Method for forming impurity-introduced layer, method for cleaning object to be processed apparatus for introducing impurity and method for producing device
    1.
    发明授权
    Method for forming impurity-introduced layer, method for cleaning object to be processed apparatus for introducing impurity and method for producing device 有权
    形成杂质导入层的方法,用于清洗待加工物体的方法,用于引入杂质的方法及其制造方法

    公开(公告)号:US07759254B2

    公开(公告)日:2010-07-20

    申请号:US10569464

    申请日:2004-08-25

    IPC分类号: H01L21/302

    CPC分类号: H01L21/02052 H01L21/2236

    摘要: A method of forming an impurity-introduced layer is disclosed. The method includes at least a step of forming a resist pattern on a principal face of a solid substrate such as a silicon substrate (S27); a step of introducing impurity into the solid substrate through plasma-doping in ion mode (S23), a step of removing a resist (S28), a step of cleaning metal contamination and particles attached to a surface of the solid substrate (S25a); a step of anneal (S26). The step of removing a resist (S28) irradiates the resist with oxygen-plasma or brings mixed solution of sulfuric acid and hydrogen peroxide water, or mixed solution of NH4OH, H2O2 and H2O into contact with the resist. The step of cleaning (S25a) brings mixed solution of sulfuric acid and hydrogen peroxide water, or mixed solution of NH4OH, H2O2 and H2O into contact with the principal face of the solid substrate. The step of removing a resist (S28) and the step of cleaning (S25a) can be conducted simultaneously by bringing mixed solution of sulfuric acid and hydrogen peroxide water, or mixed solution of NH4OH, H2O2 and H2O into contact with the principal face of the solid substrate.

    摘要翻译: 公开了一种形成杂质导入层的方法。 该方法至少包括在诸如硅衬底的固体衬底的主面上形成抗蚀剂图案的步骤(S27); 通过离子模式的等离子体掺杂(S23)将杂质引入固体基板的步骤,去除抗蚀剂的步骤(S28),清洁附着在固体基板表面上的金属污染物和颗粒的步骤(S25a); 退火步骤(S26)。 去除抗蚀剂的步骤(S28)用氧等离子体照射抗蚀剂,或者将硫酸和过氧化氢水的混合溶液,或NH 4 OH,H 2 O 2和H 2 O的混合溶液与抗蚀剂接触。 清洗步骤(S25a)将硫酸和过氧化氢水或NH 4 OH,H 2 O 2和H 2 O的混合溶液混合溶液与固体基质的主面接触。 除去抗蚀剂(S28)和清洗步骤(S25a)的步骤可以通过将硫酸和过氧化氢水的混合溶液或NH 4 OH,H 2 O 2和H 2 O的混合溶液与主要面接触来同时进行 固体基质。

    Method for Introducing Impurities
    2.
    发明申请
    Method for Introducing Impurities 失效
    引入杂质的方法

    公开(公告)号:US20080146009A1

    公开(公告)日:2008-06-19

    申请号:US10597716

    申请日:2005-02-04

    IPC分类号: H01L21/22

    CPC分类号: H01L21/2236

    摘要: To provide an impurity introducing method which can repeatedly carry out such a process that plasma irradiation for realization of amorphous and plasma doping were combined, in such a situation that steps are simple and through-put is high, without destroying an apparatus.At the time of switching over plasmas which are used in plasma irradiation for realization of amorphous and plasma doping, electric discharge is stopped, and an initial condition of a matching point of a high frequency power supply and a peripheral circuit is reset so as to adapt to plasma which is used in each step, or at the time of switching, a load, which is applied to the high frequency power supply etc., is reduced by increasing pressure and decreasing a bias voltage.

    摘要翻译: 为了提供可以重复进行等离子体放电以实现非晶态和等离子体掺杂的方法,在步骤简单且易于投入的情况下,不会破坏装置的方法。 在用于等离子体等离子体掺杂的等离子体照射中使用的等离子体切换时,停止放电,并且复位高频电源和外围电路的匹配点的初始状态,以适应 对于每个步骤中使用的等离子体,或者在切换时,通过增加压力和降低偏置电压来减小施加到高频电源等的负载。

    Plasma processing method and apparatus
    3.
    发明授权
    Plasma processing method and apparatus 失效
    等离子体处理方法和装置

    公开(公告)号:US08288259B2

    公开(公告)日:2012-10-16

    申请号:US12950048

    申请日:2010-11-19

    IPC分类号: H01L21/223

    摘要: With the evacuation of an interior of a vacuum chamber halted and with gas supply into the vacuum chamber halted, in a state that a mixed gas of helium gas and diborane gas is sealed in the vacuum chamber, a plasma is generated in a vacuum vessel and simultaneously a high-frequency power is supplied to a sample electrode. By the high-frequency power supplied to the sample electrode, boron is introduced to a proximity to a substrate surface.

