公开(公告)号：US20180066663A1

公开(公告)日：2018-03-08

申请号：US15260121

申请日：2016-09-08

Applicant: Intel Corporation

Inventor： Devdatta P. Kulkarni ,  Robin A. Steinbrecher

IPC: F04D25/04 ,  H05K7/20

Abstract: Processes, apparatuses, and systems are associated with using coolant-driven fans to cool computer systems. In embodiments, the flow of coolant through tubes used to cool cold plates within the system may be used to drive one or more fans within the system to provide additional airflow to cool components, for example, components to be air cooled that are attached to a motherboard. Other embodiments may be described and/or claimed.

公开(公告)号：US20170315595A1

公开(公告)日：2017-11-02

申请号：US15140014

申请日：2016-04-27

Applicant: Intel Corporation

Inventor： Devdatta P. Kulkarni ,  Timothy G. Hanna

IPC: G06F1/20

CPC classification number: G06F1/20 ,  G06F1/206 ,  G06F2200/201 ,  H01L21/00 ,  H01L35/00 ,  H01L37/00

Abstract: Methods, apparatuses, and systems associated with tunable pumped two-phase liquid cooling thermal management are disclosed. In embodiments, a tunable cooling apparatus may include a thermoelectric cooler device, TEC, that has a hot side and a cold side, where the cold side is to cool the coolant in route to an inlet manifold of the cold plate before the coolant enters the inlet manifold, and the hot side may be to warm the coolant in route from an outlet manifold of the cold plate after the coolant flows through the cold plate and exits the outlet manifold and or vice versa. In embodiments, the coolant may be either in a liquid state or in a vapor state. Other embodiments may be described and/or claimed.