公开(公告)号：US09969023B2

公开(公告)日：2018-05-15

申请号：US15122113

申请日：2014-02-28

申请人： FUJI MACHINE MFG. CO., LTD.

发明人： Nobuyuki Ishikawa ,  Katsunori Tanaka ,  Mitsuhiro Nishibori

IPC分类号： B23K1/00 ,  B23K31/02 ,  B23K3/06 ,  B23K1/08 ,  H05K3/34 ,  B23K3/08 ,  B23K101/42

CPC分类号： B23K3/0638 ,  B23K1/0016 ,  B23K1/08 ,  B23K1/085 ,  B23K3/06 ,  B23K3/0653 ,  B23K3/085 ,  B23K31/02 ,  B23K2101/42 ,  F28D7/082 ,  F28F1/00 ,  H05K3/3468 ,  H05K2203/081

摘要： Solder housed in flow tank 20 is ejected from nozzle 22 by a pump provided inside flow tank 20. Jet motor 26 that drives the pump is provided outside flow tank 20, and cooling device 30 is provided between flow tank 20 and jet motor 26. Cooling device 30 includes cooling pipe 52 that is formed folded back on itself. Nitrogen gas is supplied from an upper end of cooling pipe 52, flows along cooling pipe 52, and flows out of a lower end of cooling pipe 52 so as to be supplied to flow tank 20. The temperature of the nitrogen gas increases due to heat dissipated from jet motor 26, thus lowering the temperature of jet motor 26. Heat is transferred from jet motor 26 to the nitrogen gas, and jet motor 26 is cooled satisfactorily.

公开(公告)号：US20180132361A1

公开(公告)日：2018-05-10

申请号：US15807110

申请日：2017-11-08

申请人： Flex Ltd.

发明人： Zohair Mehkri ,  Anwar Mohammed ,  Jesus Tan ,  David Geiger ,  Murad Kurwa

IPC分类号： H05K3/34 ,  H05K3/00 ,  H05K1/18 ,  F28F13/00 ,  F28F21/06 ,  B23K3/08

CPC分类号： H05K3/3494 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/085 ,  B23K1/20 ,  B23K3/085 ,  B23K2101/42 ,  F28F13/00 ,  F28F21/06 ,  F28F2270/00 ,  H05K1/0201 ,  H05K1/181 ,  H05K3/0005 ,  H05K3/341 ,  H05K2201/10522 ,  H05K2203/0195 ,  H05K2203/044

摘要： A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

公开(公告)号：US09948051B2

公开(公告)日：2018-04-17

申请号：US15107535

申请日：2014-07-02

申请人： ZTE Corporation

发明人： Yuwen Feng

IPC分类号： B23K37/04 ,  H01R43/02 ,  B23K1/08 ,  B23K3/08

CPC分类号： H01R43/0263 ,  B23K1/085 ,  B23K3/08 ,  B23K3/087 ,  B23K37/04 ,  B23K37/0461 ,  H01R43/0256

摘要： The embodiments of disclosure disclose a welding tray, which includes a tray frame (18) and a supporting device (16), wherein the supporting device (16) includes a supporting component and an adjustable connecting component, the supporting component includes a supporting surface, the adjustable connecting component connects the supporting component to a side edge of the tray frame (18), and a distance between the supporting surface and a bearing surface of the tray frame (18) is adjustable.

公开(公告)号：US09849535B2

公开(公告)日：2017-12-26

申请号：US15260678

申请日：2016-09-09

申请人： Senju Metal Industry Co., Ltd.

发明人： Noboru Hashimoto ,  Takahiro Kasama

IPC分类号： B23K3/06 ,  B23K1/00 ,  B23K1/08 ,  H05K3/34 ,  B23K101/42

CPC分类号： B23K3/0653 ,  B23K1/0016 ,  B23K1/085 ,  B23K3/0646 ,  B23K3/0676 ,  B23K2101/42 ,  H05K3/34 ,  H05K3/3468 ,  H05K2203/1509

摘要： Provided is a jet nozzle that varies a width of a flow of jetted molten solder. The jet nozzle contains a nozzle main body having a channel section at its part and a molten solder flow width varying member that varies a width of the upper opening end of the nozzle main body by a slide of the molten solder flow width varying member within the channel section of the nozzle main body to vary a width of the molten solder flow jetted from the upper opening end of the nozzle main body. The molten solder flow width varying member includes a molten solder flow width varying plate that varies the width of the molten solder flow, a rectangular rectifying piece that extends along a slide direction of the molten solder flow width varying member, and a sliding shaft that slides the rectifying piece.

公开(公告)号：US09662732B2

公开(公告)日：2017-05-30

申请号：US15188299

申请日：2016-06-21

申请人： International Business Machines Corporation

发明人： Stephen M. Hugo ,  Matthew S. Kelly

IPC分类号： B23K1/00 ,  B23K1/20 ,  H05K7/20 ,  B23K3/08 ,  B23K31/12 ,  B23K31/02 ,  H05K3/34 ,  B23K1/08 ,  B23K3/06

CPC分类号： B23K3/08 ,  B23K1/0016 ,  B23K1/085 ,  B23K3/0653 ,  B23K31/02 ,  B23K31/12 ,  B23K2101/42 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2203/044 ,  H05K2203/1509 ,  H05K2203/306

摘要： A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.

公开(公告)号：US09370838B2

公开(公告)日：2016-06-21

申请号：US14465559

申请日：2014-08-21

申请人： Illinois Tool Works Inc.

