公开(公告)号：US5251266A

公开(公告)日：1993-10-05

申请号：US873581

申请日：1992-04-21

Applicant: Donald J. Spigarelli ,  John M. DeCarlo

Inventor： Donald J. Spigarelli ,  John M. DeCarlo

IPC: H05K13/08 ,  G06K9/00 ,  B23P19/00 ,  B25J19/00 ,  G02B27/32

CPC classification number: H05K13/08 ,  Y10T29/53091 ,  Y10T29/53178 ,  Y10T29/53261

Abstract: A guidance type placement apparatus for placing and mounting integrated circuit (IC) components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus includes a mechanical positioning subsystem, an image acquisition/processing subsystem, a master control subsystem, and optionally, a heater array subsystem. The mechanical positioning subsystem is sequentially operative to position the circuit board and IC device for the generation of images thereof, to align the IC device with a designated placement site on the board, and to mount the IC device in aligned combination with the board. The image acquisition subsystem is operative to generate images of at least one pair of diagonally opposed corners of the placement site and IC device from the same optical perspective. Images generated by the image acquisition subsystem provide feedback control to regulate the placement process to attain and verify lead-to-pad alignment. The heater array subsystem is utilized to bond the IC device to the circuit board while the mechanical positioning subsystem maintains the IC device in aligned combination with the board.

Abstract translation: 一种用于将集成电路（IC）部件或装置，特别是微型间距集成电路装置（FPD）放置和安装的引导型放置装置，与印刷电路板对齐。 该装置包括机械定位子系统，图像采集/处理子系统，主控制子系统以及可选的加热器阵列子系统。 机械定位子系统依次操作以定位电路板和IC器件以产生其图像，以使IC器件与板上的指定放置位置对准，并将IC器件与板对准地组装。 图像采集子系统可操作以从相同的光学透视图生成放置位置和IC器件的至少一对斜对角的图像。 由图像采集子系统产生的图像提供反馈控制，以调节放置过程以获得和验证引线对焊盘对准。 加热器阵列子系统用于将IC器件连接到电路板，同时机械定位子系统将IC器件与板对齐组合。

公开(公告)号：US5235407A

公开(公告)日：1993-08-10

申请号：US713966

申请日：1991-06-11

Applicant: Donald J. Spigarelli ,  John M. DeCarlo

Inventor： Donald J. Spigarelli ,  John M. DeCarlo

IPC: H05K13/08

CPC classification number: H05K13/08

Abstract: A guidance type placement apparatus for placing and mounting integrated circuit (IC) components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus includes an image acquisition/processing subsystem. The image acquisition subsystem is operative to generate images of at least one pair of diagonally opposed corners of the placement site and IC device from the same optical perspective. Images generated by the image acquisition subsystem provide feedback control to regulate the placement process to attain and verify lead-to-pad alignment.

Abstract translation: 一种用于将集成电路（IC）部件或装置，特别是微型间距集成电路装置（FPD）放置和安装的引导型放置装置，与印刷电路板对齐。 该装置包括图像采集/处理子系统。 图像采集子系统可操作以从相同的光学透视图生成放置位置和IC器件的至少一对斜对角的图像。 由图像采集子系统产生的图像提供反馈控制，以调节放置过程以获得和验证引线对焊盘对准。

公开(公告)号：US4914513A

公开(公告)日：1990-04-03

申请号：US227380

申请日：1988-08-02

Applicant: Donald J. Spigarelli ,  William F. Drislane

Inventor： Donald J. Spigarelli ,  William F. Drislane

IPC: H04N7/18 ,  H05K13/08

CPC classification number: H05K13/08 ,  H04N7/183

Abstract: A system is disclosed for viewing the aligning and soldering of an electrical component to a printed circuit board. The novel system provided the operator with a clear, close up view of the work area allowing the operator to accurately position electrical components on the work surface. Images of different sectors of the work area are received by a viewing device such as a video camera, are processed and electronically transferred to the operator's display terminal. The multiple images are displayed simultaneously on the operator's terminal. By viewing the display terminal, the operator is able to observe simultaneously the critical sectors of the work area while manipulating the electrical component with a pick-and-place head to accurately align and place the component in a pre-determined position.

