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    Thick wafer processing and resultant products
    22.
    发明授权
    Thick wafer processing and resultant products 有权
    厚晶圆加工及产品

    公开(公告)号：US06777311B2

    公开(公告)日：2004-08-17

    申请号：US10087989

    申请日：2002-03-05

    Applicant: Hongtao Han ,  Jay Mathews

    Inventor： Hongtao Han ,  Jay Mathews

    IPC: H01L21301

    CPC classification number: H01S5/183 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4274 ,  H01L2924/0002 ,  H01S5/0201 ,  H01S5/02236 ,  H01S5/02248 ,  H01S5/0425 ,  Y10T156/1052 ,  H01L2924/00

    Abstract: A thick wafer is diced by partially dicing a first side to form a first dice, flipping the wafer so that the first side is now in contact with a dicing tape, and dicing a second side. The dicing of the second side may be achieved by aligning a dicing tool to the first dice and/or alignment marks on the wafer. The thick wafer may be a composite wafer including two or more wafers bonded together. These two wafers may be different thicknesses and/or different materials.

    Abstract translation: 通过部分切割第一面以形成第一骰子来切割厚晶片，翻转晶片，使得第一面现在与切割胶带接触，并切割第二面。 可以通过将切割工具对准晶片上的第一骰子和/或对准标记来实现第二面的切割。 厚晶片可以是包括两个或更多个晶片结合在一起的复合晶片。 这两个晶片可以是不同的厚度和/或不同的材料。

    Electrostatic bonding of optical fibers to substrates
    23.
    发明授权
    Electrostatic bonding of optical fibers to substrates 失效
    将光纤静电粘合到基板上

    公开(公告)号：US5533158A

    公开(公告)日：1996-07-02

    申请号：US269302

    申请日：1994-09-12

    Applicant: Hongtao Han ,  Songsheng Tan

    Inventor： Hongtao Han ,  Songsheng Tan

    IPC: G02B6/36

    CPC classification number: G02B6/3636 ,  G02B6/3628 ,  G02B6/3652 ,  G02B6/3692

    Abstract: An optical interconnect comprises a metallized optical fiber electrostatically bonded to a thin film of an alkali-containing glass which is itself bonded to a planar surface of a semiconductive or conductive substrate. Another optical interconnect comprises an optical fiber having a thin film of an alkali-containing glass deposited thereon, wherein the fiber is electrostatically bonded to a planar surface of a semiconductive or conductive substrate. A process of bonding an optical fiber to a semiconductive or conductive substrate includes contacting the fiber with the substrate, applying a DC potential to the fiber-substrate combination, slowly heating the combination to a maximum temperature between 180.degree.-500.degree. C., maintaining the combination at the maximum temperature for a few minutes, cooling the combination to room temperature, and removing the DC potential.

    Abstract translation: 光学互连包括静电粘合到含碱玻璃的薄膜上的金属化光纤，其本身结合到半导体或导电基底的平坦表面。 另一种光学互连件包括具有沉积在其上的含有碱的玻璃的薄膜的光纤，其中该光纤与静电结合到半导体或导电基底的平面表面。 将光纤连接到半导体或导电基板的过程包括使纤维与基底接触，向纤维 - 基底组合施加DC电位，将组合缓慢加热到180℃-500℃之间的最高温度，保持 在最高温度下组合数分钟，将组合冷却至室温，并除去DC电位。

    Optical assembly and method of making same
    27.
    发明授权
    Optical assembly and method of making same 有权
    光学组件及其制作方法

    公开(公告)号：US07817883B2

    公开(公告)日：2010-10-19

    申请号：US12292313

    申请日：2008-11-17

    Applicant: James Morris ,  Hongtao Han ,  Adam Fedor ,  Robert Te Kolste ,  Jay Mathews ,  Michael Feldman

    Inventor： James Morris ,  Hongtao Han ,  Adam Fedor ,  Robert Te Kolste ,  Jay Mathews ,  Michael Feldman

    IPC: G02B6/28

    CPC classification number: G02B6/29367 ,  G02B6/2938 ,  G02B6/4214 ,  G02B6/4215

    Abstract: An optical assembly includes a first transparent substrate having first and second surfaces, a second transparent substrate having substantially parallel third and fourth surfaces, a reflective portion on the second transparent substrate, a plurality of filters between the first substrate and the reflective portion, the plurality of filters filtering light beams incident thereon, the plurality of filters and the reflective portion forming a bounce cavity within the second transparent substrate, a collimating lens for collimating light beams to be input to the bounce cavity, a tilt mechanism for introducing tilt to light beams input to the bounce cavity; an input port receiving light beams and an output port transmitting light beams. The tilt mechanism may be between the first and second substrate.

