible base away from the at least one type of conductive pattern.

    Backlight Module and Display Device
    8.
    发明公开

    公开(公告)号:US20240295685A1

    公开(公告)日:2024-09-05

    申请号:US17914742

    申请日:2021-11-16

    IPC分类号: F21V8/00

    摘要: Disclosed are a backlight module and a display device. The backlight module includes a backplate, a led-bar, a light guide plate and an optical sheet group; wherein the led-bar includes a plurality of light sources disposed towards the light entrance surface of the light guide plate; the light exit surface and the light entrance surface of the light guide plate are adjacent; a portion of the light exit surface of the light guide plate near the light entrance surface is provided with a step structure in which heights of steps gradually decrease in a first direction; the optical sheet group includes a plurality of optical sheets stacked on the side where the light exit surface of the light guide plate is located, and each of the optical sheets is fixed to a corresponding step in the step structure.

    TIME-OF-FLIGHT CAMERA MODULE AND DISPLAY DEVICE

    公开(公告)号:US20240241224A1

    公开(公告)日:2024-07-18

    申请号:US17927388

    申请日:2021-10-26

    IPC分类号: G01S7/481 G01S7/51 G01S17/894

    摘要: A time-of-flight camera module and a display device are provided. The time-of-flight module includes: a first carrier board, a second carrier board, a structure support, an infrared laser emission unit, a lens and a time-of-flight sensor. The first carrier board, the structure support and the second carrier board are stacked, and the first carrier board and the second carrier board are fixed on both sides of the structure support, respectively. The infrared laser emission unit is arranged on a side of the first carrier board away from the structure support, and the first carrier board includes a lens via hole located on a side of the infrared laser emission unit, the structure support includes a support via hole corresponding to the lens via hole, and the lens passes through the support via hole. The time-of-flight sensor is arranged on the second carrier board and is configured to sense infrared light collected by the lens to generate depth information.