公开(公告)号：US06805282B2

公开(公告)日：2004-10-19

申请号：US10148014

申请日：2002-05-24

申请人： Yasuji Kawashima ,  Kenichiro Suetsugu ,  Shunji Hibino ,  Hiroaki Takano ,  Tatsuo Okuji ,  Shoshi Kabashima ,  Yukio Maeda ,  Mikiya Nakata

发明人： Yasuji Kawashima ,  Kenichiro Suetsugu ,  Shunji Hibino ,  Hiroaki Takano ,  Tatsuo Okuji ,  Shoshi Kabashima ,  Yukio Maeda ,  Mikiya Nakata

IPC分类号： H05K334

CPC分类号： B23K1/0016 ,  B23K1/012 ,  B23K1/085 ,  B23K1/203 ,  B23K3/0653 ,  B23K3/082 ,  B23K2101/40 ,  B23K2101/42 ,  H05K3/34 ,  H05K2203/044

摘要： There is provided a flow soldering process for mounting an electronic component onto a board by a solder material, which process is appropriate for using a lead-free solder material as the solder material. In the flow soldering process, thermal efficiency of flow soldering is improved in preheating step and/or solder material supplying step thereof. In one aspect of the present invention, a heating cover is located above a preheater, and the flow soldering is conducted while the board passes between the heating cover and the preheater. In another aspect of the present invention, a gap between a preheater and a solder bath is 20 to 60 mm. In yet another aspect of the present invention, a distance between a primary wave and a secondary wave is not larger than 60 mm.

摘要翻译： 提供了通过焊料材料将电子部件安装在基板上的流动焊接工艺，该工艺适合于使用无铅焊料材料作为焊料材料。在流焊技术中，流动焊接的热效率提高 在预热步骤和/或焊料材料供应步骤中。 在本发明的一个方面中，加热盖位于预热器上方，并且在板通过加热盖和预热器之间时进行流动焊接。 在本发明的另一方面，预热器和焊料槽之间的间隙为20至60mm。 在本发明的另一方面，一次波与二次波之间的距离不大于60mm。

公开(公告)号：US06607116B2

公开(公告)日：2003-08-19

申请号：US09874038

申请日：2001-06-06

申请人： Kenichiro Suetsugu ,  Shunji Hibino ,  Yukio Maeda ,  Shoshi Kabashima ,  Mikiya Nakata

发明人： Kenichiro Suetsugu ,  Shunji Hibino ,  Yukio Maeda ,  Shoshi Kabashima ,  Mikiya Nakata

IPC分类号： B23K3102

CPC分类号： G01N25/4866 ,  B23K3/0646 ,  B23K2101/36

摘要： There is provided a method which can conveniently estimate a quality of a lead-free solder material used for a flow soldering process. In the present invention, a differential thermal analysis curve of a sample of the lead-free solder material is obtained by utilizing a differential thermal analysis method, and thereby a quality of the lead-free solder material used for a flow soldering process is estimated based on the obtained differential thermal analysis curve.