公开(公告)号：US07487825B2

公开(公告)日：2009-02-10

申请号：US11309932

申请日：2006-10-31

申请人： Guang Yu ,  Yong-Dong Chen ,  Shih-Hsun Wung ,  Chun-Chi Chen

发明人： Guang Yu ,  Yong-Dong Chen ,  Shih-Hsun Wung ,  Chun-Chi Chen

IPC分类号： F28D15/00 ,  H05K7/20

CPC分类号： B23P15/26 ,  B23P2700/09 ,  B23P2700/10 ,  F28D15/0275 ,  H01L23/367 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49378 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink (10) and a first heat pipe (20) enclosing a bottom edge of the heat sink. The heat sink includes a base (12) defining a first passage (120) extending therethrough. The first heat pipe includes a first transferring section (22) extending in the first passage and totally embedded in the base and a pair of first dissipating sections (24) extending from the first transferring section. The first dissipating sections of the first heat pipe are attached on an outer periphery of the base. The first transferring section of the first heat pipe absorbs heat in the middle of the base and transfers it to the first dissipating sections to evenly distribute the heat throughout the whole base.

摘要翻译： 散热装置包括散热器（10）和封装散热器底部边缘的第一热管（20）。 散热器包括限定从其延伸穿过的第一通道（120）的基座（12）。 第一热管包括在第一通道中延伸并完全嵌入基座的第一传递部分（22）和从第一传送部分延伸的一对第一散热部分（24）。 第一热管的第一散热部分附接在基部的外周。 第一热管的第一传送部分吸收基部中部的热量并将其传递到第一散热部分以在整个基部均匀分布热量。

公开(公告)号：US07447035B2

公开(公告)日：2008-11-04

申请号：US11566015

申请日：2006-12-01

申请人： Jin-Biao Liu ,  Guang Yu ,  Shih-Hsun Wung ,  Chun-Chi Chen

发明人： Jin-Biao Liu ,  Guang Yu ,  Shih-Hsun Wung ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H01L23/4006 ,  H01L23/3672 ,  H01L23/427 ,  H01L2023/4056 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device assembly is mounted on a printed circuit board (80). First and second electronic components (82, 84) are mounted on the printed circuit board. The heat dissipation device assembly includes a first heat sink (10) in thermal contact with the first electronic component, and a second heat sink (20) in thermal contact with the second electronic component. A spring tab (24) is sandwiched between the first and second heat sinks for providing spring force between the first and second heat sinks thus securely mounting the second heat sink on the second electronic component.

摘要翻译： 散热装置组件安装在印刷电路板（80）上。 第一和第二电子部件（82,84）安装在印刷电路板上。 散热装置组件包括与第一电子部件热接触的第一散热器（10）和与第二电子部件热接触的第二散热器（20）。 在第一和第二散热器之间夹有弹簧片（24），以在第一和第二散热器之间提供弹簧力，从而将第二散热器牢固地安装在第二电子部件上。

公开(公告)号：US07478668B2

公开(公告)日：2009-01-20

申请号：US11564265

申请日：2006-11-28

申请人： Yong-Dong Chen ,  Guang Yu ,  Shih-Hsun Wung ,  Chun-Chi Chen

发明人： Yong-Dong Chen ,  Guang Yu ,  Shih-Hsun Wung ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base and a fin set arranged on the base. The fin set includes a plurality of fins each having an undulating body and two flanges extending from the body. The body includes a plurality of peak faces, a plurality of trough faces alternating with the peak faces and a plurality of slanted faces each connecting adjacent peak face and trough face. The peak faces of each fin conform to the peak faces of an adjacent fin, while the trough faces of each fin conform to the trough faces of the adjacent fin. Pluralities of undulating passages are defined between two adjacent fins. Each heat pipe has a first section contacting the base and a second section extending through the fin set. A fan is located corresponding to the passages of the fin set for providing forced airflow to the fin set.

摘要翻译： 散热装置包括底座和布置在基座上的翅片组。 翅片组包括多个翅片，每个翼片具有起伏体和从主体延伸的两个凸缘。 主体包括多个峰面，与峰面交替的多个槽面和各自连接相邻的峰面和槽面的多个倾斜面。 每个翅片的峰面与相邻翅片的峰面匹配，而每个翅片的槽面符合相邻翅片的槽面。 在两个相邻的翅片之间限定多个起伏通道。 每个热管具有接触基部的第一部分和延伸穿过翅片组的第二部分。 风扇对应于翅片组的通道，用于向翅片组提供强制气流。

公开(公告)号：US20080101027A1

公开(公告)日：2008-05-01

申请号：US11309932

申请日：2006-10-31

申请人： Guang Yu ,  Yong-Dong Chen ,  Shih-Hsun Wung ,  Chun-Chi Chen

发明人： Guang Yu ,  Yong-Dong Chen ,  Shih-Hsun Wung ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  B23P15/26

CPC分类号： B23P15/26 ,  B23P2700/09 ,  B23P2700/10 ,  F28D15/0275 ,  H01L23/367 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49378 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink (10) and a first heat pipe (20) enclosing a bottom edge of the heat sink. The heat sink includes a base (12) defining a first passage (120) extending therethrough. The first heat pipe includes a first transferring section (22) extending in the first passage and totally embedded in the base and a pair of first dissipating sections (24) extending from the first transferring section. The first dissipating sections of the first heat pipe are attached on an outer periphery of the base. The first transferring section of the first heat pipe absorbs heat in the middle of the base and transfers it to the first dissipating sections to evenly distribute the heat throughout the whole base.

