公开(公告)号：US20080084224A1

公开(公告)日：2008-04-10

申请号：US11545890

申请日：2006-10-10

申请人： Michael Nystrom

发明人： Michael Nystrom

IPC分类号： G01R31/302

CPC分类号： G01R31/311 ,  G01R1/072

摘要： A photoionization probe includes two electrodes and provides ionizable vapor in a carrier gas via a channel between the electrodes. The ionizable vapor is thereby concentrated in an aperture of the probe where it is photoionized by, for example, an ultraviolet (UV) lamp.

摘要翻译： 光电离探针包括两个电极，并通过电极之间的通道在载气中提供可离子化的蒸气。 因此，可离子化蒸气被浓缩在探针的孔中，其中通过例如紫外线（UV）灯进行光电离。

公开(公告)号：US20070190747A1

公开(公告)日：2007-08-16

申请号：US11655739

申请日：2007-01-19

申请人： Giles Humpston ,  Michael Nystrom ,  Vage Oganesian ,  Yulia Aksenton ,  Osher Avsian ,  Robert Burtzlaff ,  Avi Dayan ,  Andrey Grinman ,  Felix Hazanovich ,  Ilya Hecht ,  Charles Rosenstein ,  David Ovrutsky

发明人： Giles Humpston ,  Michael Nystrom ,  Vage Oganesian ,  Yulia Aksenton ,  Osher Avsian ,  Robert Burtzlaff ,  Avi Dayan ,  Andrey Grinman ,  Felix Hazanovich ,  Ilya Hecht ,  Charles Rosenstein ,  David Ovrutsky

IPC分类号： H01L21/00

CPC分类号： B81C1/00285 ,  B81C2203/0118 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： Methods are provided for making a plurality of lidded microelectronic elements. In an exemplary embodiment, a lid wafer is assembled with a device wafer. Desirably, the lid wafer is severed into a plurality of lid elements to remove portions of the lid wafer overlying contacts at a front face of the device wafer adjacent to dicing lanes of the device wafer. Thereafter, desirably, the device wafer is severed along the dicing lanes to provide a plurality of lidded microelectronic elements.

摘要翻译： 提供了制造多个带盖的微电子元件的方法。 在示例性实施例中，盖晶片与装置晶片组装在一起。 期望地，将盖晶片切割成多个盖元件以去除盖子晶片的覆盖在与器件晶片的切割通道相邻的器件晶片的正面处的触点的部分。 此后，期望地，器件晶片沿着切割通道切断以提供多个带盖的微电子元件。

公开(公告)号：US20070148824A1

公开(公告)日：2007-06-28

申请号：US11642616

申请日：2006-12-20

申请人： Michael Nystrom ,  Belgacem Haba ,  Giles Humpston

发明人： Michael Nystrom ,  Belgacem Haba ,  Giles Humpston

IPC分类号： H01L21/78 ,  H01L21/00

CPC分类号： H01L23/3114 ,  H01L23/525 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00

摘要： A method of making chip assemblies includes providing an in-process assembly including a semiconductor wafer, a wafer compliant structure overlying a front surface of the wafer and cavities, and terminals carried on the compliant structure adjacent the cavities and electrically connected to the wafer, the cavities being substantially sealed. The method includes subdividing the in-process assembly to form individual chip assemblies, each including one or more chip regions of the wafer, a portion of the compliant structure and the terminals carried on the portion, and opening vents communicating with said cavities after said providing step.

