Method of forming a capacitor including a bottom silicon diffusion
barrier layer and a top oxygen diffusion barrier layer
    21.
    发明授权
    Method of forming a capacitor including a bottom silicon diffusion barrier layer and a top oxygen diffusion barrier layer 失效
    形成包括底部硅扩散阻挡层和顶部氧扩散阻挡层的电容器的方法

    公开(公告)号:US6090658A

    公开(公告)日:2000-07-18

    申请号:US911374

    申请日:1997-08-07

    申请人: Jae Hyun Joo

    发明人: Jae Hyun Joo

    CPC分类号: H01L28/75 H01L28/55

    摘要: Capacitor in a semiconductor device suitable for diffusion prevention between a lower electrode and a polysilicon and oxidation prevention of a barrier metal layer and a method for manufacturing the same are disclosed. The capacitor in a semiconductor device includes a semiconductor substrate, an insulating layer having a contact hole on the substrate, a plug formed in the contact hole, a first barrier layer on the plug, a second barrier layer on the first barrier layer, a lower electrode on the second barrier layer, a dielectric layer on the lower electrode, and an upper electrode on the dielectric layer.

    摘要翻译: 公开了适用于下电极和多晶硅之间的扩散防止的半导体器件中的电容器以及阻挡金属层的氧化防止及其制造方法。 半导体器件中的电容器包括半导体衬底,在衬底上具有接触孔的绝缘层,形成在接触孔中的插塞,插塞上的第一阻挡层,第一阻挡层上的第二阻挡层,下部 第二阻挡层上的电极,下电极上的电介质层和介电层上的上电极。