摘要翻译： 散热装置包括散热器（10）和封装散热器底部边缘的第一热管（20）。 散热器包括限定从其延伸穿过的第一通道（120）的基座（12）。 第一热管包括在第一通道中延伸并完全嵌入基座的第一传递部分（22）和从第一传送部分延伸的一对第一散热部分（24）。 第一热管的第一散热部分附接在基部的外周。 第一热管的第一传送部分吸收基部中部的热量并将其传递到第一散热部分以在整个基部均匀分布热量。

公开(公告)号：US20070215319A1

公开(公告)日：2007-09-20

申请号：US11308250

申请日：2006-03-14

申请人： Yong-Dong Chen ,  Bo-Yong Yang ,  Guang Yu ,  Shih-Hsun Wung ,  Chun-Chi Chen

发明人： Yong-Dong Chen ,  Bo-Yong Yang ,  Guang Yu ,  Shih-Hsun Wung ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

摘要： A heat dissipation device (10) includes a first heat sink (20), a second heat sink (30) and a heat pipe (40) transferring heat from the first heat sink to the second heat sink. A bracket (50) includes a first end (51) attached to the first heat sink and a second end (52) attached to the second heat sink, thus enhancing the strength and stability of the heat dissipation device.

摘要翻译： 散热装置（10）包括第一散热器（20），第二散热器（30）和将热量从第一散热器传递到第二散热器的热管（40）。 托架（50）包括附接到第一散热器的第一端（51）和附接到第二散热器的第二端（52），从而增强散热装置的强度和稳定性。

公开(公告)号：US20070195502A1

公开(公告)日：2007-08-23

申请号：US11309819

申请日：2006-10-03

申请人： Bo-Yong Yang ,  Yong-Dong Chen ,  Guang Yu ,  Shih-Hsun Wung ,  Chun-Chi Chen

发明人： Bo-Yong Yang ,  Yong-Dong Chen ,  Guang Yu ,  Shih-Hsun Wung ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  Y10T24/44026 ,  H01L2924/00

摘要： A heat sink fastener includes a main body, a piercing member and a wire clip. The main body includes a pressing part for holding a heat sink in contact with a heat-generating component, an engaging part and a latching leg; the engaging part and the latching leg are disposed at opposing ends of the pressing part. The piercing member includes a piercing body extending through the engaging part of the main body and a tubular part and a hook. The wire clip includes a pivot shaft pivotally connected with the tubular part of the piercing member, a locking leg for fastening to the main body and a lever interconnecting the pivot shaft and the locking leg together, wherein the lever is rotatable to change the positional relationship between the piercing member and the engaging part of the main body.

摘要翻译： 散热器紧固件包括主体，穿孔构件和线夹。 主体包括用于保持与发热部件，接合部和闩锁腿接触的散热器的按压部分; 接合部和锁定腿设置在按压部的相对端。 穿刺构件包括延伸穿过主体的接合部分的穿孔体和管状部分和钩。 电线夹包括与穿刺构件的管状部分枢转地连接的枢轴，用于紧固到主体的锁定腿和将枢转轴和锁定腿相互连接在一起的杠杆，其中杠杆可旋转以改变位置关系 在穿刺构件和主体的接合部之间。

公开(公告)号：US07495915B2

公开(公告)日：2009-02-24

申请号：US11626049

申请日：2007-01-23

申请人： Yong-Dong Chen ,  Guang Yu ,  Chun-Chi Chen ,  Shih-Hsun Wung

发明人： Yong-Dong Chen ,  Guang Yu ,  Chun-Chi Chen ,  Shih-Hsun Wung

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation system is used for dissipating heat generated by an electronic device mounted on a printed circuit board. The heat dissipation system includes an enclosure adapted to receive the electronic device therein, the enclosure having a base plate on which the printed circuit board is mounted. A spreader adapted for contacting the electronic device in the enclosure. A plurality of fins disposed between the printed circuit board and the base plate, the fins thermally engaging with the base plate. A heat pipe is used to thermally connect the spreader and the fins together, which are positioned at opposite sides of the printed circuit board, respectively. Accordingly, the enclosure can help to dissipate the heat generated by the electronic device.

