Conductive etch stop for etching a sacrificial layer
    21.
    发明申请
    Conductive etch stop for etching a sacrificial layer 审中-公开
    用于蚀刻牺牲层的导电蚀刻停止

    公开(公告)号:US20050260782A1

    公开(公告)日:2005-11-24

    申请号:US11192621

    申请日:2005-07-28

    Applicant: James Hunter

    Inventor: James Hunter

    Abstract: In one embodiment, a micro device is formed by depositing a sacrificial layer over a metallic electrode, forming a moveable structure over the sacrificial layer, and then etching the sacrificial layer with a noble gas fluoride. Because the metallic electrode is comprised of a metallic material that also serves as an etch stop in the sacrificial layer etch, charge does not appreciably build up in the metallic electrode. This helps stabilize the driving characteristic of the moveable structure. In one embodiment, the moveable structure is a ribbon in a light modulator.

    Abstract translation: 在一个实施例中,通过在金属电极上沉积牺牲层来形成微器件,在牺牲层上形成可移动结构,然后用惰性气体氟化物蚀刻牺牲层。 因为金属电极由在牺牲层蚀刻中也用作蚀刻停止层的金属材料组成,所以电荷在金属电极中不会明显地积聚。 这有助于稳定可移动结构的驱动特性。 在一个实施例中,可移动结构是光调制器中的带状物。

    Interconnect partition binding API, allocation and management of application-specific partitions
    22.
    发明授权
    Interconnect partition binding API, allocation and management of application-specific partitions 有权
    互连分区绑定API,分配和管理特定于应用程序的分区

    公开(公告)号:US09519795B2

    公开(公告)日:2016-12-13

    申请号:US14133803

    申请日:2013-12-19

    Abstract: One system includes one or more host computing systems, each host computing system including at least one execution core and a system memory. The system includes a plurality of virtual partitions executing on the one or more host computing systems and including a first partition having at least a portion of the system memory associated with at least one of the one or more host computing systems and configure to store a database therein. The system also includes an interconnect layer communicatively connecting the plurality of virtual partitions, the interconnect layer providing a programming interface by which direct memory access operations between partitions are coordinated. In response to database commands received at the first partition, the data stored in the database is provided to a requesting partition a direct memory access operation.

    Abstract translation: 一个系统包括一个或多个主机计算系统,每个主机计算系统包括至少一个执行核心和系统存储器。 该系统包括在一个或多个主机计算系统上执行的多个虚拟分区,并且包括具有至少一部分与一个或多个主机计算系统中的至少一个主机计算系统相关联的系统存储器的第一分区,并且配置为存储数据库 其中。 该系统还包括通信地连接多个虚拟分区的互连层,互连层提供编程接口,通过该编程接口协调分区之间的直接存储器访问操作。 响应于在第一分区接收的数据库命令,存储在数据库中的数据被提供给请求分区直接存储器访问操作。

    Microelectromechanical system megasonic transducer
    23.
    发明授权
    Microelectromechanical system megasonic transducer 有权
    微机电系统兆声传感器

    公开(公告)号:US08957564B1

    公开(公告)日:2015-02-17

    申请号:US13172514

    申请日:2011-06-29

    CPC classification number: B08B3/12 B06B1/0292

    Abstract: Megasonic cleaning systems and methods of fabricating and using the same are provided. In one embodiment, the system comprises a plurality of Micro-Electromechanical System (MEMS) transducers, each transducer including a movable membrane with a membrane electrode coupled to a first potential disposed above and spaced apart from an upper surface of a die including a cavity electrode coupled to a second potential, the membrane including multiple layers including a polysilicon layer between a top silicon nitride layer and a bottom silicon nitride layer, and the membrane electrode includes the polysilicon layer; a chuck on which a target workpiece is positioned; and a fluid to couple sonic energy from the plurality of MEMS transducers to the target workpiece. Other embodiments are also provided.

