Plasma processing method and apparatus
    21.
    发明申请
    Plasma processing method and apparatus 有权
    等离子体处理方法和装置

    公开(公告)号:US20070020958A1

    公开(公告)日:2007-01-25

    申请号:US11517456

    申请日:2006-09-08

    IPC分类号: H01L21/00

    摘要: With evacuation of interior of a vacuum chamber halted and with gas supply into the vacuum chamber halted, in a state that a mixed gas of helium gas and diborane gas is sealed in the vacuum chamber, a plasma is generated in a vacuum vessel and simultaneously a high-frequency power is supplied to a sample electrode. By the high-frequency power supplied to the sample electrode, boron is introduced to a proximity to the substrate surface.

    摘要翻译: 在真空室的内部抽真空,并且在真空室中供气进入中止状态下,在真空室内密封氦气和乙硼烷气体的混合气体的状态下,在真空容器中产生等离子体,同时 向样品电极提供高频电力。 通过提供给样品电极的高频功率,将硼引入到衬底表面附近。

    Plasma doping method with gate shutter
    23.
    发明授权
    Plasma doping method with gate shutter 失效
    等离子体掺杂法与栅极快门

    公开(公告)号:US08652953B2

    公开(公告)日:2014-02-18

    申请号:US13560648

    申请日:2012-07-27

    IPC分类号: H01L21/26 H01L21/42

    摘要: In a plasma doping device according to the invention, a vacuum chamber is evacuated with a turbo-molecular pump as an exhaust device via a exhaust port while a predetermined gas is being introduced from a gas supply device in order to maintain the inside of the vacuum chamber to a predetermined pressure with a pressure regulating valve. A high-frequency power of 13.56 MHz is supplied by a high-frequency power source to a coil provided in the vicinity of a dielectric window opposed to a sample electrode to generate inductive-coupling plasma in the vacuum chamber. A high-frequency power source for supplying a high-frequency power to the sample electrode is provided. Uniformity of processing is enhanced by driving a gate shutter and covering a through gate.

    摘要翻译: 在根据本发明的等离子体掺杂装置中,在从气体供给装置引入预定气体的同时,通过排气口将涡轮分子泵作为排气装置抽真空室,以保持真空内部 通过压力调节阀到达预定压力。 13.56MHz的高频功率由高频电源提供给设置在与样品电极相对的电介质窗口附近的线圈,以在真空室中产生电感耦合等离子体。 提供了用于向样品电极提供高频电力的高频电源。 通过驱动闸门并覆盖通过门来增强处理的均匀性。

    Method for forming impurity-introduced layer, method for cleaning object to be processed apparatus for introducing impurity and method for producing device
    24.
    发明授权
    Method for forming impurity-introduced layer, method for cleaning object to be processed apparatus for introducing impurity and method for producing device 有权
    形成杂质导入层的方法,用于清洗待加工物体的方法,用于引入杂质的方法及其制造方法

    公开(公告)号:US07759254B2

    公开(公告)日:2010-07-20

    申请号:US10569464

    申请日:2004-08-25

    IPC分类号: H01L21/302

    CPC分类号: H01L21/02052 H01L21/2236

    摘要: A method of forming an impurity-introduced layer is disclosed. The method includes at least a step of forming a resist pattern on a principal face of a solid substrate such as a silicon substrate (S27); a step of introducing impurity into the solid substrate through plasma-doping in ion mode (S23), a step of removing a resist (S28), a step of cleaning metal contamination and particles attached to a surface of the solid substrate (S25a); a step of anneal (S26). The step of removing a resist (S28) irradiates the resist with oxygen-plasma or brings mixed solution of sulfuric acid and hydrogen peroxide water, or mixed solution of NH4OH, H2O2 and H2O into contact with the resist. The step of cleaning (S25a) brings mixed solution of sulfuric acid and hydrogen peroxide water, or mixed solution of NH4OH, H2O2 and H2O into contact with the principal face of the solid substrate. The step of removing a resist (S28) and the step of cleaning (S25a) can be conducted simultaneously by bringing mixed solution of sulfuric acid and hydrogen peroxide water, or mixed solution of NH4OH, H2O2 and H2O into contact with the principal face of the solid substrate.

