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    SYSTEMS AND METHODS FOR DISTRIBUTING POWER IN A POWER-TO-THE-EDGE SYSTEM ARCHITECTURE
    2.
    发明申请
    SYSTEMS AND METHODS FOR DISTRIBUTING POWER IN A POWER-TO-THE-EDGE SYSTEM ARCHITECTURE 审中-公开

    公开(公告)号：US20200228001A1

    公开(公告)日：2020-07-16

    申请号：US16642406

    申请日：2018-09-07

    Applicant: CommScope Technologies LLC

    Inventor： David Thomas Lambert ,  Lee Holloway ,  Andrew Williams ,  David Thomas

    IPC: H02M1/32 ,  H02M3/156 ,  H04L12/10 ,  G06F1/26

    Abstract: Systems and methods for distributing power in a power-to-the-edge system architecture are provided. In one embodiment, a system comprises an intelligent power switch configured to couple to a power supply, wherein the intelligent power switch outputs a first differential voltage output; and a plurality of intelligent remote nodes each comprising a management microcontroller (MCU) and a DC-to-DC converter. The intelligent remote nodes each receive the differential voltage output, and are communicatively coupled to a data network. The intelligent power switch comprises a processor executing an intelligent start-up control and switching function and an electrical fault detection function. The intelligent power switch outputs the differential voltage at a first voltage level while the electrical fault detection function monitors the differential voltage output. Based on results of monitoring at the first voltage level, the intelligent power switch switches the output to a second voltage level higher than the first voltage level.

    Heat dissipation enclosure
    3.
    发明授权
    Heat dissipation enclosure 有权

    公开(公告)号：US11249268B2

    公开(公告)日：2022-02-15

    申请号：US16643687

    申请日：2018-09-07

    Applicant: COMMSCOPE TECHNOLOGIES LLC

    Inventor： Christopher Charles Taylor ,  David Patrick Murray ,  David Thomas

    IPC: G02B6/44 ,  H02G3/03 ,  H02G3/16 ,  H05K7/20

    Abstract: Disclosed herein is an enclosure including a housing for dissipating heat from first and second heat generating components located on first and second circuit boards, respectively. In the enclosure, a first heat sink plate and a second heat sink plate are spring biased apart from one another. A maximum spring biasing distance between the first heat sink plate and the second heat sink plate is greater than a distance between the interior side of the front wall and the interior side of the back wall of the housing.

    Heterogeneous and/or hosted physical layer management system
    5.
    发明授权
    Heterogeneous and/or hosted physical layer management system 有权

    公开(公告)号：US10091050B2

    公开(公告)日：2018-10-02

    申请号：US13939805

    申请日：2013-07-11

    Applicant: CommScope Technologies LLC ,  CommScope Connectivity UK Limited

    Inventor： Trevor D. Smith ,  Kamlesh G. Patel ,  Gene Malone ,  David Thomas

    IPC: H04L12/24

    Abstract: One embodiment is directed to a heterogeneous physical layer management system comprising first devices, each comprising first physical layer information acquisition technology to obtain physical layer information about cabling attached to the first devices. The system further comprises second devices, each comprising second physical layer information acquisition technology to obtain physical layer information about cabling attached to the second devices, wherein the second physical layer information acquisition technology differs from the first physical layer information acquisition technology. The system further comprises a common management application communicatively coupled to the first devices and the second devices, wherein the common management application is configured to aggregate physical layer information from the first devices and the second devices. Another embodiment is directed to providing a physical layer management application as a service hosted by a third party. Other embodiments are disclosed.

    Heterogeneous and/or hosted physical layer management system
    7.
    发明授权
    Heterogeneous and/or hosted physical layer management system 有权

    公开(公告)号：US11496352B2

    公开(公告)日：2022-11-08

    申请号：US16141784

    申请日：2018-09-25

    Applicant: CommScope Technologies LLC ,  CommScope Connectivity UK Limited

    Inventor： Trevor D. Smith ,  Kamlesh G. Patel ,  Gene Malone ,  David Thomas

    IPC: H04L41/022 ,  H04L67/10 ,  H04L41/0853 ,  H04L41/12

    Abstract: One embodiment is directed to a heterogeneous physical layer management system comprising first devices, each comprising first physical layer information acquisition technology to obtain physical layer information about cabling attached to the first devices. The system further comprises second devices, each comprising second physical layer information acquisition technology to obtain physical layer information about cabling attached to the second devices, wherein the second physical layer information acquisition technology differs from the first physical layer information acquisition technology. The system further comprises a common management application communicatively coupled to the first devices and the second devices, wherein the common management application is configured to aggregate physical layer information from the first devices and the second devices. Another embodiment is directed to providing a physical layer management application as a service hosted by a third party. Other embodiments are disclosed.

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