Rifamycin derivatives
    23.
    发明授权
    Rifamycin derivatives 有权
    利福霉素衍生物

    公开(公告)号:US07229996B2

    公开(公告)日:2007-06-12

    申请号:US11186187

    申请日:2005-07-21

    CPC分类号: C07D401/12 C07D455/02

    摘要: Novel rifamycin derivatives of formula I (both hydroquinone and corresponding quinone (C1-C4) forms): or their salts, hydrates or prodrugs thereof, wherein: a preferred R comprises hydrogen, acetyl; L is a linker, a preferred linker group elements selected from any combination of 1 to 5 groups shown FIG. 1, provided L is not wherein R1 is H, methyl or alkyl. The inventive compounds exhibit valuable antibiotic properties. Formulations having these compounds can be used in the control or prevention of infectious diseases in mammals, both humans and non-humans. In particular, the compounds exhibit a pronounced antibacterial activity, even against multiresistant strains of microbes.

    摘要翻译: 式I的新型利福霉素衍生物(氢醌和相应的醌(C 1 -C 4))形成):或其盐,水合物或前药,其中:优选的R 包括氢,乙酰基; L是接头,优选的连接基团元素选自1至5个组的任何组合,如图1所示。 1,其中L不是其中R 1是H,甲基或烷基。 本发明化合物显示出有价值的抗生素性质。 具有这些化合物的制剂可以用于控制或预防哺乳动物,包括人和非人的感染性疾病。 特别地,这些化合物甚至显示出显着的抗菌活性,即使是针对多抗菌菌株的微生物。

    Singulation method used in image sensor packaging process and support for use therein
    24.
    发明申请
    Singulation method used in image sensor packaging process and support for use therein 有权
    图像传感器封装过程中使用的分割方法和其中使用的支持

    公开(公告)号:US20060063357A1

    公开(公告)日:2006-03-23

    申请号:US10944197

    申请日:2004-09-20

    IPC分类号: H01L21/78 H01L21/50

    摘要: A singulation method used in a process for making a plurality of image sensor packages is disclosed. Firstly, a semi-finished product including a plurality of package structures formed on a substrate is placed on a support having a plurality of cavities for receiving the package structures. Then, the semi-finished product is sawed into separate image sensor packages. During the sawing step, the air pressure in the cavities is decreased to create suction within the cavities such that the support abuts against at least a portion of the housing of each package structure with a gap between the transparent component and the support whereby the package structures are positioned precisely and clamped in place with the support during the sawing step.

    摘要翻译: 公开了一种用于制造多个图像传感器封装的工艺中的分割方法。 首先,将包括形成在基板上的多个封装结构的半成品放置在具有用于接收封装结构的多个空腔的支撑件上。 然后,半成品被锯成单独的图像传感器包装。 在锯切步骤期间,空腔中的空气压力减小以在空腔内产生吸力,使得支撑件抵靠每个包装结构的壳体的至少一部分,在透明部件和支撑件之间具有间隙,由此包装结构 在锯切步骤期间精确地定位并且与支撑件夹紧就位。