    摘要翻译: 公开了一种形成杂质导入层的方法。 该方法至少包括在诸如硅衬底的固体衬底的主面上形成抗蚀剂图案的步骤(S27); 通过离子模式的等离子体掺杂(S23)将杂质引入固体基板的步骤,去除抗蚀剂的步骤(S28),清洁附着在固体基板表面上的金属污染物和颗粒的步骤(S25a); 退火步骤(S26)。 去除抗蚀剂的步骤(S28)用氧等离子体照射抗蚀剂,或者将硫酸和过氧化氢水的混合溶液,或NH 4 OH,H 2 O 2和H 2 O的混合溶液与抗蚀剂接触。 清洗步骤(S25a)将硫酸和过氧化氢水或NH 4 OH,H 2 O 2和H 2 O的混合溶液混合溶液与固体基质的主面接触。 除去抗蚀剂(S28)和清洗步骤(S25a)的步骤可以通过将硫酸和过氧化氢水的混合溶液或NH 4 OH,H 2 O 2和H 2 O的混合溶液与主要面接触来同时进行 固体基质。

    PLASMA DOPING METHOD AND APPARATUS
    25.
    发明申请
    PLASMA DOPING METHOD AND APPARATUS 失效
    等离子喷涂方法和装置

    公开(公告)号:US20100098837A1

    公开(公告)日:2010-04-22

    申请号:US12648142

    申请日:2009-12-28

    IPC分类号: C23C16/52 H05H1/24 C23C16/448

    摘要: It is intended to provide a plasma doping method and apparatus which are superior in the controllability of the concentration of an impurity that is introduced into a surface layer of a sample.A prescribed gas is introduced into a vacuum container 1 from a gas supply apparatus 2 while being exhausted by a turbomolecular pump 3 as an exhaust apparatus. The pressure in the vacuum container 1 is kept at a prescribed value by a pressure regulating valve 4. High-frequency electric power of 13.56 MHz is supplied from a high-frequency power source 5 to a coil 8 disposed close to a dielectric window 7 which is opposed to a sample electrode 6, whereby induction-coupled plasma is generated in the vacuum container 1. A high-frequency power source 10 for supplying high-frequency electric power to the sample electrode 6 is provided. Every time a prescribed number of samples have been processed, a dummy sample is subjected to plasma doping and then to heating. The conditions for processing of a sample are controlled so that the measurement value of the surface sheet resistance becomes equal to a prescribed value, whereby the controllability of the impurity concentration can be increased.

    摘要翻译: 旨在提供一种等离子体掺杂方法和装置,该等离子体掺杂方法和装置在引入样品的表面层中的杂质的浓度的可控性方面是优异的。 将规定的气体从作为排气装置的涡轮分子泵3排出而从气体供给装置2引入真空容器1。 真空容器1中的压力通过压力调节阀4保持在规定值。13.56MHz的高频电力从高频电源5供给到靠近电介质窗7设置的线圈8, 与样品电极6相对,从而在真空容器1中产生感应耦合等离子体。提供了用于向样品电极6提供高频电力的高频电源10。 每当处理规定数量的样品时,将虚拟样品进行等离子体掺杂,然后进行加热。 控制处理样品的条件使得表面薄层电阻的测量值等于规定值,从而可以提高杂质浓度的可控性。

    Impurity Introducing Apparatus and Impurity Introducing Method
    27.
    发明申请
    Impurity Introducing Apparatus and Impurity Introducing Method 审中-公开
    杂质介绍仪器和杂质介绍方法

    公开(公告)号:US20090140174A1

    公开(公告)日:2009-06-04

    申请号:US11887371

    申请日:2006-03-29

    IPC分类号: H01J37/317 H01J37/32

    摘要: It is an object to prevent functions expected originally from being unexhibited when impurities to be introduced into a solid sample are mixed with each other, and to implement plasma doping with high precision.In order to distinguish impurities which may be mixed from impurities which should not be mixed, first of all, an impurity introducing mechanism of a core is first distinguished. In order to avoid a mixture of the impurities in very small amounts, a mechanism for delivering a semiconductor substrate to be treated and a mechanism for removing a resin material to be formed on the semiconductor substrate are used exclusively.

    摘要翻译: 当将待引入固体样品的杂质相互混合并且以高精度实现等离子体掺杂时,本发明的目的是防止最初预期的功能不被阻止。 为了区分可能与不混合的杂质混合的杂质,首先首先区分芯的杂质引入机理。 为了避免非常少量的杂质的混合,专门使用用于输送待处理的半导体衬底的机构和用于去除在半导体衬底上形成的树脂材料的机构。

    Method and Apparatus for Plasma Processing
    28.
    发明申请
    Method and Apparatus for Plasma Processing 失效
    等离子体处理方法和装置