摘要翻译： 散热系统用于散发由安装在印刷电路板上的电子装置产生的热量。 散热系统包括适于在其中接收电子设备的外壳，外壳具有安装有印刷电路板的基板。 适于接触外壳中的电子设备的吊具。 设置在印刷电路板和基板之间的多个翅片，散热片与基板热接合。 热管用于将扩散器和翅片热连接在一起，这些分别位于印刷电路板的相对侧。 因此，外壳可以帮助消散电子设备产生的热量。

公开(公告)号：US07292444B1

公开(公告)日：2007-11-06

申请号：US11309819

申请日：2006-10-03

申请人： Bo-Yong Yang ,  Yong-Dong Chen ,  Guang Yu ,  Shih-Hsun Wung ,  Chun-Chi Chen

发明人： Bo-Yong Yang ,  Yong-Dong Chen ,  Guang Yu ,  Shih-Hsun Wung ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  H01L23/34 ,  A41F1/00 ,  F28F7/00

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  Y10T24/44026 ,  H01L2924/00

摘要： A heat sink fastener includes a main body, a piercing member and a wire clip. The main body includes a pressing part for holding a heat sink in contact with a heat-generating component, an engaging part and a latching leg; the engaging part and the latching leg are disposed at opposing ends of the pressing part. The piercing member includes a piercing body extending through the engaging part of the main body and a tubular part and a hook. The wire clip includes a pivot shaft pivotally connected with the tubular part of the piercing member, a locking leg for fastening to the main body and a lever interconnecting the pivot shaft and the locking leg together, wherein the lever is rotatable to change the positional relationship between the piercing member and the engaging part of the main body.

摘要翻译： 散热器紧固件包括主体，穿孔构件和线夹。 主体包括用于保持与发热部件，接合部和闩锁腿接触的散热器的按压部分; 接合部和锁定腿设置在按压部的相对端。 穿刺构件包括延伸穿过主体的接合部分的穿孔体和管状部分和钩。 电线夹包括与穿刺构件的管状部分枢转地连接的枢轴，用于紧固到主体的锁定腿和将枢转轴和锁定腿相互连接在一起的杠杆，其中杠杆可旋转以改变位置关系 在穿刺构件和主体的接合部之间。

公开(公告)号：US07215550B1

公开(公告)日：2007-05-08

申请号：US11308254

申请日：2006-03-14

申请人： Bo-Yong Yang ,  Yong-Dong Chen ,  Guang Yu ,  Shih-Hsun Wung ,  Chun-Chi Chen

发明人： Bo-Yong Yang ,  Yong-Dong Chen ,  Guang Yu ,  Shih-Hsun Wung ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  Y10T24/44034 ,  H01L2924/00

摘要： A heat sink fastener includes a main body, a piercing body and an operating member. The main body includes a pressing part adapted for pressing a heat sink toward a heat-generating component, an engaging part and a latching leg, the engaging part and the latching leg being disposed at opposite ends of the pressing part. The piercing body includes a piercing part piercing through the engaging part and movable up and down in the engaging part, and a latching part below the piercing part and facing the latching leg. The operating member is connected to the piercing part and linearly movable along a direction perpendicular to the engaging part to put the pressing part in tension by exerting a force on the engaging part or to relax the tension by relieving the force exerted on the engaging part.

摘要翻译： 散热器紧固件包括主体，穿孔体和操作构件。 主体包括适于将散热器朝向发热部件按压挤压部分，接合部分和闩锁腿部，所述接合部分和闩锁腿设置在按压部分的相对端。 穿刺体包括穿过接合部分并且在接合部分中上下移动的刺穿部分，以及穿刺部分下方并且面向锁定腿部的闩锁部分。 操作构件连接到穿刺部分并且可以沿着垂直于接合部分的方向线性移动，以通过施加在接合部分上的力来使按压部分处于张紧状态，或者通过减轻施加在接合部分上的力来松弛张力。

公开(公告)号：US20070183124A1

公开(公告)日：2007-08-09

申请号：US11307445

申请日：2006-02-08

申请人： Shih-Hsun Wung ,  Chun-Chi Chen ,  Tsung-Lung Lee ,  Bao-Chun Chen

发明人： Shih-Hsun Wung ,  Chun-Chi Chen ,  Tsung-Lung Lee ,  Bao-Chun Chen

IPC分类号： G06F1/16

CPC分类号： G06F1/184

摘要： A computer chassis compatible with an ATX motherboard and a BTX motherboard, includes a motherboard holder (100) for mounting an ATX motherboard or a BTX motherboard thereon, a first back panel (200) designed for the ATX motherboard, and a second back panel (300) designed for the BTX motherboard. A side panel (840) is located opposite the motherboard holder, defining a plurality of vents (842) in a lower portion of the side panel. The motherboard holder, the first and second back panels are available in two arrangements to make the computer chassis in accordance with the preferred embodiment of the present invention to be adapted to the ATX motherboard or the BTX motherboard.

摘要翻译： 与ATX主板和BTX主板兼容的计算机机箱包括用于在其上安装ATX主板或BTX主板的主板架（100），为ATX主板设计的第一后面板（200）和第二后面板（ 300）为BTX主板设计。 侧板（840）位于母板支架的对面，在侧板的下部限定多个通风口（842）。 主板支架，第一和第二后面板有两种布置，使得根据本发明的优选实施例的计算机机箱适合于ATX主板或BTX主板。