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公开(公告)号：US12083989B2
公开(公告)日：2024-09-10
申请号：US16629179
申请日：2018-07-09
发明人： Bruno Carraro , Eric Kozlowski , Rene Chauvin , Daniel C Wyatt
IPC分类号： B60R22/48 , B29C44/12 , B29C44/58 , B29C45/14 , B29C45/26 , B29K75/00 , B29K105/04 , B29L31/00 , B29L31/30 , B29L31/34 , B60N2/00 , B60R21/01 , G01L1/20 , H05K1/02 , H05K1/03
CPC分类号： B60R22/48 , B29C44/1266 , B29C44/583 , B29C45/14065 , B29C45/26 , B60N2/002 , B60R21/01 , G01L1/205 , H05K1/0296 , H05K1/032 , H05K1/0393 , B29C2045/14147 , B29K2075/00 , B29K2105/04 , B29L2031/3005 , B29L2031/3425 , B29L2031/771 , B60R2022/4808 , H05K2201/10151
摘要： A pressure sensing system (24), seat cushion (20) incorporating the pressure sensing system, and method of sensing a weight group associated with an occupant of an automotive seat are described. The pressure sensing system includes a layer of an electrically conductive foam (28) and a flexible printed circuit (26) that includes a flexible substrate (26a) and N horizontal sensing wires (26b) and M vertical sensing wires (26c) securely placed on a top surface of the flexible substrate. The horizontal sensing wires intersect with the vertical sensing wires and form N×M intersections. The layer of an electrically conductive foam is placed on top of the N horizontal sensing wires and the M vertical sensing wires. When a pressure is applied to the layer of the electrically conductive foam, each intersection generates in real time an electric flux density value to reflect a degree of a compression caused by the pressure to a corresponding point of the electrically conductive foam.
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公开(公告)号：US20180162111A1
公开(公告)日：2018-06-14
申请号：US15575442
申请日：2016-06-03
发明人： Kazutoshi IWATA , Yoshiaki HONMA
CPC分类号： B32B37/1054 , B29C43/28 , B29C43/58 , B29C2043/5808 , B29C2043/5833 , B29K2905/00 , B29L2031/34 , B29L2031/3425 , B32B37/1018 , B32B41/00 , B32B2457/08 , H05K3/4655 , H05K2203/0278 , H05K2203/063 , H05K2203/085 , H05K2203/163
摘要： A laminating apparatus includes workpiece transport units, a vacuum laminating device and a flat press device. The flat press device includes a ball screw having a screw shaft and supporting a first one of a pair of pressing elements, a servomotor connected to the screw shaft of the ball screw, a gap measuring device (linear scale) for measuring a distance between the first pressing element and the second pressing element, and a pressing gap control system for moving the first pressing element to a position in which a predetermined gap is defined between the first pressing element and the second pressing element to stop the first pressing element at that position. The pressing gap control system changes the RPM of the servomotor, based on information on the distance between the first and second pressing elements which is provided from the gap measuring device.
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公开(公告)号：US20180104888A1
公开(公告)日：2018-04-19
申请号：US15292645
申请日：2016-10-13
IPC分类号： B29C59/00 , B29C37/00 , B29C59/02 , H01L21/027
CPC分类号： B29C59/002 , B29C37/0025 , B29C59/022 , B29C59/026 , B29C2059/023 , B29K2105/0058 , B29L2031/3425 , G03F7/00 , G03F7/0002 , H01L21/0271
摘要： A substrate useful for imprint lithography having a location thereon defining an imprint field, the imprint field further defined by an interior region, a perimeter region surrounding the interior region, and a border, with the perimeter region further including fluid control features. A polymerizable material deposited on the substrate at the imprint field location is allowed to spread on the substrate, with the fluid control relief features redirecting the spreading of the polymerizable material so as to minimize spreading of the polymerizable material beyond the imprint field border as further imprint lithography techniques are then performed.
