Abstract:
The present invention features a robust customizable computing system comprising: a processing control unit; an external object; and means for operably connecting the processing control unit to the external object, the processing control unit introducing intelligence into the external object, thus causing the external object to perform smart functions. The processing control unit preferably comprises: (a) an encasement module comprising a main support chassis having a plurality of wall supports and a plurality of junction centers containing means for supporting a computer component therein, a dynamic back plane that provides support for connecting peripheral and other computing components directly to a system bus without requiring an interface, means for enclosing the main support chassis and providing access to an interior portion of the encasement module; (b) one or more computer processing components disposed within the junction centers of the encasement module; and (c) means for cooling the interior portion of the encasement module.
Abstract:
The present invention relates to providing a single console to access and display or otherwise output user customizable content from a plurality of content sources. In particular, the present invention relates to channeling content from a variety of content sources to the television so as to provide a collection of all digital content that is important to the user and available on a single console, wherein the content may come from competing providers and is customizable by the user. Further, the system dynamically alerts and provides information to the user, wherein the alerts and information is customizable by the user.
Abstract:
The present invention features a non-peripherals-based processing control unit having an encasement module that is very small and durable compared to conventional computer encasement structures. The process control unit is capable of being incorporated into various devices and/or environments, of accepting applied and impact loads, of functioning as a load bearing structure, as well as being able to be processed coupled together with one or more processing control units to provide scaled processing power. The processing control unit of the present invention further features a unique method of cooling using natural convection, as well as utilizing known cooling means, such as liquid or thermoelectric cooling.
Abstract:
The present invention relates to systems and methods for providing a universal computing system. Implementations include a modular motherboard having two or more electronic circuit boards that are connected to form a motherboard. The two or more electronic circuit boards each include a security key structure on a connector for providing a keyed connector therebetween. Computing components may be provided on two of the major surfaces of the first electronic circuit board circuit board. Components are disclosed in which the computing system will not turn on unless the first printed circuit board is electrically connected to the second printed circuit board. A heat sink is disclosed that may be used in the universal computing system. A customizable encasement is disclosed. An expandable memory device is disclosed.
Abstract:
Miniaturization techniques, systems, and apparatus relating to power supplies, memory, interconnections, and LEDS are described herein. Specifically, some aspects of the invention relate to techniques for miniaturization of power supplies. Other aspects relate to systems and methods for optimizing memory performance in a computer device or system. Still further, some aspects relate to systems and methods for miniaturizing and optimizing memory layout on a circuit board. Other aspects relate to systems and methods for attaching an integrated circuit, which comprises an array of pins, to a circuit board through the use of an adaptor that comprises a BGA, and which is configured to electrically and physically attach to the circuit board. Furthermore, some aspects relate to systems and methods for achieving activation of at least one multi-color LED, such as a bi-color or tri-color LED, using multiple electrical ground outputs or signals intended to activate only a single unicolor LED.
Abstract:
The present invention features a robust customizable computing system comprising: a processing control unit; an external object; and means for operably connecting the processing control unit to the external object, the processing control unit introducing intelligence into the external object, thus causing the external object to perform smart functions. The processing control unit preferably comprises: (a) an encasement module comprising a main support chassis having a plurality of wall supports and a plurality of junction centers containing means for supporting a computer component therein, a dynamic back plane that provides support for connecting peripheral and other computing components directly to a system bus without requiring an interface, means for enclosing the main support chassis and providing access to an interior portion of the encasement module; (b) one or more computer processing components disposed within the junction centers of the encasement module; and (c) means for cooling the interior portion of the encasement module.
Abstract:
The present invention features a non-peripherals-based processing control unit having an encasement module that is very small and durable compared to conventional computer encasement structures. The process control unit is capable of being incorporated into various devices and/or environments, of accepting applied and impact loads, of functioning as a load bearing structure, as well as being able to be processed coupled together with one or more processing control units to provide scaled processing power. The processing control unit of the present invention further features a unique method of cooling using natural convection, as well as utilizing known cooling means, such as liquid or thermoelectric cooling.
Abstract:
Systems and methods for providing a dynamically modular processing unit. A modular processing unit is provided as a platform that is lightweight, compact, and is configured to be selectively used alone or oriented with one or more additional processing units in an enterprise. In some implementations, a modular processing unit includes a non-peripheral based encasement, a cooling process (e.g., a thermodynamic convection cooling process, a forced air cooling process, and/or a liquid cooling process), an optimized circuit board configuration, optimized processing and memory ratios, and a dynamic back plane that provides increased flexibility and support to peripherals and applications. The modular processing unit is customizable and may be employed in association with all types of computer enterprises. The platform allows for a plethora of modifications that may be made with minimal impact to the dynamically modular unit, thereby enhancing the usefulness of the platform across all type of application.
Abstract:
The present invention features a robust customizable computing system comprising: a processing control unit; an external object; and means for operably connecting the processing control unit to the external object, the processing control unit introducing intelligence into the external object, thus causing the external object to perform smart functions. The processing control unit preferably comprises: (a) an encasement module comprising a main support chassis having a plurality of wall supports and a plurality of junction centers containing means for supporting a computer component therein, a dynamic back plane that provides support for connecting peripheral and other computing components directly to a system bus without requiring an interface, means for enclosing the main support chassis and providing access to an interior portion of the encasement module; (b) one or more computer processing components disposed within the junction centers of the encasement module; and (c) means for cooling the interior portion of the encasement module.
Abstract:
Systems and methods for providing a dynamically modular processing unit. A modular processing unit is provided as a platform that is lightweight, compact, and is configured to be selectively used alone or oriented with one or more additional processing units in an enterprise. In some implementations, a modular processing unit includes a non-peripheral based encasement, a cooling process (e.g., a thermodynamic convection cooling process, a forced air cooling process, and/or a liquid cooling process), an optimized circuit board configuration, optimized processing and memory ratios, and a dynamic back plane that provides increased flexibility and support to peripherals and applications. The modular processing unit is customizable and may be employed in association with all types of computer enterprises. The platform allows for a plethora of modifications that may be made with minimal impact to the dynamically modular unit, thereby enhancing the usefulness of the platform across all type of application.