    Abstract translation: 提供了超声波清洗系统及其制造和使用方法。 在一个实施例中,系统包括多个微机电系统(MEMS)换能器,每个换能器包括具有耦合到第一电位的膜电极的可移动膜,所述膜电极设置在模具的上表面上方并与模具的上表面间隔开,所述模具的上表面包括腔电极 耦合到第二电位,所述膜包括多层,包括顶部氮化硅层和底部氮化硅层之间的多晶硅层,并且所述膜电极包括所述多晶硅层; 目标工件所在的卡盘; 以及将来自多个MEMS换能器的声能耦合到目标工件的流体。 还提供了其他实施例。

    Flow Through MEMS Package
    25.
    发明申请
    Flow Through MEMS Package 有权
    流过MEMS封装

    公开(公告)号:US20120307215A1

    公开(公告)日:2012-12-06

    申请号:US13153127

    申请日:2011-06-03

    Abstract: A flow through Micro-Electromechanical Systems (MEMS) package and methods of operating a MEMS packaged using the same are provided. Generally, the package includes a cavity in which the MEMS is enclosed, an inlet through which a fluid is introduced to the cavity during operation of the MEMS and an outlet through which the fluid is removed during operation of the MEMS. In certain embodiments, the fluid includes an gas, such as nitrogen, and the inlet and outlet are adapted to provide a flow of gas of from 0.01 Standard Cubic Centimeters per Minute (sccm) to 10000 sccm during operation of the MEMS. The package and method are particularly useful in packaging spatial light modulators including a reflective surface and adapted to reflect and modulate a light beam incident thereon. Other embodiments are also provided.

    Abstract translation: 提供了通过微机电系统(MEMS)封装的流程以及操作使用其的MEMS封装的方法。 通常,封装包括MEMS封装的空腔,在MEMS运行期间将流体引入空腔的入口以及在MEMS运行期间流体被除去的出口。 在某些实施例中,流体包括气体,例如氮气,并且入口和出口适于在MEMS运行期间提供从0.01标准立方厘米每分钟(sccm)至10000sccm的气体流。 包装和方法在包装空间光调制器包括反射表面并适于反射和调制入射在其上的光束时特别有用。 还提供了其他实施例。

    Discharge from grinding mills
    27.
    发明申请
    Discharge from grinding mills 有权
    从磨粉机排出

    公开(公告)号:US20070012807A1

    公开(公告)日:2007-01-18

    申请号:US10558517

    申请日:2004-05-28

    Applicant: James Hunter

    Inventor: James Hunter

    CPC classification number: B02C17/1855 B02C17/14 B02C17/181

    Abstract: A screening element (35) can be mounted at a discharge passage (28) of a grinding mill chamber (4). The discharge passage is positioned in use to receive ground particles moving thereinto in a discharge direction. The screening element comprises one or more openings (6) defined therein which are oriented such that ground particles pass therethrough in a direction that is oblique with respect to the discharge direction. The grinding mill chamber may form part of a centrifugal grinding mill.

    Abstract translation: 筛分元件(35)可以安装在研磨室(4)的排出通道(28)上。 放电通道定位在使用中以接收沿排出方向移动的磨碎颗粒。 筛分元件包括限定在其中的一个或多个开口(6),其被定向成使得研磨颗粒沿相对于排出方向倾斜的方向通过。 研磨室可以形成离心式研磨机的一部分。

    Pre-deflected bias ribbons
    28.
    发明授权
    Pre-deflected bias ribbons 有权
    预偏转色带

    公开(公告)号:US07042611B1

    公开(公告)日:2006-05-09

    申请号:US10378710

    申请日:2003-03-03

    CPC classification number: G02B26/0808 H01L27/14625

    Abstract: A modulator for and a method of modulating an incident beam of light including means for supporting a plurality of active elements and a plurality of bias elements, each active and bias element including a light reflective planar surface with the light reflective planar surfaces of the plurality of active elements lying in a first parallel plane and the plurality of bias elements lying in a second parallel plane wherein the plurality of active and bias elements are parallel to each other and further wherein the plurality of bias elements are mechanically or electrically deflected with respect to the plurality of active elements. Each of the plurality of bias elements is deflected an odd multiple of the wavelength of an incident light wave divided by four and the plurality of light reflective planar surfaces of the plurality of active elements move between the first parallel plane to the second parallel plane. The deflection of bias elements is optimized to minimize optical attenuation error due to voltage error.

