公开(公告)号：US07971627B2

公开(公告)日：2011-07-05

申请号：US11996682

申请日：2006-06-30

申请人： Yasuji Kawashima

发明人： Yasuji Kawashima

IPC分类号： B22D46/00 ,  G01N1/12

CPC分类号： G01N1/125

摘要： A process and a device for easily and rapidly producing a metal sample for analysis for determining the content of impurities in a molten metal with high accuracy. More particularly, according to the metal sample production process, a metal sample for high accuracy analysis is produced by solidifying a collected molten metal without segregating impurities contained in a molten metal, by rapidly cooling a collected molten metal using a metal sample production device having a thin-walled mold having a thin sample collection space for collecting a molten metal, and an opening/closing operation part with which the mold can be freely opened/closed.

摘要翻译： 用于容易且快速地制造用于分析的金属样品以用于以高精度确定熔融金属中的杂质含量的方法和装置。 更具体地说，根据金属样品的制造方法，通过使收集的熔融金属凝固而不会分离熔融金属中所含的杂质，从而通过使用金属样品制造装置快速冷却收集的熔融金属来生产用于高精度分析的金属样品， 具有用于收集熔融金属的薄样品收集空间的薄壁模具，以及可以自由打开/关闭模具的打开/关闭操作部。

公开(公告)号：US06805282B2

公开(公告)日：2004-10-19

申请号：US10148014

申请日：2002-05-24

申请人： Yasuji Kawashima ,  Kenichiro Suetsugu ,  Shunji Hibino ,  Hiroaki Takano ,  Tatsuo Okuji ,  Shoshi Kabashima ,  Yukio Maeda ,  Mikiya Nakata

发明人： Yasuji Kawashima ,  Kenichiro Suetsugu ,  Shunji Hibino ,  Hiroaki Takano ,  Tatsuo Okuji ,  Shoshi Kabashima ,  Yukio Maeda ,  Mikiya Nakata

IPC分类号： H05K334

CPC分类号： B23K1/0016 ,  B23K1/012 ,  B23K1/085 ,  B23K1/203 ,  B23K3/0653 ,  B23K3/082 ,  B23K2101/40 ,  B23K2101/42 ,  H05K3/34 ,  H05K2203/044

摘要： There is provided a flow soldering process for mounting an electronic component onto a board by a solder material, which process is appropriate for using a lead-free solder material as the solder material. In the flow soldering process, thermal efficiency of flow soldering is improved in preheating step and/or solder material supplying step thereof. In one aspect of the present invention, a heating cover is located above a preheater, and the flow soldering is conducted while the board passes between the heating cover and the preheater. In another aspect of the present invention, a gap between a preheater and a solder bath is 20 to 60 mm. In yet another aspect of the present invention, a distance between a primary wave and a secondary wave is not larger than 60 mm.

摘要翻译： 提供了通过焊料材料将电子部件安装在基板上的流动焊接工艺，该工艺适合于使用无铅焊料材料作为焊料材料。在流焊技术中，流动焊接的热效率提高 在预热步骤和/或焊料材料供应步骤中。 在本发明的一个方面中，加热盖位于预热器上方，并且在板通过加热盖和预热器之间时进行流动焊接。 在本发明的另一方面，预热器和焊料槽之间的间隙为20至60mm。 在本发明的另一方面，一次波与二次波之间的距离不大于60mm。

公开(公告)号：US06235208B1

公开(公告)日：2001-05-22

申请号：US09680953

申请日：2000-10-10

申请人： Yasuji Kawashima ,  Kaoru Shimizu

发明人： Yasuji Kawashima ,  Kaoru Shimizu

IPC分类号： B01D1700

CPC分类号： B23K1/018 ,  B23K1/206 ,  B23K3/08 ,  B23K2101/42 ,  C22B25/06 ,  C22B25/08 ,  Y02P10/228

摘要： A soldering apparatus includes a solder wave shape forming means for melting solder and forming a solder wave shape, and a separating agent dusting means for dusting solder oxides with a separating agent which separates solder and solder oxides. The separating agent is any one selected from the group consisting of offal, cereal grain or flour, bean flour, seed grain or flour, soybean-cake flour, and peanut hull flour, or a combination thereof, as well as an agent and a method of separating solder and solder oxides.

摘要翻译： 焊接装置包括用于熔化焊料并形成焊波形状的焊波形状形成装置，以及用于分离焊料和焊剂氧化物的分离剂粉碎焊剂氧化物的分离剂除尘装置。 分离剂是选自由内脏，谷粒或面粉，豆粉，种籽或面粉，大豆饼粉，花生壳粉，或其组合组成的组中的任何一种，以及试剂和方法 分离焊料和焊剂氧化物。

公开(公告)号：US20100282430A1

公开(公告)日：2010-11-11

申请号：US11996682

申请日：2006-06-30

申请人： Yasuji Kawashima

发明人： Yasuji Kawashima

IPC分类号： B22D29/00 ,  B22C9/06

CPC分类号： G01N1/125

摘要： A process and device for easily and rapidly producing a metal sample for analysis to he used for determining the content of impurities in a molten metal with high accuracy. The device for metal sample production comprises: a thin-walled mold having a thin sample collection space for collecting a molten metal; and an opening/closing operation part with which the mold can be freely opened/closed. This device is used to collect a molten metal and rapidly cool the molten metal to thereby solidify it without causing segregation of the impurities contained in the molten metal. Thus, a metal sample for high-accuracy analysis is produced.

