公开(公告)号：US20190213725A1

公开(公告)日：2019-07-11

申请号：US16134986

申请日：2018-09-19

Applicant: Industrial Technology Research Institute

Inventor： Ming-Kaan Liang ,  An-Chun Luo ,  Yu-Shan Deng ,  Chih-Ming Shen ,  Ming-Ji Dai

IPC: G06T7/00 ,  G06N3/08 ,  G06K9/62

CPC classification number: G06T7/001 ,  G06K9/6267 ,  G06N3/08 ,  G06T2207/20132 ,  G06T2207/30141

Abstract: A board defect filtering method is provided. The method includes: receiving a defect list; obtaining a plurality of defect images of a plurality of defect records on the defect list; receiving a circuit layout image; analyzing a defect location of a first defect image of the plurality of defect images according to the circuit layout image; cropping the first defect image to obtain a first cropped defect image according to the defect location; inputting the first cropping defect image to a defect classifying model; and determining whether the first defect image is a qualified product image or not according to an output result of the defect classifying model.

公开(公告)号：US20190188357A1

公开(公告)日：2019-06-20

申请号：US15922910

申请日：2018-03-15

Applicant: Industrial Technology Research Institute

Inventor： Heng-Chieh Chien ,  Sheng-Tsai Wu ,  Ming-Ji Dai ,  Chih-Ming Shen

IPC: G06F17/50

Abstract: A chip temperature computation method and a chip temperature computation device are provided. The chip temperature computation method includes: computing an upper layer thermal resistance and a lower layer thermal resistance of a chip, computing a total thermal resistance of the chip, and computing a temperature of the chip according to the total thermal resistance.

公开(公告)号：US10197255B2

公开(公告)日：2019-02-05

申请号：US15479733

申请日：2017-04-05

Applicant: Industrial Technology Research Institute

Inventor： Heng-Chieh Chien ,  Yu-Lin Chao ,  Wen-Fu Hsu ,  Chih-Ming Shen ,  Chia-Wei Jui ,  Yao-Shun Chen

IPC: F21V21/35 ,  F21V21/14 ,  F21V23/06 ,  F21V19/02 ,  F21V19/00 ,  H01R25/14 ,  F21Y115/15

Abstract: A rail-type organic light emitting diode lamp assembly is provided. The lamp assembly includes a lamp module, an annular member, a connector, a conductive member, and a rail module. The annular member includes a protrusion portion having a pair of indentations. The connector is connected to the annular member, and includes a through hole, a first end provided with a pair of ears and a second end provided with a pair of hooks. The conductive member is provided in the through hole and has a first end in contact with the annular conductive coil. The rail module is connected with the connector and includes a conductor in contact with a second end of the conductive member. The connector can be slidably hooked to the rail module through the hooks, and after the ears are inserted into the indentations, the annular member can be rotatable with respect to the connector.

公开(公告)号：US20170104027A1

公开(公告)日：2017-04-13

申请号：US14979533

申请日：2015-12-28

Applicant: Industrial Technology Research Institute

Inventor： Wei-Chung Lo ,  Yu-Wei Huang ,  Tao-Chih Chang ,  Chih-Ming Shen

IPC: H01L27/15 ,  H01L33/00 ,  H01L33/62 ,  H01L33/38

CPC classification number: H01L27/156 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/38 ,  H01L33/62 ,  H01L2224/48139 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: In an embodiment, a light emitting device comprises a light emitting diode chip and a spherical extending electrode. The light emitting diode chip includes a semiconductor epitaxial structure, a first electrode and a second electrode. The first electrode and the second electrode are disposed on two opposite sides of the semiconductor epitaxial structure, respectively. The first electrode is disposed between the semiconductor epitaxial structure and the spherical extending electrode, and the spherical extending electrode is electrically connected to the semiconductor epitaxial structure electrically through the first electrode. The volume of the spherical extending electrode is greater than that of the light emitting diode chip.