摘要:
A shared AMP includes: a transmission/reception processor section (TRX-B) for a second mobile communication system configured to perform frequency conversion processing on an inputted transmission baseband signal for a mobile communication system B, and to output a transmission radio frequency signal for the second mobile communication system; a power level adjuster section (VA) configured to adjust a power level of an inputted transmission radio frequency signal for a first mobile communication system; a combiner section (COM) configured to generate a transmission radio frequency signal, by combining the transmission radio frequency signal for the first mobile communication system outputted from the power level adjuster section (VA) and the transmission radio frequency signal for the second mobile communication system outputted from the transmission/reception processor section (TRX-B) for the second mobile communication system; and a common amplifier section (PA) configured to amplify a power level of the transmission radio frequency signal outputted from the combiner section (COM) at a predetermined amplification rate, and to output the resultant signal.
摘要:
An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.
摘要:
A shared AMP includes: a transmission/reception processor section (TRX-B) for a second mobile communication system configured to perform frequency convers ion processing on an inputted transmission baseband signal for a mobile communication system B, and to output a transmission radio frequency signal for the second mobile communication system; a power level adjuster section (VA) configured to adjust a power level of an inputted transmission radio frequency signal for a first mobile communication system; a combiner section (COM) configured to generate a transmission radio frequency signal, by combining the transmission radio frequency signal for the first mobile communication system outputted from the power level adjuster section (VA) and the transmission radio frequency signal for the second mobile communication system outputted from the transmission/reception processor section (TRX-B) for the second mobile communication system; and a common amplifier section (PA) configured to amplify a power level of the transmission radio frequency signal outputted from the combiner section (COM) at a predetermined amplification rate, and to output the resultant signal.
摘要:
A coplanar resonator which is comprised of a dielectric substrate, a center conductor formed in the surface thereof, and a ground conductor formed so as to surround the same center conductor, wherein the same center conductor is comprised of a main line conductor 31, formed by extension in a rectilinear shape, and auxiliary line conductors 32a and 32b bifurcating from at least one end of the same main line conductor, folding back and being extended on both sides of the main line conductor.
摘要:
A coplanar waveguide resonator (100a) has a center conductor (101) formed on a dielectric substrate (105) that has a line conductor (a center line conductor) (101b) extending in the input/output direction, a ground conductor (103) that is disposed on the dielectric substrate (105) across a gap section from the center conductor (101), and a line conductor (a base stub) (104) formed as an extension line from the ground conductor (103), and a part of the base stub (104) constitutes a line conductor (a first collateral line conductor) (104a) disposed in parallel with the center line conductor (101b).
摘要:
A contactor configured to be electrically connected to the terminals of an electronic component is disclosed. The connector includes multiple contact electrodes contacting the terminals of the electronic component and multiple elastic electrodes each composed of an electrically conductive elastic body. The elastic electrodes generate a pressing force for pressing the contact electrodes against the terminals of the electronic component. The contact electrodes are separable from the elastic electrodes.
摘要:
A signal switching device is disclosed that is capable of transmitting signals with less signal loss while securing a good isolation characteristic. The signal switching device includes a first section formed from a superconducting material connected to a first transmission path. The first section has a smaller cross section at the input end than at the output end or, the signal switching device may include a first section formed from a superconducting material connected to a first transmission path in series, and a second section formed from a superconducting material connected to a second transmission path in parallel. The cross section of the second section is smaller than that of the second transmission path. The length of the second transmission path is determined in such a way that an input impedance of the second transmission path is sufficiently large when the second section is in a superconducting state.
摘要:
An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.
摘要:
Formed on a dielectric substrate 11 are a center conductor 12 having a length L1 which is equivalent in electrical length to one quarter wavelength and ground conductors 13 disposed on the opposite sides of the center conductor with a gap portion therebetween in coplanar manner. The center conductor 12 and the ground conductors 13 located on the opposite sides thereof are connected together by shorting ends 14 resulting in forming corner areas, respectively whereby obtaining a coplanar waveguide resonator, wherein the edge line of the shorting end 14 is recessed to have an arcuate curve configuration so that each corner area has an angle of greater than 90° to reduce power current concentration at the corner points in the respective corner areas.
摘要:
An attachment structure between a semiconductor device socket and a test circuit substrate is provided. The semiconductor device socket includes a socket body and a contact film disposed therein. Extension conductive wires extended from a contact portion to be connected to a semiconductor device are formed on the contact film. The contact film is also provided with socket connectors connected to the extension conductive wires. The test circuit substrate is provided with circuit substrate connectors corresponding to the socket connectors. The socket connectors and the circuit substrate connectors are in a male-female connector relationship.