发明人： Gregory Leo Hueste

IPC分类号： B23K31/02 ,  B23K3/06 ,  B23K1/00 ,  H05K3/34 ,  H05K13/04 ,  B23K1/08

CPC分类号： B23K3/0653 ,  B23K1/0016 ,  B23K1/085 ,  B23K3/0676 ,  H05K3/34 ,  H05K3/3489 ,  H05K13/0465 ,  H05K2203/044

摘要： A wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a reservoir of solder material, and a wave solder nozzle system adapted to create a solder wave. The wave solder nozzle system has a nozzle frame, and a nozzle plate secured to the nozzle frame. The nozzle plate includes a first zone of openings positioned adjacent a leading edge of the nozzle plate, a second zone of openings positioned proximate a middle of the nozzle plate, and a third zone having no openings positioned adjacent a trailing edge of the nozzle plate.

摘要翻译： 波峰焊机包括壳体和联接到壳体的传送器。 输送机被配置为将印刷电路板输送通过壳体。 波峰焊机还包括耦合到外壳的波峰焊台。 波峰焊站包括焊料材料的储存器和适于产生焊波的波峰焊管系统。 波峰喷嘴系统具有喷嘴框架和固定在喷嘴框架上的喷嘴板。 喷嘴板包括邻近喷嘴板的前缘定位的第一开口区域，邻近喷嘴板的中间定位的第二开口区域，以及没有位于喷嘴板的后缘附近的开口的第三区域。

公开(公告)号：US20160044791A1

公开(公告)日：2016-02-11

申请号：US14454839

申请日：2014-08-08

申请人： International Business Machines Corporation

发明人： Stephen M. Hugo ,  Matthew S. Kelly

IPC分类号： H05K3/00 ,  B23K31/02 ,  B23K31/12 ,  H05K13/00 ,  B23K1/00

CPC分类号： B23K3/08 ,  B23K1/0016 ,  B23K1/085 ,  B23K3/0653 ,  B23K31/02 ,  B23K31/12 ,  B23K2101/42 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2203/044 ,  H05K2203/1509 ,  H05K2203/306

摘要： A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.

公开(公告)号：US20160023309A1

公开(公告)日：2016-01-28

申请号：US14878056

申请日：2015-10-08

申请人： ALPHA METALS, INC.

发明人： Pritha Choudhury ,  Morgana De Avila Ribas ,  Sutapa Mukherjee ,  Anil Kumar ,  Siuli Sarkar ,  Ranjit Pandher ,  Ravi Bhatkal ,  Bawa Singh

IPC分类号： B23K35/26 ,  H05K3/34 ,  C22C13/00 ,  B23K1/00 ,  C22C13/02

CPC分类号： B23K35/262 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/0056 ,  B23K1/012 ,  B23K1/085 ,  B23K1/19 ,  B23K1/203 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  B23K2103/12 ,  C22C13/00 ,  C22C13/02 ,  H05K3/3457 ,  H05K3/3463 ,  Y10T403/479

摘要： A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt. % of silver, 2.5 to 4 wt. % of bismuth, 0.3 to 0.8 wt. % of copper, 0.03 to 1 wt. % nickel, 0.005 to 1 wt. % germanium, and a balance of tin, together with any unavoidable impurities.

公开(公告)号：US09232664B2

公开(公告)日：2016-01-05

申请号：US14102994

申请日：2013-12-11

申请人： International Business Machines Corporation

发明人： Stephen M. Hugo ,  Matthew S. Kelly

IPC分类号： B23K31/02 ,  H05K3/34 ,  B23K1/08 ,  B23K3/06 ,  H05K13/04 ,  H05K1/02

CPC分类号： H05K3/3447 ,  B23K1/085 ,  B23K3/0653 ,  H05K1/0292 ,  H05K3/3468 ,  H05K13/04 ,  H05K2201/09127 ,  H05K2203/044

摘要： A structure including a circuit board including a plane and a pin-in-hole component; and a heat transfer device, where the heat transfer device is thermally connected to the plane at a leading edge of the circuit board, the heat transfer device transfers heat from a wave of molten solder to the plane.

公开(公告)号：US20150367438A1

公开(公告)日：2015-12-24

申请号：US14842226

申请日：2015-09-01

申请人： Illinois Tool Works Inc.

发明人： Jonathan M. Dautenhahn

IPC分类号： B23K3/08 ,  H05K3/34 ,  B23K3/047 ,  B23K3/06 ,  B23K1/08 ,  B23K1/00

CPC分类号： B23K3/08 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/085 ,  B23K3/047 ,  B23K3/0653 ,  B23K3/082 ,  F27B9/029 ,  F27B17/0025 ,  H01T23/00 ,  H05K3/34 ,  H05K3/341 ,  H05K3/3468 ,  H05K2203/044 ,  Y10T29/49826

摘要： A wave solder machine includes a pre-heating station, a wave soldering station, and a conveyor to transport substrates through a tunnel passing through the pre-heating station and the wave soldering station. The tunnel has a substantially oxygen-free environment. The pre-heating station includes a pre-heater including a support frame assembly, and a heater assembly supported by the support frame assembly. The heater assembly is slidably coupled to the support frame assembly between an operational position and a non-operational position. The pre-heater further includes a seal disposed between the heater assembly and the support frame assembly. The seal provides a gas-tight seal when the heater assembly is in the operational position to prevent atmosphere from entering the tunnel thereby preserving the substantially oxygen-free environment within the tunnel.

摘要翻译： 波峰焊机包括预热站，波峰焊站和输送机，以通过穿过预热站和波峰焊站的隧道输送基板。 隧道具有基本上无氧的环境。 预热站包括预热器，其包括支撑框架组件和由支撑框架组件支撑的加热器组件。 加热器组件在操作位置和非操作位置之间可滑动地联接到支撑框架组件。 预热器还包括设置在加热器组件和支撑框架组件之间的密封件。 当加热器组件处于操作位置时，密封件提供气密密封，以防止大气进入隧道，从而保持隧道内基本上无氧的环境。