    公开(公告)号:US20090068769A1

    公开(公告)日:2009-03-12

    申请号:US11887821

    申请日:2006-04-04

    IPC分类号: H01L21/66 G21K5/00

    摘要: An object of the invention is to provide a method and an apparatus for plasma processing which can accurately monitor an ion current applied to the surface of a sample.Predetermined gas is exhausted via an exhaust port 11 by a turbo-molecular pump 3 while introducing the gas within the vacuum chamber 1 from a gas supply device 2, and the pressure within the vacuum chamber 1 is kept at a predetermined value by a pressure regulating valve 4. A high-frequency power supply 5 for a plasma source supplies a high-frequency power to a coil 8 provided near a dielectric window 7 to generate inductively coupled plasma within the vacuum chamber 1. A high-frequency power supply 10 for the sample electrode for supplying the high-frequency power to the sample electrode 6 is provided. A matching circuit 13 for the sample electrode and a high-frequency sensor 14 are provided between the sample electrode high-frequency power supply and the sample electrode 6. An ion current applied to the surface of a sample can be accurately monitored buy using the high-frequency sensor 14 and an arithmetic device 15.

    摘要翻译: 本发明的目的是提供一种等离子体处理的方法和装置,其可以精确地监测施加在样品表面上的离子电流。 通过涡轮分子泵3通过排气口11排出预定气体,同时从气体供给装置2将真空室1内的气体导入,并通过压力调节将真空室1内的压力保持在规定值 用于等离子体源的高频电源5向设置在电介质窗口7附近的线圈8提供高频电力,以在真空室1内产生电感耦合等离子体。一高频电源10用于 提供了用于向样品电极6提供高频电力的样品电极。 在样品电极高频电源和样品电极6之间设置用于采样电极和高频传感器14的匹配电路13。可以使用高电平来准确地监测施加到样品表面的离子电流 频率传感器14和运算装置15。

    Method for Introducing Impurities
    29.
    发明申请
    Method for Introducing Impurities 失效
    引入杂质的方法

    公开(公告)号:US20080146009A1

    公开(公告)日:2008-06-19

    申请号:US10597716

    申请日:2005-02-04

    IPC分类号: H01L21/22

    CPC分类号: H01L21/2236

    摘要: To provide an impurity introducing method which can repeatedly carry out such a process that plasma irradiation for realization of amorphous and plasma doping were combined, in such a situation that steps are simple and through-put is high, without destroying an apparatus.At the time of switching over plasmas which are used in plasma irradiation for realization of amorphous and plasma doping, electric discharge is stopped, and an initial condition of a matching point of a high frequency power supply and a peripheral circuit is reset so as to adapt to plasma which is used in each step, or at the time of switching, a load, which is applied to the high frequency power supply etc., is reduced by increasing pressure and decreasing a bias voltage.

    摘要翻译: 为了提供可以重复进行等离子体放电以实现非晶态和等离子体掺杂的方法,在步骤简单且易于投入的情况下,不会破坏装置的方法。 在用于等离子体等离子体掺杂的等离子体照射中使用的等离子体切换时,停止放电,并且复位高频电源和外围电路的匹配点的初始状态,以适应 对于每个步骤中使用的等离子体,或者在切换时,通过增加压力和降低偏置电压来减小施加到高频电源等的负载。

    Method and apparatus for plasma doping
    30.
    发明申请
    Method and apparatus for plasma doping 审中-公开
    等离子体掺杂的方法和装置

    公开(公告)号:US20070074813A1

    公开(公告)日:2007-04-05

    申请号:US11603146

    申请日:2006-11-22

    IPC分类号: C23F1/00

    摘要: A method for impurity implantation, in which a substrate is positioned on a table provided within a chamber in which a vacuum will be introduced and also an implantation impurity is supplied. A first high frequency electric power is applied to a plasma generating element to thereby generate a plasma so that the impurity in the chamber is implanted in the substrate. Also, a second high frequency electric power is applied to the table. Detected are a condition of the plasma in the chamber and a voltage or current in the table. A controller controls at least one of the first and second high frequency electric power sources according to the detected condition of the plasma and/or the detected voltage or current, thereby controlling an implantation concentration of the impurity to be implanted.

    摘要翻译: 一种用于杂质注入的方法,其中将基板放置在设置在其中将被引入真空的室内的台上,并且还提供注入杂质。 将第一高频电力施加到等离子体发生元件,从而产生等离子体,使得腔室中的杂质注入基板。 此外,第二高频电力被施加到桌子上。 检测到的是室内等离子体的状态,以及表中的电压或电流。 控制器根据检测到的等离子体的状态和/或检测到的电压或电流来控制第一和第二高频电源中的至少一个,从而控制待植入的杂质的注入浓度。