Abstract translation: 公开了一种用于观察电气部件对印刷电路板的对准和焊接的系统。 该新颖的系统为操作者提供了工作区域的清晰的关闭视图，允许操作者将电气部件精确地定位在工作表面上。 工作区的不同扇区的图像由诸如摄像机的观察装置接收，被处理并电子地传送到操作者的显示终端。 多个图像同时显示在操作员的终端上。 通过观察显示终端，操作者能够同时观察工作区域的关键扇区，同时用拾取头进行电气部件的操作，以精确对准并将组件放置在预定位置。

公开(公告)号：US4775775A

公开(公告)日：1988-10-04

申请号：US62903

申请日：1987-06-16

Applicant: Donald J. Spigarelli ,  Mark Finocchario

Inventor： Donald J. Spigarelli ,  Mark Finocchario

IPC: G05D23/19 ,  H05K3/22 ,  H05K3/34 ,  F24H3/00 ,  H01C1/01 ,  H01C10/14 ,  H05B3/02

CPC classification number: G05D23/1934 ,  H05K3/225 ,  H05K3/3494

Abstract: A programmable heater which can be electronically programmed to provide an intended heat profile and intended heater power for application of heat only to an intended area. The heater is especially adapted for use in electronic circuit board repair systems. The heater comprises a matrix of electrical heater elements arranged in row and column configuration, each element being disposed within a respective tube terminating at a nozzle plane. Individual heater elements are selectively energized and the power applied to the heating elements is controlled to provide an intended heat level. Gas or air is supplied to the heater housing and flows through the tubes and out of the nozzle openings. Only the gas flowing through the tubes containing the energized heating elements is heated to provide a selected heat profile for application to a work surface.

Abstract translation: 可编程加热器，其可以电子编程以提供预期的热分布和预期的加热器功率，以仅将热量施加到预期的区域。 加热器特别适用于电子电路板维修系统。 加热器包括以行和列配置布置的电加热器元件矩阵，每个元件设置在终止于喷嘴平面的相应管中。 单独的加热器元件被选择性地通电，并且控制施加到加热元件的功率以提供预期的热水平。 气体或空气被供应到加热器壳体并流过管并且从喷嘴开口流出。 只有流过包含赋能加热元件的管的气体被加热才能提供选择的热分布，以供应到工作表面。

公开(公告)号：US4697730A

公开(公告)日：1987-10-06

申请号：US872300

申请日：1986-06-09

Applicant: Donald J. Spigarelli ,  Douglas J. Peck ,  James L. Finney

Inventor： Donald J. Spigarelli ,  Douglas J. Peck ,  James L. Finney

IPC: B23K1/015 ,  B23K3/06 ,  B23K3/04

CPC classification number: B23K3/0653 ,  B23K1/015

Abstract: A system for the continuous production soldering of circuit boards and other products in which the product is heated by an independently controlled vapor phase system, and solder applied by a separately controlled application system operative to direct one or more controlled and defined streams of solder onto the product. A vessel is provided for containing a heated saturated inert vapor into which the product is introduced prior to solder application. One or more nozzles are disposed within the vessel for directing one or more streams of molten solder to the heated product. The heating and soldering operations are separately controllable and are each substantially independent of the control of the other.

Abstract translation: 用于连续生产焊接电路板和其它产品的系统，其中产品被独立控制的气相系统加热，以及通过单独控制的应用系统施加的焊料，其可操作地将一个或多个受控和限定的焊料流引导到 产品。 提供容器用于容纳加热的饱和惰性蒸气，在施加焊料之前将产品引入其中。 一个或多个喷嘴设置在容器内，用于将一个或多个熔融焊料流引导到被加热的产品。 加热和焊接操作是可单独控制的，并且各自基本上独立于另一个的控制。

公开(公告)号：US4685605A

公开(公告)日：1987-08-11

申请号：US872370

申请日：1986-06-09

Applicant: Donald J. Spigarelli ,  Douglas J. Peck ,  James L. Finney

Inventor： Donald J. Spigarelli ,  Douglas J. Peck ,  James L. Finney

IPC: B23K1/015 ,  B23K3/06

CPC classification number: B23K1/015 ,  B23K3/0653

Abstract: A system for the continuous production soldering of circuit boards and other products in which the product is heated by an independently controlled vapor phase system, and solder applied by a separately controlled application system operative to direct one or more controlled and defined streams of solder onto the product. A vessel is provided for containing a heated saturated inert vapor into which the product is introduced prior to solder application. One or more nozzles are disposed within the vessel for directing one or more streams of molten solder to the heated product. The heating and soldering operations are separately controllable and are each substantially independent of the control of the other.