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公开(公告)号：US20180063949A1
公开(公告)日：2018-03-01
申请号：US15247151
申请日：2016-08-25
CPC分类号： H05K1/0353 , B29C35/02 , B29C35/0272 , B29K2105/0872 , B29K2105/162 , B29K2995/0008 , B29L2031/3425 , H05K1/0201 , H05K2201/068 , H05K2201/09009
摘要： A composite material incorporates multi-compartment microcapsules that produce heat when subject to a stimulus such as a compressive force or a magnetic field. The stimulus ruptures an isolating structure within the multi-compartment microcapsule, allowing reactants within the multi-compartment microcapsule to produce heat from an exothermic reaction. In some embodiments, the composite material is a laminate used in the manufacture of multi-layer printed circuit boards (PCBs) and provides heat during the curing process of the multi-layer PCBs to ensure a consistent thermal gradient in the multi-layer product.
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公开(公告)号：US09900988B1
公开(公告)日：2018-02-20
申请号：US14249540
申请日：2014-04-10
申请人： Nien-Hua Chao , John A. Dispenza , Mario DeAngelis
发明人： Nien-Hua Chao , John A. Dispenza , Mario DeAngelis
CPC分类号： H01L21/565 , B29C33/3842 , B29C51/16 , B29C2791/006 , B29L2031/3406 , B29L2031/3425 , H01L2924/0002 , H05K3/0014 , H05K3/284 , H05K2201/0715 , H05K2203/1316 , H05K2203/1322 , H01L2924/00
摘要： A protective layering process that encapsulates and protects printed circuit board assemblies with complex and imprecise geometries. The protective layering process provides a combination of a flexible mold and/or a rigid mold, which are derived from modified data from a 3 dimensional scan of the printed circuit board assembly, and which applies close-forming, encapsulating polymer layers, electrically non-conductive layers, EMI shielding layers, and/or thermal management layers to the electronic components and circuit board assemblies. Polymer layers and protective jackets are shaped to as-populated circuit boards and assemblies, providing tightly fit barriers with fine resolution accommodating imprecise geometries. The protective jackets/layers can be formed in rigid, semi-rigid, or highly flexible polymer films, to protect the circuitry from the elements, CTE mismatches, shock and vibration loads and extreme g-forces, and from internal and external EMI and to manage thermal dissipation. Multiple, nesting layers, each with different protective properties, can be formed and applied.
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公开(公告)号：US09662830B2
公开(公告)日：2017-05-30
申请号：US14748465
申请日：2015-06-24
发明人： Tymon Barwicz , Nicolas Boyer , Paul Fortier , Stephane Harel , Roch Thivierge
CPC分类号： B29C65/483 , B29C65/7847 , B29C66/1122 , B29C66/474 , B29C66/8163 , B29C66/8242 , B29C66/82421 , B29C66/8322 , B29C66/863 , B29C66/9221 , B29C66/9231 , B29D11/00663 , B29D11/00721 , B29L2031/3425 , G02B6/00 , G02B6/12 , G02B6/12004 , G02B6/30
摘要： A bondline control fixture and an active bondline control fixture are provided for affixing first and second components. The bondline control fixture includes a base fixable relative to a first component maneuvering device and comprising a first body defining an aperture and a first chamber and a second body disposable within the first chamber and defining a second chamber, a flexible membrane disposable to seal the second chamber, a mobile plate to which the second component is removably attachable, the mobile plate being disposable in contact with the flexible membrane and a pressure regulating system coupled to the second body and configured to regulate a pressure within the second chamber to deform the flexible membrane.
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公开(公告)号：US09656420B2
公开(公告)日：2017-05-23
申请号：US14700738
申请日：2015-04-30
发明人： Tymon Barwicz , Nicolas Boyer , Paul Fortier , Stephane Harel , Roch Thivierge
CPC分类号： B29C65/483 , B29C65/7847 , B29C66/1122 , B29C66/474 , B29C66/8163 , B29C66/8242 , B29C66/82421 , B29C66/8322 , B29C66/863 , B29C66/9221 , B29C66/9231 , B29D11/00663 , B29D11/00721 , B29L2031/3425 , G02B6/00 , G02B6/12 , G02B6/12004 , G02B6/30
摘要： A bondline control fixture and an active bondline control fixture are provided for affixing first and second components. The bondline control fixture includes a base fixable relative to a first component maneuvering device and comprising a first body defining an aperture and a first chamber and a second body disposable within the first chamber and defining a second chamber, a flexible membrane disposable to seal the second chamber, a mobile plate to which the second component is removably attachable, the mobile plate being disposable in contact with the flexible membrane and a pressure regulating system coupled to the second body and configured to regulate a pressure within the second chamber to deform the flexible membrane.
