WIRELESS ACTUATOR CIRCUIT FOR WIRELESS ACTUATION OF MICRO ELECTROMECHANICAL SYSTEM SWITCH FOR MAGNETIC RESONANCE IMAGING
    21.
    发明申请
    WIRELESS ACTUATOR CIRCUIT FOR WIRELESS ACTUATION OF MICRO ELECTROMECHANICAL SYSTEM SWITCH FOR MAGNETIC RESONANCE IMAGING 有权
    无线执行器无线致动器电路用于磁共振成像的微机电系统开关

    公开(公告)号:US20160047869A1

    公开(公告)日:2016-02-18

    申请号:US14459352

    申请日:2014-08-14

    CPC classification number: G01R33/3692 G01R33/3657 H01H9/54

    Abstract: A wireless actuator circuit configured to actuate a micro electromechanical system (MEMS) switch is provided. The wireless actuator circuit includes a transmitter portion and a receiver portion operatively coupled to the transmitter portion. The transmitter portion includes an oscillator device configured to generate a signal at a determined frequency and a first antenna operatively coupled to the oscillator device to receive a modulated signal. Further, the receiver portion includes a second antenna configured to receive the modulated signal from the transmitter portion, a radio frequency power detector configured to detect the modulated signal and a comparator configured to produce a control signal in response to the modulated signal detected by the radio frequency power detector to toggle the MEMS switch.

    Abstract translation: 提供了一种构造成致动微机电系统(MEMS)开关的无线致动器电路。 无线致动器电路包括可操作地耦合到发射器部分的发射器部分和接收器部分。 发射机部分包括被配置为产生确定频率的信号的振荡器装置和可操作地耦合到振荡器装置以接收调制信号的第一天线。 此外,接收器部分包括被配置为从发送器部分接收调制信号的第二天线,被配置为检测调制信号的射频功率检测器和被配置为响应于由无线电装置检测到的调制信号产生控制信号的比较器 频率功率检测器来切换MEMS开关。

    Systems and methods for inspecting reinforced concrete structures
    22.
    发明授权
    Systems and methods for inspecting reinforced concrete structures 有权
    钢筋混凝土结构检查系统和方法

    公开(公告)号:US09194819B2

    公开(公告)日:2015-11-24

    申请号:US14063526

    申请日:2013-10-25

    CPC classification number: G01N22/02 G01M7/04 G01N29/07 G01N29/265 G01N33/383

    Abstract: An inspection system for a metal-reinforced concrete structure is described. The system includes a radio frequency (RF) system configured to be movable with respect to a surface of the concrete structure while transmitting radio signals into the interior of the structure, and receiving reflected radio signals. The system also includes a processor configured to process the reflected radio signals, so as to obtain a focused image of the reinforcement in at least one selected region within the concrete structure. The image corresponds to the physical condition of the reinforcement. A method for determining the condition of a reinforced concrete structure is also described, utilizing the inspection system.

    Abstract translation: 描述了一种用于金属钢筋混凝土结构的检查系统。 该系统包括射频(RF)系统,其配置成相对于混凝土结构的表面可移动,同时将无线电信号传送到结构的内部,并且接收反射的无线电信号。 该系统还包括配置成处理反射的无线电信号的处理器,以便在混凝土结构内的至少一个选定区域中获得加强件的聚焦图像。 图像对应于加固的物理条件。 还描述了一种用于确定钢筋混凝土结构状况的方法,利用检查系统。

    PASSIVE WIRELESS SENSORS
    23.
    发明申请
    PASSIVE WIRELESS SENSORS 有权
    被动无线传感器

    公开(公告)号:US20150312654A1

    公开(公告)日:2015-10-29

    申请号:US14264074

    申请日:2014-04-29

    Abstract: A passive wireless sensor having a plurality of dielectric layers, an antenna, a diaphragm, and a feeding element is provided. Further, the antenna is disposed in at least a portion of a cavity formed by one or more dielectric layers of the plurality of dielectric layers. Moreover, the diaphragm is disposed on the cavity. Additionally, the feeding element is disposed in at least a portion of the plurality of dielectric layers. Also, the feeding element is operatively coupled to the antenna.

    Abstract translation: 提供了具有多个电介质层的无源无线传感器,天线,隔膜和馈电元件。 此外,天线设置在由多个电介质层的一个或多个电介质层形成的空腔的至少一部分中。 此外,隔膜设置在空腔上。 另外,馈电元件设置在多个电介质层的至少一部分中。 而且,馈电元件可操作地耦合到天线。

    Sensor system and method
    24.
    发明授权

    公开(公告)号:US11079359B2

    公开(公告)日:2021-08-03

    申请号:US16720471

    申请日:2019-12-19

    Abstract: A system includes a structure bonding layer and a sensor. The structure bonding layer is disposed on a structure. The structure bonding layer is a metallic alloy. The sensor includes a non-metallic wafer and a sensor bonding layer disposed on a surface of the non-metallic wafer. The sensor bonding layer is a metallic alloy. The sensor bonding layer is coupled to the structure bonding layer via a metallic joint, and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.

