公开(公告)号：US20070183124A1

公开(公告)日：2007-08-09

申请号：US11307445

申请日：2006-02-08

申请人： Shih-Hsun Wung ,  Chun-Chi Chen ,  Tsung-Lung Lee ,  Bao-Chun Chen

发明人： Shih-Hsun Wung ,  Chun-Chi Chen ,  Tsung-Lung Lee ,  Bao-Chun Chen

IPC分类号： G06F1/16

CPC分类号： G06F1/184

摘要： A computer chassis compatible with an ATX motherboard and a BTX motherboard, includes a motherboard holder (100) for mounting an ATX motherboard or a BTX motherboard thereon, a first back panel (200) designed for the ATX motherboard, and a second back panel (300) designed for the BTX motherboard. A side panel (840) is located opposite the motherboard holder, defining a plurality of vents (842) in a lower portion of the side panel. The motherboard holder, the first and second back panels are available in two arrangements to make the computer chassis in accordance with the preferred embodiment of the present invention to be adapted to the ATX motherboard or the BTX motherboard.

摘要翻译： 与ATX主板和BTX主板兼容的计算机机箱包括用于在其上安装ATX主板或BTX主板的主板架（100），为ATX主板设计的第一后面板（200）和第二后面板（ 300）为BTX主板设计。 侧板（840）位于母板支架的对面，在侧板的下部限定多个通风口（842）。 主板支架，第一和第二后面板有两种布置，使得根据本发明的优选实施例的计算机机箱适合于ATX主板或BTX主板。

公开(公告)号：US07286357B2

公开(公告)日：2007-10-23

申请号：US11164534

申请日：2005-11-29

申请人： Shih-Hsun Wung ,  Chun-Chi Chen ,  Bao-Chun Chen

发明人： Shih-Hsun Wung ,  Chun-Chi Chen ,  Bao-Chun Chen

IPC分类号： H05K7/20

CPC分类号： G06F1/20 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A computer system includes a casing, a motherboard, a CPU mounted on the motherboard and a cooling device. The casing includes a pair of parallel panels. Air inlets and air outlets are respectively defined in the parallel panels and oriented toward each other. The motherboard is parallelly positioned between the parallel panels. The cooling device has a base portion contacting the CPU, a heat dissipation portion defining a plurality of channels communicating with the air outlets, at least one heat pipe thermally connecting the heat dissipation portion to the base portion, and a fan communicating with the air inlets and the channels.

摘要翻译： 计算机系统包括壳体，母板，安装在母板上的CPU和冷却装置。 壳体包括一对平行板。 空气入口和出气口分别定义在平行面板上并相互朝向。 主板平行地位于平行板之间。 冷却装置具有接触CPU的基部，限定与空气出口连通的多个通道的散热部，至少一个将散热部热连接到基部的热管，以及与空气入口连通的风扇 和频道。

公开(公告)号：US20070121296A1

公开(公告)日：2007-05-31

申请号：US11164534

申请日：2005-11-29

申请人： Shih-Hsun Wung ,  Chun-Chi Chen ,  Bao-Chun Chen

发明人： Shih-Hsun Wung ,  Chun-Chi Chen ,  Bao-Chun Chen

IPC分类号： H05K7/20

CPC分类号： G06F1/20 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A computer system includes a casing, a motherboard, a CPU mounted on the motherboard and a cooling device. The casing includes a pair of parallel panels. Air inlets and air outlets are respectively defined in the parallel panels and oriented toward each other. The motherboard is parallelly positioned between the parallel panels. The cooling device has a base portion contacting the CPU, a heat dissipation portion defining a plurality of channels communicating with the air outlets, at least one heat pipe thermally connecting the heat dissipation portion to the base portion, and a fan communicating with the air inlets and the channels.

摘要翻译： 计算机系统包括壳体，母板，安装在母板上的CPU和冷却装置。 壳体包括一对平行板。 空气入口和出气口分别定义在平行面板中并相互朝向。 主板平行地位于平行板之间。 冷却装置具有接触CPU的基部，限定与空气出口连通的多个通道的散热部，至少一个将散热部热连接到基部的热管，以及与空气入口连通的风扇 和频道。

公开(公告)号：US07487825B2

公开(公告)日：2009-02-10

申请号：US11309932

申请日：2006-10-31

申请人： Guang Yu ,  Yong-Dong Chen ,  Shih-Hsun Wung ,  Chun-Chi Chen

发明人： Guang Yu ,  Yong-Dong Chen ,  Shih-Hsun Wung ,  Chun-Chi Chen

IPC分类号： F28D15/00 ,  H05K7/20

CPC分类号： B23P15/26 ,  B23P2700/09 ,  B23P2700/10 ,  F28D15/0275 ,  H01L23/367 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49378 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink (10) and a first heat pipe (20) enclosing a bottom edge of the heat sink. The heat sink includes a base (12) defining a first passage (120) extending therethrough. The first heat pipe includes a first transferring section (22) extending in the first passage and totally embedded in the base and a pair of first dissipating sections (24) extending from the first transferring section. The first dissipating sections of the first heat pipe are attached on an outer periphery of the base. The first transferring section of the first heat pipe absorbs heat in the middle of the base and transfers it to the first dissipating sections to evenly distribute the heat throughout the whole base.