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公开(公告)号：US20170135210A1
公开(公告)日：2017-05-11
申请号：US15318695
申请日：2015-09-14
申请人： DENSO CORPORATION
CPC分类号： H05K1/115 , B29C43/18 , B29C70/78 , B29C70/88 , B29L2031/3425 , H01L21/565 , H01L23/3121 , H01L2924/0002 , H05K1/181 , H05K3/28 , H01L2924/00
摘要： A manufacturing method of an electronic device, including: a circuit board with a substrate through hole; a circuit element; and a resin mold with a mold through hole, using a first mold, a second mold having a cavity, and a pressing member protruding from a bottom of the cavity includes: fixing the circuit board to the first mold; fixing the second mold to the first mold to cover an opening of the substrate through hole by the pressing member; and forming the resin mold while covering the circuit element with the constituent material in the cavity. The circuit board is deformed by press-contacting the pressing member to the circuit board in a state where a part of the pressing member is inserted into the substrate through hole so that an opening area of the substrate through hole decreases toward a reverse surface from the one surface.
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公开(公告)号：US20170099744A1
公开(公告)日：2017-04-06
申请号：US15379720
申请日：2016-12-15
发明人： SHAO-HAN CHANG
CPC分类号： H05K7/18 , B29C45/14008 , B29C45/14639 , B29K2105/20 , B29K2995/0005 , B29K2995/0007 , B29L2031/3425 , H04M1/0202 , H04M1/0249
摘要： A method for making a multi-part frame for a device, to render different parts of the frame available for electronic and other functions of the device, includes providing a plurality of conductive frames, and making each of the conductive frames with a predetermined shape. Each sheet of a plurality of conductive sheets can be coupled to a conductive frame. The conductive frames so coupled are placed in an injection mold and a predetermined gap maintained between conductive frames. The gap between conductive frames can be filled with insulating material to form an insulated frame, the insulated frame partially covering the plurality of conductive sheets.
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公开(公告)号：US09548284B2
公开(公告)日：2017-01-17
申请号：US14132812
申请日：2013-12-18
申请人： Intel Corporation
IPC分类号： H01L23/00 , H01L21/603 , B29L31/34
CPC分类号： H01L24/75 , B29L2031/34 , B29L2031/3425 , H01L2021/603 , H01L2224/75102 , H01L2224/75252 , H01L2224/75266 , H01L2224/75301 , H01L2224/75501 , H01L2224/75502 , H01L2224/81203 , H01L2224/81801 , H01L2924/01008 , H01L2924/01014 , H01L2924/01022 , H01L2924/0104 , H01L2924/01074 , H01L2924/0474 , H01L2924/0489 , H01L2924/04894 , H01L2924/05032 , H01L2924/0549 , Y10T29/49826
摘要： Embodiments of a thermal compression bonding process bond head and a method for producing a thermal compression bonding process bond head are disclosed. In some embodiments, the bond head includes a thermal compression bonding process heater and a cooling block coupled to the heater through an annular structure. The annular structure surrounds a lower portion of the cooling block and couples the cooling block to the heater such that there is no direct mechanical contact between the cooling block and the heater.
摘要翻译： 公开了热压接工艺粘结头的实施例和用于制造热压接工艺粘合头的方法。 在一些实施例中，接合头包括热压接工艺加热器和通过环形结构联接到加热器的冷却块。 环形结构围绕冷却块的下部并且将冷却块连接到加热器，使得冷却块和加热器之间不存在直接的机械接触。
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