    Sensor system for a rotor assembly
    25.
    发明授权

    公开(公告)号:US10996082B2

    公开(公告)日:2021-05-04

    申请号:US16445577

    申请日:2019-06-19

    Abstract: A sensor system includes a rotor antenna, a radio frequency (RF) sensor, a stator antenna, and one or more processors. The rotor antenna and the RF sensor are configured to be disposed on a shaft of a rotor assembly and are conductively connected to each other. The RF sensor generates measurement signals. The stator antenna is mounted to a stator member of the rotor assembly and positioned radially outward from the rotor antenna. The stator antenna is wirelessly connected to the rotor antenna across an air gap. The one or more processors are communicatively connected to the stator antenna and are configured to monitor one or more electrical characteristics of the measurement signals that are received by the stator antenna from the rotor antenna over time as the shaft rotates and to determine rotational speed of the shaft based on recurrent variations in the one or more electrical characteristics.

    SYSTEMS AND METHODS FOR SAW WAFER LEVEL ASSEMBLY WITH TOP SIDE CONTACTS

    公开(公告)号:US20210013866A1

    公开(公告)日:2021-01-14

    申请号:US16509554

    申请日:2019-07-12

    Abstract: A wafer level assembly is disclosed. The wafer level assembly includes a device wafer, and a plurality of electrodes disposed on the device wafer, wherein the device wafer the plurality of electrodes form a surface acoustic wave (SAW) device, a plurality of device pads disposed on the device wafer, wherein each of the plurality of electrodes are coupled to one of the device pads, a cap wafer coupled to the device wafer through a seal layer, the cap wafer having a plurality of contact pads and a plurality of interconnect pads integral with a surface of the cap wafer, wherein each of the plurality of contact pads is coupled to one of the plurality of interconnect pads, and a plurality of conductive interconnects, wherein each of the plurality of conductive interconnects is coupled between one of the plurality of device pads and one of the plurality of interconnect pads.

    Wireless monitoring system for rotary machines

    公开(公告)号:US10677088B2

    公开(公告)日:2020-06-09

    申请号:US15078344

    申请日:2016-03-23

    Abstract: A monitoring system for monitoring environmental conditions for rotary members includes a plurality of stationary reader antennas positioned proximate rotary members. A first sensor is coupled to a first rotary member and a second sensor is coupled to a second rotary member. Each sensor is configured to generate environmental condition data. A key phasor is coupled to a third rotary member and configured to generate key phasor data. The monitoring system also includes a data integrator communicatively coupled to each stationary reader antenna and configured to determine measurement values for the first and second environmental condition based on raw data from each stationary reader antennas and data from the key phasor.

    Process for fabricating printed circuit assembly and printed circuit assembly thereof

    公开(公告)号:US10537024B2

    公开(公告)日:2020-01-14

    申请号:US15883664

    申请日:2018-01-30

    Abstract: A process for fabricating a printed circuit assembly is presented. The process includes providing a first base substrate having a first surface and a second surface opposite to the first surface; providing a flexible circuit layer including a first region having a first set of signal traces and a second region having a second set of signal traces, wherein the first region and the second region are separated by a first intermediate region; disposing the first region of the flexible circuit layer on the first surface of the first base substrate; bending the flexible circuit layer at the first intermediate region to surround a thickness side of the first base substrate; and disposing the second region of the flexible circuit layer on the second surface of the first base substrate. A printed circuit assembly is also presented.

    TRUE TIME DELAY BEAM FORMER MODULE AND METHOD OF MAKING THE SAME

    公开(公告)号:US20190115658A1

    公开(公告)日:2019-04-18

    申请号:US15782991

    申请日:2017-10-13

    Abstract: A beam former module includes a package base and an interconnect structure formed within the package base. The beam former module also includes a first true time delay (TTD) module attached to the package base. The first TTD module includes a plurality of switching elements configured to define a signal transmission path between a signal input and a signal output of the first TTD module by selectively activating a plurality of time delay lines. The signal input and the signal output of the first TTD module are electrically coupled to the interconnect structure. In some embodiments, the interconnect structure includes at least one TTD meander line and at least one of the time delay lines of the first TTD module is electrically coupled to the at least one TTD meander line.

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