公开(公告)号：US20220181262A1

公开(公告)日：2022-06-09

申请号：US17677130

申请日：2022-02-22

Applicant: Intel Corporation

Inventor： Sanka Ganesan ,  Ram Viswanath ,  Xavier Francois Brun ,  Tarek A. Ibrahim ,  Jason M. Gamba ,  Manish Dubey ,  Robert Alan May

IPC: H01L23/538 ,  H01L23/367 ,  H01L23/31 ,  H01L23/00

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic component may include a substrate having a first face and an opposing second face, wherein the substrate includes a through-substrate via (TSV); a first mold material region at the first face, wherein the first mold material region includes a first through-mold via (TMV) conductively coupled to the TSV; and a second mold material region at the second face, wherein the second mold material region includes a second TMV conductively coupled to the TSV.

公开(公告)号：US20220093515A1

公开(公告)日：2022-03-24

申请号：US17540079

申请日：2021-12-01

Applicant: Intel Corporation

Inventor： Praneeth Kumar Akkinepally ,  Frank Truong ,  Jason M. Gamba ,  Robert Alan May

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/31

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a microelectronic component embedded in the package substrate, the microelectronic component including: a substrate having a surface, where the substrate includes a conductive pathway and a mold material region at the surface, where the mold material region includes a through-mold via (TMV) electrically coupled to the conductive pathway, and where the mold material region is at the second surface of the package substrate; and a die conductively coupled, at the second surface of the package substrate, to the package substrate and to the TMV of the microelectronic component.

公开(公告)号：US20210305163A1

公开(公告)日：2021-09-30

申请号：US16832150

申请日：2020-03-27

Applicant: Intel Corporation

Inventor： Praneeth Kumar Akkinepally ,  Frank Truong ,  Jason M. Gamba ,  Robert Alan May

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/31

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a microelectronic component embedded in the package substrate, the microelectronic component including: a substrate having a surface, where the substrate includes a conductive pathway and a mold material region at the surface, where the mold material region includes a through-mold via (TMV) electrically coupled to the conductive pathway, and where the mold material region is at the second surface of the package substrate; and a die conductively coupled, at the second surface of the package substrate, to the package substrate and to the TMV of the microelectronic component.