摘要翻译： 一种用于容易且快速地生产用于分析的金属样品用于以高精度确定熔融金属中的杂质含量的方法和装置。 用于金属样品生产的装置包括：具有用于收集熔融金属的薄样品收集空间的薄壁模具; 以及可以自由地打开/关闭模具的打开/关闭操作部。 该装置用于收集熔融金属并快速冷却熔融金属，从而使熔融金属固化，而不引起熔融金属中所含杂质的偏析。 因此，产生用于高精度分析的金属样品。

公开(公告)号：US06214218B1

公开(公告)日：2001-04-10

申请号：US09253527

申请日：1999-02-22

申请人： Yasuji Kawashima ,  Kaoru Shimizu

发明人： Yasuji Kawashima ,  Kaoru Shimizu

IPC分类号： B23K108

CPC分类号： B23K1/018 ,  B23K1/206 ,  B23K3/08 ,  B23K2101/42 ,  C22B25/06 ,  C22B25/08 ,  Y02P10/228

摘要： A soldering apparatus includes a solder wave shape forming device for melting solder and forming a solder wave shape, and a separating agent dusting device for dusting solder oxides with a separating agent which separates solder and solder oxides. The separating agent is any one selected from the group consisting of offal, cereal grain or flour, bean flour, seed grain or flour, soybean-cake flour, and peanut hull flour, or a combination thereof, as well as an agent and a method of separating solder and solder oxides.

摘要翻译： 焊接装置包括用于熔化焊料并形成焊波形状的焊波形状形成装置，以及用于分离焊料和焊剂氧化物的分离剂粉碎焊剂氧化物的分离剂除尘装置。 分离剂是选自由内脏，谷粒或面粉，豆粉，种籽或面粉，大豆饼粉，花生壳粉，或其组合组成的组中的任何一种，以及试剂和方法 分离焊料和焊剂氧化物。

公开(公告)号：US4981249A

公开(公告)日：1991-01-01

申请号：US400605

申请日：1989-08-30

申请人： Yasuji Kawashima ,  Kazuo Nishibori ,  Yasuhiro Morita ,  Sachiho Hayama

发明人： Yasuji Kawashima ,  Kazuo Nishibori ,  Yasuhiro Morita ,  Sachiho Hayama

IPC分类号： B23K3/06

CPC分类号： B23K3/0653 ,  B23K2201/42

摘要： An automatic jet soldering apparatus comprising: a solder bath for holding molten solder therein; a nozzle body having an open top and an open bottom through which the molten solder rises from the solder bath; a punched panel having numerous holes and disposed inside of the nozzle body in such a way to be opened and closed; and a jet source connected to the lower part of the nozzle body, the molten solder rising upward through the nozzle body via the open bottom and the open top of the nozzle body by means of jet power from the jet source. The soldering apparatus further comprises a back rectifying plate mounted on the rear portion of the top opening of the nozzle body, the sloping angle of the back rectifying plate being adjustable, thereby attaining an easy removal of solder residues from the punched panel and achieving a zero relative speed between a printed circuit board and the solder flow velocity, so that the reliability of soldering can be enhanced.

摘要翻译： 一种自动喷射焊接装置，包括：用于在其中保持熔融焊料的焊料槽; 喷嘴体，其具有开口顶部和开口底部，熔融焊料通过该顶部焊料从焊料槽上升; 具有多个孔的穿孔板，以打开和关闭的方式设置在喷嘴体的内部; 以及连接到喷嘴主体的下部的喷射源，熔融焊料通过来自喷射源的喷射动力，经由打开的底部和喷嘴体的开口顶部通过喷嘴主体向上升起。 焊接装置还包括安装在喷嘴主体的顶部开口的后部上的后整流板，后整流板的倾斜角度是可调节的，从而可以容易地从冲孔板去除焊料残留物并实现零点 印刷电路板之间的相对速度和焊料流动速度，从而可以提高焊接的可靠性。

公开(公告)号：US5690890A

公开(公告)日：1997-11-25

申请号：US334236

申请日：1994-11-04

申请人： Yasuji Kawashima ,  Takashi Nagashima ,  Akihiko Matsuike ,  Takeshi Meguro ,  Kaoru Shimizu ,  Hideo Chaki ,  Toshiaki Ogura

发明人： Yasuji Kawashima ,  Takashi Nagashima ,  Akihiko Matsuike ,  Takeshi Meguro ,  Kaoru Shimizu ,  Hideo Chaki ,  Toshiaki Ogura

IPC分类号： B23K35/26 ,  B23K35/36

CPC分类号： B23K35/268 ,  B23K35/262

摘要： A tin-lead alloy solder is provided which exhibits high joint strength under conditions which are likely to induce fatigue fracture. The tin-lead alloy solder comprises 15-80 wt. % lead, 0.1-5 wt. % silver, 0.1-10 wt. % antimony, and 0.0005-0.3 phosphorus, the balance being tin.

摘要翻译： 提供了一种锡铅合金焊料，其在可能引起疲劳断裂的条件下表现出高的接合强度。 锡铅合金焊料包含15-80wt。 ％铅，0.1-5重量％ ％银，0.1-10重量％ ％锑和0.0005-0.3磷，余量为锡。