摘要翻译： 散热装置包括散热器（10）和封装散热器底部边缘的第一热管（20）。 散热器包括限定从其延伸穿过的第一通道（120）的基座（12）。 第一热管包括在第一通道中延伸并完全嵌入基座的第一传递部分（22）和从第一传送部分延伸的一对第一散热部分（24）。 第一热管的第一散热部分附接在基部的外周。 第一热管的第一传送部分吸收基部中部的热量并将其传递到第一散热部分以在整个基部均匀分布热量。

公开(公告)号：US07447035B2

公开(公告)日：2008-11-04

申请号：US11566015

申请日：2006-12-01

申请人： Jin-Biao Liu ,  Guang Yu ,  Shih-Hsun Wung ,  Chun-Chi Chen

发明人： Jin-Biao Liu ,  Guang Yu ,  Shih-Hsun Wung ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H01L23/4006 ,  H01L23/3672 ,  H01L23/427 ,  H01L2023/4056 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device assembly is mounted on a printed circuit board (80). First and second electronic components (82, 84) are mounted on the printed circuit board. The heat dissipation device assembly includes a first heat sink (10) in thermal contact with the first electronic component, and a second heat sink (20) in thermal contact with the second electronic component. A spring tab (24) is sandwiched between the first and second heat sinks for providing spring force between the first and second heat sinks thus securely mounting the second heat sink on the second electronic component.

摘要翻译： 散热装置组件安装在印刷电路板（80）上。 第一和第二电子部件（82,84）安装在印刷电路板上。 散热装置组件包括与第一电子部件热接触的第一散热器（10）和与第二电子部件热接触的第二散热器（20）。 在第一和第二散热器之间夹有弹簧片（24），以在第一和第二散热器之间提供弹簧力，从而将第二散热器牢固地安装在第二电子部件上。

公开(公告)号：US07414841B2

公开(公告)日：2008-08-19

申请号：US11307011

申请日：2006-01-19

申请人： Chun-Chi Chen ,  Shih-Hsun Wung ,  Guang Yu ,  Da-Yuan Zhou ,  Jin-Biao Liu

发明人： Chun-Chi Chen ,  Shih-Hsun Wung ,  Guang Yu ,  Da-Yuan Zhou ,  Jin-Biao Liu

IPC分类号： H05K7/20 ,  H05K5/00 ,  F28D15/00

CPC分类号： G06F1/20 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device in a computer enclosure includes a heat spreader (20) mounted on a CPU (12), a first heat sink (30), a cooling fan (40) coupled to the first heat sink, a second heat sink (50), a heat pipe (80) mounted on the heat spreader and thermally connected the first heat sink and the second heat sink, a system fan (60) attached to the second heat sink, and a fan duct (70) interconnected between the cooling fan and the second heat sink. The system fan is positioned adjacent to louvers of the computer enclosure. An airflow generated by the cooling fan and the system fan flows through the first heat sink, then the fan duct, the second heat sink, and finally the louvers to leave the computer enclosure.

摘要翻译： 计算机外壳中的散热装置包括安装在CPU（12）上的散热器（20），第一散热器（30），耦合到第一散热器的冷却风扇（40），第二散热器（50） ），安装在所述散热器上并热连接所述第一散热器和所述第二散热器的热管（80），附接到所述第二散热器的系统风扇（60）和在所述冷却 风扇和第二个散热器。 系统风扇位于计算机外壳的百叶窗附近。 由冷却风扇和系统风扇产生的气流流过第一散热器，然后流过风扇导管，第二散热器，最后通风百叶窗离开电脑外壳。

公开(公告)号：US20070263355A1

公开(公告)日：2007-11-15

申请号：US11309837

申请日：2006-10-09

申请人： Guang Yu ,  Da-Yuan Zhou ,  Shih-Hsun Wung ,  Chun-Chi Chen

发明人： Guang Yu ,  Da-Yuan Zhou ,  Shih-Hsun Wung ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation system is used for dissipating heat generated by an electronic device. The heat dissipation system includes a computer enclosure containing the electronic device therein. The computer enclosure has a heat dissipating member formed thereon. A base contacts the electronic device in the computer enclosure. At least a heat pipe includes a first end thermally engaged in at least a groove defined in the base and a second end thermally contacting the computer enclosure. A heat sink is mounted on the base and thermally connects with the base and the first end of the at least a heat pipe.

