Heat dissipation enclosure
    21.
    发明授权

    公开(公告)号:US11249268B2

    公开(公告)日:2022-02-15

    申请号:US16643687

    申请日:2018-09-07

    Abstract: Disclosed herein is an enclosure including a housing for dissipating heat from first and second heat generating components located on first and second circuit boards, respectively. In the enclosure, a first heat sink plate and a second heat sink plate are spring biased apart from one another. A maximum spring biasing distance between the first heat sink plate and the second heat sink plate is greater than a distance between the interior side of the front wall and the interior side of the back wall of the housing.

    Managed electrical connectivity systems

    公开(公告)号:US09437990B2

    公开(公告)日:2016-09-06

    申请号:US14809789

    申请日:2015-07-27

    Abstract: A receptacle block defines at least one socket at which a plug connector may be received. First contact members extend into each socket to receive a primary signal from a plug connector. Second contact members extend into one or more of the sockets to read physical layer information from any plug connector inserted into the socket. A sensing contact is positioned to electrically connect to one of the second contact members when a plug connector is inserted into the respective socket. At least a portion of the sensing contact is flexible to follow the movement of the one second contact member. In certain implementations, the second contact members have resilient sections that are identical to each other.

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