Abstract:
A wireless actuator circuit configured to actuate a micro electromechanical system (MEMS) switch is provided. The wireless actuator circuit includes a transmitter portion and a receiver portion operatively coupled to the transmitter portion. The transmitter portion includes an oscillator device configured to generate a signal at a determined frequency and a first antenna operatively coupled to the oscillator device to receive a modulated signal. Further, the receiver portion includes a second antenna configured to receive the modulated signal from the transmitter portion, a radio frequency power detector configured to detect the modulated signal and a comparator configured to produce a control signal in response to the modulated signal detected by the radio frequency power detector to toggle the MEMS switch.
Abstract:
An inspection system for a metal-reinforced concrete structure is described. The system includes a radio frequency (RF) system configured to be movable with respect to a surface of the concrete structure while transmitting radio signals into the interior of the structure, and receiving reflected radio signals. The system also includes a processor configured to process the reflected radio signals, so as to obtain a focused image of the reinforcement in at least one selected region within the concrete structure. The image corresponds to the physical condition of the reinforcement. A method for determining the condition of a reinforced concrete structure is also described, utilizing the inspection system.
Abstract:
A passive wireless sensor having a plurality of dielectric layers, an antenna, a diaphragm, and a feeding element is provided. Further, the antenna is disposed in at least a portion of a cavity formed by one or more dielectric layers of the plurality of dielectric layers. Moreover, the diaphragm is disposed on the cavity. Additionally, the feeding element is disposed in at least a portion of the plurality of dielectric layers. Also, the feeding element is operatively coupled to the antenna.
Abstract:
A system includes a structure bonding layer and a sensor. The structure bonding layer is disposed on a structure. The structure bonding layer is a metallic alloy. The sensor includes a non-metallic wafer and a sensor bonding layer disposed on a surface of the non-metallic wafer. The sensor bonding layer is a metallic alloy. The sensor bonding layer is coupled to the structure bonding layer via a metallic joint, and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.
Abstract:
A sensor system includes a rotor antenna, a radio frequency (RF) sensor, a stator antenna, and one or more processors. The rotor antenna and the RF sensor are configured to be disposed on a shaft of a rotor assembly and are conductively connected to each other. The RF sensor generates measurement signals. The stator antenna is mounted to a stator member of the rotor assembly and positioned radially outward from the rotor antenna. The stator antenna is wirelessly connected to the rotor antenna across an air gap. The one or more processors are communicatively connected to the stator antenna and are configured to monitor one or more electrical characteristics of the measurement signals that are received by the stator antenna from the rotor antenna over time as the shaft rotates and to determine rotational speed of the shaft based on recurrent variations in the one or more electrical characteristics.
Abstract:
A wafer level assembly is disclosed. The wafer level assembly includes a device wafer, and a plurality of electrodes disposed on the device wafer, wherein the device wafer the plurality of electrodes form a surface acoustic wave (SAW) device, a plurality of device pads disposed on the device wafer, wherein each of the plurality of electrodes are coupled to one of the device pads, a cap wafer coupled to the device wafer through a seal layer, the cap wafer having a plurality of contact pads and a plurality of interconnect pads integral with a surface of the cap wafer, wherein each of the plurality of contact pads is coupled to one of the plurality of interconnect pads, and a plurality of conductive interconnects, wherein each of the plurality of conductive interconnects is coupled between one of the plurality of device pads and one of the plurality of interconnect pads.
Abstract:
A monitoring system for monitoring environmental conditions for rotary members includes a plurality of stationary reader antennas positioned proximate rotary members. A first sensor is coupled to a first rotary member and a second sensor is coupled to a second rotary member. Each sensor is configured to generate environmental condition data. A key phasor is coupled to a third rotary member and configured to generate key phasor data. The monitoring system also includes a data integrator communicatively coupled to each stationary reader antenna and configured to determine measurement values for the first and second environmental condition based on raw data from each stationary reader antennas and data from the key phasor.
Abstract:
A true time delay (TTD) module includes a substrate and a transmission line formed on the substrate. The transmission line includes time delay lines that define signal paths of varying lengths between a signal input and a signal output of the TTD module. A plurality of switching elements are positioned along the transmission line and are selectively controllable to define a signal transmission path between the signal input and the signal output. The switching elements include an input switching element positioned at a first end of each of the plurality of time delay lines, an output switching element positioned at a second end of each of the plurality of time delay lines, and at least one intermediate switching element positioned between the input switching element and the output switching element of at least one of the plurality of time delay lines.
Abstract:
A process for fabricating a printed circuit assembly is presented. The process includes providing a first base substrate having a first surface and a second surface opposite to the first surface; providing a flexible circuit layer including a first region having a first set of signal traces and a second region having a second set of signal traces, wherein the first region and the second region are separated by a first intermediate region; disposing the first region of the flexible circuit layer on the first surface of the first base substrate; bending the flexible circuit layer at the first intermediate region to surround a thickness side of the first base substrate; and disposing the second region of the flexible circuit layer on the second surface of the first base substrate. A printed circuit assembly is also presented.
Abstract:
A beam former module includes a package base and an interconnect structure formed within the package base. The beam former module also includes a first true time delay (TTD) module attached to the package base. The first TTD module includes a plurality of switching elements configured to define a signal transmission path between a signal input and a signal output of the first TTD module by selectively activating a plurality of time delay lines. The signal input and the signal output of the first TTD module are electrically coupled to the interconnect structure. In some embodiments, the interconnect structure includes at least one TTD meander line and at least one of the time delay lines of the first TTD module is electrically coupled to the at least one TTD meander line.