公开(公告)号：US10759898B2

公开(公告)日：2020-09-01

申请号：US15705722

申请日：2017-09-15

Applicant: Corning Incorporated

Inventor： Mingqian He ,  James Robert Matthews ,  Weijun Niu ,  Arthur Lawrence Wallace

IPC: C08G61/12 ,  H01B1/12 ,  H01L51/00

Abstract: Described herein are compositions including heterocyclic organic compounds. More specifically, described herein are bicyclic thiadiazole-based compounds that are combined with fused thiophenes structures, along with methods for making such compounds, and uses thereof.

公开(公告)号：US20200212304A1

公开(公告)日：2020-07-02

申请号：US16620050

申请日：2018-06-01

Applicant: Corning Incorporated

Inventor： Mingqian He ,  Yang Li ,  James Robert Matthews ,  Karan Mehrotra ,  Weijun Niu ,  Arthur Lawrence Wallace

IPC: H01L51/00 ,  C08G61/12

Abstract: Disclosed is a polymer blend comprising an organic semiconductor (OSC) polymer blended with an isolating polymer and method for making the same. The OSC polymer includes a diketopyrrolopyrrole fused thiophene polymeric material, and the fused thiophene is beta-substituted. The isolating polymer includes a non-conjugated backbone, and the isolating polymer may be one of polyacrylonitrile, alkyl substituted polyacrylonitrile, polystyrene, polysulfonate, polycarbonate, an elastomer block copolymer, derivatives thereof, copolymers thereof and mixtures thereof. The method includes blending the OSC polymer with an isolating polymer in an organic solvent to create a polymer blend and depositing a thin film of the polymer blend over a substrate. Also disclosed is an organic semiconductor device that includes a thin semiconducting film comprising OSC polymer.

公开(公告)号：US20200075865A1

公开(公告)日：2020-03-05

申请号：US16555548

申请日：2019-08-29

Applicant: CORNING INCORPORATED

Inventor： Mingqian He ,  James Robert Matthews ,  Weijun Niu ,  Adama Tandia ,  Arthur Lawrence Wallace

IPC: H01L51/00 ,  C08G61/12

Abstract: Compositions are included comprising heterocyclic organic compounds based on fused thiophene compounds, polymers based on fused thiophene compounds, and methods for making the monomers and polymer along with uses in thin film-based and other devices.

公开(公告)号：US20190240958A1

公开(公告)日：2019-08-08

申请号：US16385670

申请日：2019-04-16

Applicant: CORNING INCORPORATED

Inventor： Michael Edward DeRosa ,  Jennifer Lynn Lyon ,  James Robert Matthews ,  Michael Lesley Sorensen ,  Arlin Lee Weikel

IPC: B32B17/10 ,  B32B7/022 ,  C08L33/14 ,  B32B7/02 ,  B64C1/14 ,  C08L33/10 ,  C08F220/28 ,  C08F220/30 ,  C08F226/06 ,  C08L33/08 ,  B64C1/06

CPC classification number: B32B17/10761 ,  B32B7/02 ,  B32B7/022 ,  B32B17/10036 ,  B32B17/10119 ,  B32B17/10137 ,  B32B17/10743 ,  B32B2250/03 ,  B32B2255/26 ,  B32B2307/102 ,  B32B2307/732 ,  B32B2419/00 ,  B32B2479/00 ,  B32B2509/00 ,  B32B2605/00 ,  B32B2607/00 ,  B64C1/00 ,  B64C1/066 ,  B64C1/14 ,  B64C2001/0072 ,  B64D2011/0046 ,  C08F220/18 ,  C08F220/28 ,  C08F220/30 ,  C08F226/06 ,  C08F2220/1875 ,  C08F2220/282 ,  C08F2220/285 ,  C08F2220/301 ,  C08L33/08 ,  C08L33/10 ,  C08L33/14 ,  Y02T50/43 ,  Y02T50/46 ,  Y10T428/2495 ,  Y10T428/24967

Abstract: Described herein are laminate structures with enhanced sound-damping properties and mechanical properties. The laminates are composed of an interlayer stucture disposed between a first glass substrate and a second glass substrate, wherein the interlayer is composed of a polymer layer designed such that sound attenuation or damping by the laminate is optimized. The laminates described herein may be used in vehicles or architectural panels. In one or more embodiments, the laminate may be disposed in an opening of a vehicle body. Where the vehicle body is an automobile, the laminate could be used as a windshield, a side window, sunroof or rear windshield. The body of some embodiments may include railcar body, or an airplane body. In other embodiments, the laminate may be used in architectural panels, which may include a window, an interior wall panel, a modular furniture panel, a backsplash, a cabinet panel, or an appliance panel.