    摘要翻译: 随着真空室内部的抽真空,并且气体供应到真空室中停止,在氦气和乙硼烷气体的混合气体被密封在真空室中的状态下,在真空容器中产生等离子体, 同时向样品电极提供高频电力。 通过提供给样品电极的高频电力,将硼引入到衬底表面附近。

    Plasma processing method and plasma processing apparatus
    4.
    发明授权
    Plasma processing method and plasma processing apparatus 失效
    等离子体处理方法和等离子体处理装置

    公开(公告)号:US07858155B2

    公开(公告)日:2010-12-28

    申请号:US11666773

    申请日:2005-10-27

    IPC分类号: A61N5/00 G21G5/00

    摘要: It is intended to provide a plasma processing method and apparatus capable of increasing the uniformity of amorphyzation processing.A prescribed gas is introduced into a vacuum container 1 from a gas supply apparatus 2 through a gas inlet 11 while being exhausted by a turbomolecular pump 3 as an exhaust apparatus through an exhaust hole 12. The pressure in the vacuum container 1 is kept at a prescribed value by a pressure regulating valve 4. High-frequency electric power of 13.56 MHz is supplied from a high-frequency power source 5 to a coil 8 disposed close to a dielectric window 7 which is opposed to a sample electrode 6, whereby induction-coupled plasma is generated in the vacuum container 1. A high-frequency power source 10 for supplying high-frequency electric power to the sample electrode 6 is provided and functions as a voltage source for controlling the potential of the sample electrode 6. A surface crystal layer of a silicon wafer 9 was rendered amorphous successfully by improving the structure of the sample-electrode 6.

    摘要翻译: 本发明旨在提供一种能够提高薰蒸处理的均匀性的等离子体处理方法和装置。 通过排气孔12,通过作为排气装置的涡轮分子泵3排出,通过气体入口11将气体从气体供给装置2引入真空容器1。真空容器1内的压力保持在 通过压力调节阀4的规定值。13.56MHz的高频电力从高频电源5供给到靠近与样品电极6相对的电介质窗7的线圈8, 在真空容器1中产生耦合等离子体。提供用于向样品电极6提供高频电力的高频电源10,并且用作用于控制样品电极6的电位的电压源。表面晶体 通过改善样品电极6的结构,使硅晶片9的层成为无定形。

    Plasma Processing Method and Plasma Processing Apparatus
    6.
    发明申请
    Plasma Processing Method and Plasma Processing Apparatus 失效
    等离子体处理方法和等离子体处理装置

    公开(公告)号:US20080258082A1

    公开(公告)日:2008-10-23

    申请号:US11666773

    申请日:2005-10-27

    IPC分类号: G21G5/00

    摘要: It is intended to provide a plasma processing method and apparatus capable of increasing the uniformity of amorphyzation processing.A prescribed gas is introduced into a vacuum container 1 from a gas supply apparatus 2 through a gas inlet 11 while being exhausted by a turbomolecular pump 3 as an exhaust apparatus through an exhaust hole 12. The pressure in the vacuum container 1 is kept at a prescribed value by a pressure regulating valve 4. High-frequency electric power of 13.56 MHz is supplied from a high-frequency power source 5 to a coil 8 disposed close to a dielectric window 7 which is opposed to a sample electrode 6, whereby induction-coupled plasma is generated in the vacuum container 1. A high-frequency power source 10 for supplying high-frequency electric power to the sample electrode 6 is provided and functions as a voltage source for controlling the potential of the sample electrode 6. A surface crystal layer of a silicon wafer 9 was rendered amorphous successfully by improving the structure of the sample-electrode 6.

    摘要翻译: 本发明旨在提供一种能够提高薰蒸处理的均匀性的等离子体处理方法和装置。 通过排气孔12通过作为排气装置的涡轮分子泵3排出,将规定的气体从气体供给装置2经由气体入口11导入真空容器1。 真空容器1中的压力通过压力调节阀4保持在规定值。 从高频电源5将13.56MHz的高频电力供给到与样品电极6相对的电介质窗7附近设置的线圈8,由此在真空容器1内产生感应耦合等离子体 。 提供了用于向样品电极6提供高频电力的高频电源10,并且用作用于控制样品电极6的电位的电压源。 通过改善样品电极6的结构,使硅晶片9的表面晶体层成为非晶体。

    Plasma processing method and apparatus
    9.
    发明申请
    Plasma processing method and apparatus 有权
    等离子体处理方法和装置

    公开(公告)号:US20070020958A1

    公开(公告)日:2007-01-25

    申请号:US11517456

    申请日:2006-09-08

    IPC分类号: H01L21/00

    摘要: With evacuation of interior of a vacuum chamber halted and with gas supply into the vacuum chamber halted, in a state that a mixed gas of helium gas and diborane gas is sealed in the vacuum chamber, a plasma is generated in a vacuum vessel and simultaneously a high-frequency power is supplied to a sample electrode. By the high-frequency power supplied to the sample electrode, boron is introduced to a proximity to the substrate surface.

    摘要翻译: 在真空室的内部抽真空,并且在真空室中供气进入中止状态下,在真空室内密封氦气和乙硼烷气体的混合气体的状态下,在真空容器中产生等离子体,同时 向样品电极提供高频电力。 通过提供给样品电极的高频功率,将硼引入到衬底表面附近。