公开(公告)号：US20070284028A1

公开(公告)日：2007-12-13

申请号：US11753486

申请日：2007-05-24

Applicant: Isamu Kawashima ,  Hideshi Sato ,  Hideo Kino ,  Minoru Ametani

Inventor： Isamu Kawashima ,  Hideshi Sato ,  Hideo Kino ,  Minoru Ametani

IPC: B32B41/00 ,  B32B37/12

CPC classification number: H01L21/67132

Abstract: A peeling tap adhering method for adhering a peeling tape (4) to a surface protection film (11) adhered to the front surface of a wafer (20), comprises the steps of: supporting the wafer on a table (31) under the condition that the surface protection film is directed upward; adhering the peeling tape onto the surface protection film by pressing the peeling tape onto the surface protection film when a peeling tape adhering means (46) is lowered; detecting the pressure between the surface protection film of the wafer and the peeling tape adhering means; and stopping the peeling tape adhering means from lowering in the case where a pressure detection value (P) is not less than a predetermined value (P0). Due to the foregoing, it is possible to prevent the wafer from being cracked. Further, it is possible to prevent the peeling tape and the dicing tape from adhering to each other. When the distance (L) between the surface protection film of the wafer and the peeling tape adhering means becomes a value not more than a predetermined value (L0), the peeling tape sticking means may be stopped from lowering.

Abstract translation: 一种用于将剥离带（4）粘附到粘附到晶片（20）的前表面上的表面保护膜（11）的剥离剥离粘合方法包括以下步骤：在条件下将晶片支撑在工作台（31）上 表面保护膜被向上引导; 当剥离带粘合装置（46）降低时，通过将剥离带压到表面保护膜上将剥离胶带粘附到表面保护膜上; 检测晶片的表面保护膜和剥离带粘附装置之间的压力; 并且在压力检测值（P）不小于预定值（P 0）的情况下，使剥离胶带粘合装置停止下降。 由于上述原因，可以防止晶片破裂。 此外，可以防止剥离带和切割带彼此粘附。 当晶片的表面保护膜和剥离带粘合装置之间的距离（L）成为不大于预定值（L 0）的值时，可以停止剥离胶带粘附装置的降低。

公开(公告)号：US20070267132A1

公开(公告)日：2007-11-22

申请号：US11744199

申请日：2007-05-03

Applicant: Isamu Kawashima ,  Hideshi Sato ,  Hideo Kino ,  Minoru Ametani

Inventor： Isamu Kawashima ,  Hideshi Sato ,  Hideo Kino ,  Minoru Ametani

IPC: B32B37/12 ,  B32B41/00 ,  B32B38/00

CPC classification number: B29C63/02 ,  B29C63/0004 ,  B29L2031/3425 ,  B65H37/002 ,  Y10T156/10 ,  Y10T156/1705 ,  Y10T156/1712 ,  Y10T156/1734

Abstract: A tape adhering device (10) comprises: a drawing roller (42) for drawing out a tape (3); a tape fixing means (47) for fixing one portion of the tape drawn out from the drawing roller; a tape drawing means (62) for drawing out a predetermined amount of tape, which is fixed by the tape fixing means, from the drawing roller between the tape fixing means and the drawing roller; and a tape adhering means (49, 31, 37) for adhering the tape, which is located in the downstream of the tape fixing means, onto an object to be adhered (20, 36) under the condition that fixing operation of the tape by the tape fixing means is released. It is preferable that the length of the tape drawn out by the tape drawing means is not less than the diameter of the object to be adhered. Due to the foregoing, it is possible to prevent wrinkles from being form on the tape at the time of adhering the tape.

Abstract translation: 胶带粘接装置（10）包括：用于拉出带（3）的拉丝辊（42）; 用于固定从牵引辊引出的一部分带的胶带固定装置（47）; 用于从带固定装置和牵引辊之间的拉丝辊中抽出预定量的由带固定装置固定的胶带的胶带拉伸装置（62）; 以及用于将位于带固定装置的下游的胶带粘附到待粘合物体（20,36）上的带粘合装置（49,31,37），条带是通过 磁带固定装置被释放。 由带拉伸装置引出的带的长度最好不小于被粘物的直径。 由于上述原因，可以防止在胶带粘附时在带上形成褶皱。

公开(公告)号：US6127720A

公开(公告)日：2000-10-03

申请号：US75804

申请日：1998-05-11

Applicant: Hideaki Nakura ,  Isamu Kawashima ,  Jutarou Kotani ,  Hidekazu Nakamura

Inventor： Hideaki Nakura ,  Isamu Kawashima ,  Jutarou Kotani ,  Hidekazu Nakamura

IPC: H01L29/41 ,  H01L21/301 ,  H01L21/316 ,  H01L21/331 ,  H01L21/76 ,  H01L21/762 ,  H01L29/417 ,  H01L29/73 ,  H01L29/732 ,  H01L29/74 ,  H01L21/306

CPC classification number: H01L21/76232

Abstract: A semiconductor device provided with a wide and shallow first groove and a second groove in the first groove area, having a narrower width than that of the first groove around a predetermined area in a one-conductive area provided in the upper region of a semiconductor substrate as a mesa groove, wherein at least the second groove is covered with an electrical insulator. The upper surface of the electrical insulator is located approximately as high as or lower than the upper surface of the electrical insulating film. Thus, especially in a mesa semiconductor device with a high-voltage resistance, an insulating protective layer having a sufficient thickness can be formed stably over the entire region of a mesa groove. As a result, the variation in high-voltage resistance characteristics can be decreased and the processing yield affected by breakage or cracking in the mesa groove region during subsequent processes caused by the formation of the mesa groove can be improved greatly.

Abstract translation: 一种半导体器件，在所述第一沟槽区域中设置有宽而浅的第一沟槽和第二沟槽，所述半导体器件具有比设置在半导体衬底的上部区域中的导电区域中围绕预定区域的第一沟槽的宽度窄的宽度 作为台面凹槽，其中至少第二凹槽被电绝缘体覆盖。 电绝缘体的上表面大致高于或低于电绝缘膜的上表面。 因此，特别是在具有高电压电阻的台面半导体器件中，可以在台面凹槽的整个区域稳定地形成具有足够厚度的绝缘保护层。 结果，可以大大提高高压电阻特性的变化，并且可以大大提高由于台面槽的形成而导致的后续工序中的台面槽区域中的断裂或破裂的加工成品率。