摘要翻译： 散热系统用于散发由电子设备产生的热量。 散热系统包括其中包含电子设备的计算机外壳。 计算机外壳具有形成在其上的散热构件。 基座接触电脑机箱中的电子设备。 至少热管包括热接合在限定在基部中的至少一个凹槽中的第一端和与该计算机外壳热接触的第二端。 散热器安装在基座上并与基座和至少一个热管的第一端热连接。

公开(公告)号：US20060273137A1

公开(公告)日：2006-12-07

申请号：US11308383

申请日：2006-03-20

申请人： Chun-Chi Chen ,  Shih-Hsun Wung ,  Guang Yu ,  Da-Yuan Zhou ,  Jin-Biao Liu

发明人： Chun-Chi Chen ,  Shih-Hsun Wung ,  Guang Yu ,  Da-Yuan Zhou ,  Jin-Biao Liu

IPC分类号： A47J36/02

CPC分类号： H01L23/4006 ,  H01L23/427 ,  H01L2023/4056 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device comprises a seat for absorbing heat from a heat generating device. At least a heat pipe has a first section thereof thermally combined to the seat, and two second sections thereof extending from the first section and remotely from the seat. Pluralities of heat sinks are located on the seat. Each of the pluralities of heat sinks has a base and a plurality of fins integrally extending from the base and is made of aluminum extrusion. The bases of the heat sinks thermally sandwich the two second sections of the at least a heat pipe therebetween. At least one of the bases of the heat sinks is angled or perpendicular to the seat.

摘要翻译： 散热装置包括用于从发热装置吸收热量的座。 至少一个热管具有与座椅热结合的第一部分，并且其第二部分从第一部分延伸并远离座椅。 多个散热片位于座椅上。 多个散热器中的每一个具有基部和从基部一体地延伸并由铝挤压制成的多个翅片。 散热器的基部将其中的至少一个热管的两个第二部分热夹心。 散热器的至少一个基座成角度或垂直于座椅。

公开(公告)号：US07802616B2

公开(公告)日：2010-09-28

申请号：US11757196

申请日：2007-06-01

申请人： Yong-Dong Chen ,  Guang Yu ,  Shih-Hsun Wung ,  Chun-Chi Chen

发明人： Yong-Dong Chen ,  Guang Yu ,  Shih-Hsun Wung ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/12 ,  F28F3/02 ,  F28F2215/10 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation apparatus adapted for removing heat from a heat-generating electronic component, includes a conducting core, a plurality of conducting arms, a plurality of fins and a heat pipe assembly. The conducting core comprises a heat-absorbing portion contacting with the heat-generating electronic component. The conducting arms extend radially and outwardly from the conducting core. The fins extend outwardly from the respective conducting arms. Each of the heat pipes comprises an evaporating section thermally attached to the heat-absorbing portion of the conducting core and at least one condensing section thermally coupled to the respective conducting arm.

摘要翻译： 一种用于从发热电子部件除去热量的散热装置，包括导电芯，多个导电臂，多个翅片和热管组件。 导电芯包括与发热电子部件接触的吸热部。 导电臂从导电芯径向和向外延伸。 翅片从相应的导电臂向外延伸。 每个热管包括热连接到导电芯的吸热部分的蒸发部分和至少一个热连接到相应导电臂的冷凝部分。

公开(公告)号：US07495920B2

公开(公告)日：2009-02-24

申请号：US11614766

申请日：2006-12-21

申请人： Yong-Dong Chen ,  Guang Yu ,  Shih-Hsun Wung ,  Chun-Chi Chen

发明人： Yong-Dong Chen ,  Guang Yu ,  Shih-Hsun Wung ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  H01L23/36

CPC分类号： H01L23/467 ,  F28F2215/00 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device is used for dissipating heat from a CPU and electronic components. The heat dissipation device includes a heat absorbing portion for absorbing heat from the CPU, and a heat sink located on the heat absorbing portion. The heat sink includes a plurality of curved fins defining a plurality of curved passages therebetween. An airflow source is located adjacent to the heat sink for providing forced airflow to the heat sink. A direction of the airflow from the airflow source is changed when it passes through the passages. A direction of the airflow out of the passages is perpendicular to a direction of the airflow into the passages. The airflow out of the heat sink further flows to the electronic components located adjacent to the CPU.

摘要翻译： 散热装置用于散发来自CPU和电子元件的热量。 散热装置包括用于从CPU吸收热量的吸热部分和位于吸热部分上的散热器。 散热器包括多个在其间限定多个弯曲通道的弯曲翅片。 气流源位于散热器附近，以向散热器提供强制气流。 来自气流源的气流的方向在通过通路时发生变化。 从通道出来的气流的方向垂直于进入通道的气流的方向。 从散热器出来的气流进一步流向位于CPU附近的电子部件。