摘要翻译： 一种制造芯片组件的方法包括提供包括半导体晶片，覆盖晶片前表面的晶片兼容结构和空腔的过程中组件以及与该空腔相邻并且电连接到晶片的柔性结构承载的端子， 空腔基本上被密封。 该方法包括将进程中的组件细分以形成各自的芯片组件，每个芯片组件包括晶片的一个或多个芯片区域，柔性结构的一部分和承载在该部分上的端子，以及在提供之后与所述空腔连通的开口 步。

公开(公告)号：US20060139041A1

公开(公告)日：2006-06-29

申请号：US11021602

申请日：2004-12-23

申请人： Michael Nystrom ,  Bill Peck ,  William Chesk

发明人： Michael Nystrom ,  Bill Peck ,  William Chesk

IPC分类号： G01R31/02

CPC分类号： G01R1/07 ,  G01R1/06783 ,  G01R31/304

摘要： There are disclosed systems and methods in which a liquid dispensing head is positioned above the contact area of the device under test (DUT). A stream of liquid is dispensed from the head such that a continuous column of liquid extends from the head to the contact area of the test device. This column of liquid completes a circuit which allows current to flow thereby allowing for current measurement.

摘要翻译： 公开了一种系统和方法，其中液体分配头位于被测设备（DUT）的接触区域上方。 从头部分出液体流，使得连续的液体柱从头部延伸到测试装置的接触区域。 这一列液体完成一个允许电流流动从而允许电流测量的电路。

公开(公告)号：US06556738B2

公开(公告)日：2003-04-29

申请号：US10021979

申请日：2001-12-17

申请人： Greg C. Pfeiffer ,  Todd P. Knettel ,  Michael Nystrom ,  Jorge A. Cano

发明人： Greg C. Pfeiffer ,  Todd P. Knettel ,  Michael Nystrom ,  Jorge A. Cano

IPC分类号： G02B626

CPC分类号： H04B10/075 ,  G02B6/4453 ,  H04Q11/0003

摘要： A fiber optic circuit provides signal access and monitoring. A module housing the circuit and the module is mountable to a chassis. The module housing includes mounting flanges for mounting the module to the chassis; and a plurality of exposed adapters along at least one of the front and rear faces. Each of the plurality of adapters is connectable to a fiber optic connector external to the module. The plurality of adapters define first and second transmit signal ports and first and second receive signal ports. A transmit signal pathway is between the first and second transmit signal port. A receive signal pathway is between the first and second receive signal ports. A first switch, such as a 2×2 switch, is between the transmit and receive signal pathways wherein the switch has first and second states, the first state being a normal through state wherein the first and second transmit signal ports are in communication along the transmit signal pathway, and wherein the first and second receive signal ports are in communications along the receive signal pathway, and a loopback state wherein the first transmit signal and the receive signal port are in communication along a first loopback path along a portion of the transmit and receive signal pathways, and wherein the second transmit and receive signal ports are in communication along a loopback path along other portions of the transmit and receive signal pathways. A second 2×2 switch or a 1×2 switch allows access for testing with test equipment and a 1×N optical switch. The various switches can be remotely controlled.

公开(公告)号：US20050093186A1

公开(公告)日：2005-05-05

申请号：US10698210

申请日：2003-10-31

申请人： Michael Nystrom ,  Annette Grot

发明人： Michael Nystrom ,  Annette Grot

IPC分类号： B29D99/00 ,  B29D11/00

CPC分类号： B29D11/00 ,  B29C2059/023

摘要： Selective area stamping of optical elements may be performed to make multiple micro-optic components on one or two sides of a substrate may be fabricated using a batch process. The presence of molding material may be controlled on the substrate through the use of gaps.

摘要翻译： 可以执行光学元件的选择性区域冲压，以便可以使用间歇工艺来制造在衬底的一侧或两侧上的多个微光学元件。 成型材料的存在可以通过使用间隙来控制在基材上。

公开(公告)号：US20080105963A1

公开(公告)日：2008-05-08

申请号：US11881743

申请日：2007-07-27

申请人： William Carlson ,  Michael Warner ,  Salvador Tostado ,  John Riley ,  Ronald Green ,  Ilyas Mohammed ,  Michael Nystrom ,  Rolfe Gustus ,  David Baker

发明人： William Carlson ,  Michael Warner ,  Salvador Tostado ,  John Riley ,  Ronald Green ,  Ilyas Mohammed ,  Michael Nystrom ,  Rolfe Gustus ,  David Baker

IPC分类号： H01L23/02

CPC分类号： H05K1/144 ,  H01L23/49811 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/162 ,  H01L2224/16 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/284 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/10265 ,  H05K2201/2036

摘要： A stackable chip assembly is disclosed, as are many different embodiments relating to same. The chip assembly preferably includes at least two substrates with components mounted on each. The substrates are preferably situated with respect to one another such that components on one substrate extend towards the other substrate and vice versa. The components of each substrate preferably extend between each other. In addition various connections between the substrates are disclosed, as well as methods of constructing such chip assemblies.