    Abstract translation: 一种用于调制入射光束的调制器和一种调制入射光束的方法,包括用于支撑多个有源元件和多个偏置元件的装置,每个有源偏置元件和偏置元件包括具有多个反射平面的光反射平面的光反射平面 位于第一平行平面中的有源元件和位于第二平行平面中的多个偏置元件,其中多个有源和偏置元件彼此平行,并且其中多个偏置元件相对于 多个有源元件。 多个偏置元件中的每一个偏转了入射光波的四倍的波长的奇数倍,并且多个有源元件的多个光反射平面在第一平行平面与第二平行平面之间移动。 偏置元件的偏转被优化以最小化由于电压误差引起的光衰减误差。

    Stress tuned blazed grating light valve
    29.
    发明授权
    Stress tuned blazed grating light valve 有权
    应力调节闪耀光栅光阀

    公开(公告)号:US06639722B2

    公开(公告)日:2003-10-28

    申请号:US09930820

    申请日:2001-08-15

    CPC classification number: G02B26/0808

    Abstract: A light modulator includes elongated elements arranged parallel to each other and suspended above a substrate. The light modulator operates in a first diffraction mode and in a second diffraction mode. In the first diffraction mode, an incident light diffracts into a single diffraction order. Each of the elongated elements comprises a central blazed portion, a first outer blaze transition, and a second outer blaze transition. The central blaze portion, couples the first outer blaze transition to the second outer blaze transition. Each of the central blazed portions comprises a reflective surface. Selected ones of the central blazed portions comprise a first conductive element. The first outer blaze transition and the second outer blaze transition are coupled to the substrate.

    Abstract translation: 光调制器包括彼此平行布置并悬浮在基板上方的细长元件。 光调制器以第一衍射模式和第二衍射模式工作。 在第一衍射模式中,入射光衍射成单个衍射级。 每个细长元件包括中心闪耀部分,第一外部火焰转变和第二外部火焰转变。 中央火焰部分,将第一外部火焰过渡耦合到第二外部火焰转变。 每个中心闪耀部分包括反射表面。 所选择的中央闪耀部分包括第一导电元件。 第一外部火焰转变和第二外部火焰转变耦合到衬底。

    Method of fabricating an integrated device
    30.
    发明授权
    Method of fabricating an integrated device 有权
    制造集成装置的方法

    公开(公告)号:US08320038B2

    公开(公告)日:2012-11-27

    申请号:US12639899

    申请日:2009-12-16

    Abstract: A method of fabricating an integrated device including a MicroElectroMechanical system (MEMS) and an associated microcircuit is provided. In one embodiment, the method comprises: forming a high temperature capable contact through a dielectric layer to an underlying element of a microcircuit formed adjacent to a MicroElectroMechanical System (MEMS) structure on a substrate; and depositing a layer of conducting material over the dielectric layer, and patterning the layer of conducting material to form a local interconnect (LI) for the microcircuit overlying and electrically coupled to the contact and a bottom electrode for the adjacent MEMS structure. Other embodiments are also provided.

    Abstract translation: 提供了一种制造包括微电子机械系统(MEMS)和相关微电路的集成装置的方法。 在一个实施例中,该方法包括:通过介电层形成高温能力接触到邻近微电子机械系统(MEMS)结构的衬底上形成的微电路的下层元件; 以及在所述电介质层上沉积导电材料层,以及图案化所述导电材料层以形成用于所述微电路的局部互连(L1),所述微电路覆盖并电耦合到所述触点和所述相邻MEMS结构的底部电极。 还提供了其他实施例。

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