    Abstract translation: 光学组件包括具有第一表面和第二表面的第一透明衬底，具有基本上平行的第三和第四表面的第二透明衬底，第二透明衬底上的反射部分，第一衬底和反射部分之间的多个滤光器， 过滤器入射到其上的光束，所述多个滤光器和所述反射部分在所述第二透明基板内形成反射腔;准直透镜，用于准直入射到所述反射腔的光束;倾斜机构，用于将倾斜引导到光束 输入到反弹腔; 接收光束的输入端口和发射光束的输出端口。 倾斜机构可以在第一和第二基板之间。

    Optical assembly and method of making same
    28.
    发明申请
    Optical assembly and method of making same 有权
    光学组件及其制作方法

    公开(公告)号：US20090103866A1

    公开(公告)日：2009-04-23

    申请号：US12292313

    申请日：2008-11-17

    Applicant: James Morris ,  Hongtao Han ,  Adam Fedor ,  Robert Te Kolste ,  Jay Mathews ,  Michael Feldman

    Inventor： James Morris ,  Hongtao Han ,  Adam Fedor ,  Robert Te Kolste ,  Jay Mathews ,  Michael Feldman

    IPC: G02B6/26

    CPC classification number: G02B6/29367 ,  G02B6/2938 ,  G02B6/4214 ,  G02B6/4215

    Abstract: An optical assembly includes a first transparent substrate having first and second surfaces, a second transparent substrate having substantially parallel third and fourth surfaces, a reflective portion on the second transparent substrate, a plurality of filters between the first substrate and the reflective portion, the plurality of filters filtering light beams incident thereon, the plurality of filters and the reflective portion forming a bounce cavity within the second transparent substrate, a collimating lens for collimating light beams to be input to the bounce cavity, a tilt mechanism for introducing tilt to light beams input to the bounce cavity; an input port receiving light beams and an output port transmitting light beams. The tilt mechanism may be between the first and second substrate.

    Abstract translation: 光学组件包括具有第一表面和第二表面的第一透明衬底，具有基本上平行的第三和第四表面的第二透明衬底，第二透明衬底上的反射部分，第一衬底和反射部分之间的多个滤光器， 过滤器入射到其上的光束，所述多个滤光器和所述反射部分在所述第二透明基板内形成反射腔;准直透镜，用于准直入射到所述反射腔的光束;倾斜机构，用于将倾斜引导到光束 输入到反弹腔; 接收光束的输入端口和发射光束的输出端口。 倾斜机构可以在第一和第二基板之间。

    Passive alignment frame using monocrystalline material
    29.
    发明授权
    Passive alignment frame using monocrystalline material 失效
    被动对准框架采用单晶材料

    公开(公告)号：US5905831A

    公开(公告)日：1999-05-18

    申请号：US674770

    申请日：1996-06-28

    Applicant: Robert Addison Boudreau ,  Terry Patrick Bowen ,  Hongtao Han

    Inventor： Robert Addison Boudreau ,  Terry Patrick Bowen ,  Hongtao Han

    IPC: G02B6/36 ,  G02B6/42

    CPC classification number: G02B6/4224 ,  G02B6/4228 ,  G02B6/423 ,  G02B6/4238 ,  G02B6/4249 ,  G02B6/4246

    Abstract: An apparatus for coupling an optical fiber to an optical device comprises a substrate and a passive alignment member. The substrate having a top surface and a bottom surface. The top surface having a fist groove disposed thereon for holding an optical fiber, and a second groove disposed on the top surface. The second groove being substantially orthogonal to the first groove. The passive alignment member disposed in the second groove. The passive alignment member having selectively etched forward and side pedestals for aligning the optical device to the optical fiber disposed in the first groove.

    Abstract translation: 用于将光纤耦合到光学装置的装置包括基板和无源对准部件。 衬底具有顶表面和底表面。 上表面具有设置在其上的用于保持光纤的第一槽和设置在顶表面上的第二槽。 第二槽基本上与第一槽正交。 被动对准构件设置在第二凹槽中。 被动对准构件具有选择性蚀刻的正面和侧面底座，用于将光学装置对准设置在第一凹槽中的光纤。

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