公开(公告)号：US10350861B2

公开(公告)日：2019-07-16

申请号：US15219664

申请日：2016-07-26

Applicant: CORNING INCORPORATED

Inventor： Michael Edward DeRosa ,  Jennifer Lynn Lyon ,  James Robert Matthews ,  Michael Lesley Sorensen ,  Arlin Lee Weikel

IPC: B32B17/10 ,  B32B7/022 ,  C08L33/08 ,  C08L33/10 ,  C08L33/14 ,  C08F220/18 ,  C08F220/28 ,  C08F220/30 ,  C08F226/06 ,  B64C1/14 ,  B32B7/02 ,  B64C1/06 ,  B64C1/00 ,  B64D11/00

Abstract: Described herein are laminate structures with enhanced sound-damping properties and mechanical properties. The laminates are composed of an interlayer structure disposed between a first glass substrate and a second glass substrate, wherein the interlayer is composed of a polymer layer designed such that sound attenuation or damping by the laminate is optimized. The laminates described herein may be used in vehicles or architectural panels. In one or more embodiments, the laminate may be disposed in an opening of a vehicle body. Where the vehicle body is an automobile, the laminate could be used as a windshield, a side window, sunroof or rear windshield. The body of some embodiments may include railcar body, or an airplane body. In other embodiments, the laminate may be used in architectural panels, which may include a window, an interior wall panel, a modular furniture panel, a backsplash, a cabinet panel, or an appliance panel.

公开(公告)号：USRE47003E1

公开(公告)日：2018-08-21

申请号：US15254700

申请日：2016-09-01

Applicant: Corning Incorporated

Inventor： Mingqian He ,  Jianfeng Li ,  James Robert Matthews ,  Michael S Pambianchi

IPC: H01L29/08 ,  H01L51/00 ,  H01L35/24 ,  H01L51/05

CPC classification number: H01L51/0508 ,  H01L51/0001 ,  H01L51/0096 ,  Y02E10/549 ,  Y02P70/521

Abstract: Articles utilizing strengthened glass substrates, for example, ion-exchanged glass substrates, in combination with organic molecules or polymers are described along with methods for making the articles. The articles are useful in electronics-based devices that utilize organic thin film transistors.

公开(公告)号：US09580556B2

公开(公告)日：2017-02-28

申请号：US14968168

申请日：2015-12-14

Applicant: CORNING INCORPORATED

Inventor： Mingqian He ,  James Robert Matthews ,  Weijun Niu

IPC: C08G75/00 ,  C08G61/12 ,  H01L51/00 ,  H01L51/05

CPC classification number: C08G75/00 ,  C08G61/123 ,  C08G61/124 ,  C08G61/125 ,  C08G61/126 ,  C08G2261/124 ,  C08G2261/1412 ,  C08G2261/21 ,  C08G2261/3223 ,  C08G2261/3243 ,  C08G2261/334 ,  C08G2261/344 ,  C08G2261/364 ,  C08G2261/414 ,  C08G2261/92 ,  H01L51/0036 ,  H01L51/0043 ,  H01L51/0053 ,  H01L51/0558

Abstract: Described herein are compositions including hereocyclic fused thiophene based compounds, polymers based on fused thiophene compounds, and methods for making the monomer and polymer along with uses in thin film-based and other devices.

Abstract translation: 本文描述的是包括基于稠合噻吩的化合物，基于稠合噻吩化合物的聚合物和用于制备单体和聚合物以及用于薄膜和其它装置的方法的组合物。