Broadband DC block impedance matching network
    21.
    发明申请
    Broadband DC block impedance matching network 有权
    宽带直流阻抗匹配网络

    公开(公告)号:US20070052492A1

    公开(公告)日:2007-03-08

    申请号:US11222254

    申请日:2005-09-08

    IPC分类号: H01P5/02

    CPC分类号: H01P1/203 H01P11/007

    摘要: An apparatus in one example has: a substrate having a microstrip line; a capacitor at a predetermined location along the microstrip line, the capacitor producing a discontinuity; and a ground plane assembly on the substrate, the ground plane assembly having an opening that compensates for the discontinuity of the capacitor.

    摘要翻译: 一个示例中的装置具有:具有微带线的基板; 沿着微带线在预定位置处的电容器,所述电容器产生不连续性; 以及在基板上的接地平面组件,接地平面组件具有补偿电容器不连续性的开口。

    Interrogation, monitoring and data exchange using RFID tags

    公开(公告)号:US07053777B2

    公开(公告)日:2006-05-30

    申请号:US11133298

    申请日:2005-05-20

    申请人: Barry Allen

    发明人: Barry Allen

    IPC分类号: G08B13/14

    摘要: A method and apparatus for identification and monitoring of, and obtaining data relating to, products moving along a distribution path, including at least one RFID tag mountable to a product, or product carrier, and a plurality of interrogators spaced apart along the distribution path, wherein each interrogator of the plurality of interrogators cooperates in RF communication with the RFID tag when the RFID tag is in proximity to the each interrogator along the distribution path. Each interrogator interrogates the RFID tag during the RF communication so as to obtain unique data, unique to the RFID tag. The RFID tag and each interrogator each includes a transceiver and memory, the memory.

    Interrogation, monitoring and data exchange using RFID tags
    23.
    发明授权
    Interrogation, monitoring and data exchange using RFID tags 有权
    使用RFID标签的询问,监控和数据交换

    公开(公告)号:US06917291B2

    公开(公告)日:2005-07-12

    申请号:US10373175

    申请日:2003-02-26

    申请人: Barry Allen

    发明人: Barry Allen

    摘要: A method and apparatus for identification and monitoring of, and obtaining data relating to, products moving along a distribution path, including at least one RFID tag mountable to a product, or product carrier, and a plurality of interrogators spaced apart along the distribution path, wherein each interrogator of the plurality of interrogators cooperates in RF communication with the RFID tag when the RFID tag is in proximity to the each interrogator along the distribution path. Each interrogator interrogates the RFID tag during the RF communication so as to obtain unique data, unique to the RFID tag. The RFID tag and each interrogator each includes a transceiver and memory.

    摘要翻译: 一种用于识别和监测并获得与沿着分配路径移动的产品相关的数据的方法和装置,包括可安装到产品或产品载体的至少一个RFID标签以及沿着分配路径间隔开的多个询问器, 其中当RFID标签沿着分配路径接近每个询问器时,多个询问器的每个询问器与RFID标签进行RF通信协作。 每个询问器在RF通信期间询问RFID标签,以获得RFID标签独有的唯一数据。 RFID标签和每个询问器都包括收发器和存储器。

    Suspended substrate low loss coupler
    24.
    发明申请
    Suspended substrate low loss coupler 有权
    悬挂衬底低损耗耦合器

    公开(公告)号:US20050104681A1

    公开(公告)日:2005-05-19

    申请号:US10705870

    申请日:2003-11-13

    IPC分类号: H01P5/18

    CPC分类号: H01P5/187

    摘要: A low loss suspended substrate coupler includes a substrate having a first transmission line disposed on a topside of the substrate and a second transmission line disposed on the bottom side of the substrate, thereby providing broadside transmission line coupling. To provide closer mode velocity matching, the coupler has capacitive loading or coupling to ground at discrete intervals between the two transmission lines. The capacitive loading is formed by integrating stubs in each transmission line at pre-determined intervals, each of which is opposite a corresponding one of a plurality of ground stubs on the other side of the substrate. The ground stubs are connected to ground at the outer edge of the coupler area with substrate vias or directly to the coupler housing.

    摘要翻译: 低损耗悬置基板耦合器包括具有设置在基板的顶侧上的第一传输线的基板和设置在基板的底侧上的第二传输线,由此提供宽边传输线耦合。 为了提供更接近的模式速度匹配,耦合器在两个传输线之间以离散的间隔具有电容负载或耦合到地。 通过以预定的间隔将每个传输线中的短截线整合在一起,形成电容负载,每个间隔与衬底的另一侧上的多个接地短截线中的相应一个相对。 接地端子在耦合器区域的外边缘处与基板通孔连接,或直接连接到耦合器壳体。