-
公开(公告)号:US20090237890A1
公开(公告)日:2009-09-24
申请号:US12299877
申请日:2007-02-01
CPC分类号: H01L25/071 , H01L23/3735 , H01L24/48 , H01L25/115 , H01L25/50 , H01L2224/48137 , H01L2224/48227 , H01L2224/48472 , H01L2924/00014 , H01L2924/0102 , H01L2924/01078 , H01L2924/12041 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19107 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor device includes: a semiconductor element (106) having a surface on a positive electrode side and a surface on a negative electrode side; multiple conductors (13 to 15) bonded respectively to the surface on the positive electrode side and to the surface on the negative electrode side of the semiconductor element; a heat sink plate (11) disposed as intersecting a junction interface between the semiconductor element and each of the multiple conductors and configured to discharge heat of the semiconductor element; and an insulator (12) bonding the heat sink plate to the multiple conductors. The insulator includes a heat conductive insulator (16) disposed inside a portion facing all of the multiple conductors and a flexible insulator (17) disposed at a portion other than the heat conductive insulator.
摘要翻译: 半导体器件包括:具有在正极侧表面和负极侧的表面的半导体元件(106); 多个导体(13〜15)分别与半导体元件的正极侧和负极侧的表面接合, 散热板(11),设置成与所述半导体元件和所述多个导体中的每一个之间的结界面相交并且被配置为放电所述半导体元件的热; 以及将散热板连接到多个导体的绝缘体(12)。 绝缘体包括设置在面向所有多个导体的部分内的导热绝缘体(16),以及布置在导热绝缘体以外的部分的柔性绝缘体(17)。