摘要翻译： 公开了可堆叠的芯片组件，与其相关的许多不同的实施例也是公开的。 芯片组件优选地包括至少两个具有安装在其上的部件的基板。 衬底优选地相对于彼此定位，使得一个衬底上的部件朝向另一个衬底延伸，反之亦然。 每个基板的部件优选彼此延伸。 此外，公开了基板之间的各种连接以及构造这种芯片组件的方法。

公开(公告)号：US20070145536A1

公开(公告)日：2007-06-28

申请号：US11318815

申请日：2005-12-27

申请人： Michael Nystrom ,  Belgacem Haba ,  Giles Humpston

发明人： Michael Nystrom ,  Belgacem Haba ,  Giles Humpston

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L23/3114 ,  H01L23/525 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00

摘要： A compliant structure is provided on a semiconductor wafer. The compliant structure includes cavities. The compliant structure and the wafer seal the cavities during process steps used to form conductive elements on the compliant structure. After processing, vents are opened to connect the cavities to the exterior of the assembly. The vents may be formed by severing the wafer and compliant structure to form individual units, so that the severance planes intersect channels or other voids communicating with the cavities. Alternatively, the vents may be formed by forming holes in the compliant structure, or by opening bores extending through the wafer.

摘要翻译： 在半导体晶片上提供柔性结构。 顺应结构包括腔。 顺应结构和晶片在用于在柔性结构上形成导电元件的工艺步骤期间密封空腔。 处理后，通风口打开，将空腔连接到组件的外部。 通孔可以通过切断晶片和柔顺结构以形成单独的单元而形成，使得分离平面与通道或与空腔连通的其它空隙相交。 或者，可以通过在柔性结构中形成孔或通过打开延伸穿过晶片的孔而形成通气口。

公开(公告)号：US20060220234A1

公开(公告)日：2006-10-05

申请号：US11322617

申请日：2005-12-30

申请人： Kenneth Honer ,  Giles Humpston ,  David Tuckerman ,  Michael Nystrom

发明人： Kenneth Honer ,  Giles Humpston ,  David Tuckerman ,  Michael Nystrom

IPC分类号： H01L23/34

CPC分类号： B81B7/0006 ,  B81C1/00269 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.

公开(公告)号：US20060139040A1

公开(公告)日：2006-06-29

申请号：US11020725

申请日：2004-12-23

申请人： Michael Nystrom ,  Daniel Roitman

发明人： Michael Nystrom ,  Daniel Roitman

IPC分类号： G01R31/02

CPC分类号： G09G3/006 ,  G01R1/06783 ,  G01R1/07 ,  G01R31/304 ,  G09G3/32

摘要： There present invention is directed to a system and method which a liquid dispensing head is positioned above the contact area of the device under test (DUT). Liquid droplets are dispensed form the head and these droplets are charged with an electrical charge so that when the drops form a pool of liquid on the contact area the pool is charged thereby causing current to flow in the DUT. In this manner, for example, the transistor at each pixel of an OLED can be tested. In one embodiment an inkjet head is used to dispense fluid that is subsequently charged. In still another embodiment, the inkjet head is piezoelectric.

摘要翻译： 本发明涉及一种液体分配头位于被测设备（DUT）的接触区域上方的系统和方法。 液滴从头部分配，并且这些液滴用电荷充电，使得当液滴在接触区域上形成液体池时，池被充电，从而导致电流在DUT中流动。 以这种方式，例如，可以测试OLED的每个像素处的晶体管。 在一个实施例中，喷墨头用于分配随后带电的流体。 在另一个实施例中，喷墨头是压电的。