Systems and methods for providing a robust computer processing unit
    21.
    发明授权
    Systems and methods for providing a robust computer processing unit 有权
    用于提供强大的计算机处理单元的系统和方法

    公开(公告)号:US08976513B2

    公开(公告)日:2015-03-10

    申请号:US12795439

    申请日:2010-06-07

    Abstract: The present invention features a robust customizable computing system comprising: a processing control unit; an external object; and means for operably connecting the processing control unit to the external object, the processing control unit introducing intelligence into the external object, thus causing the external object to perform smart functions. The processing control unit preferably comprises: (a) an encasement module comprising a main support chassis having a plurality of wall supports and a plurality of junction centers containing means for supporting a computer component therein, a dynamic back plane that provides support for connecting peripheral and other computing components directly to a system bus without requiring an interface, means for enclosing the main support chassis and providing access to an interior portion of the encasement module; (b) one or more computer processing components disposed within the junction centers of the encasement module; and (c) means for cooling the interior portion of the encasement module.

    Abstract translation: 本发明具有可靠的可定制计算系统,其包括:处理控制单元; 外部物体 以及用于将所述处理控制单元可操作地连接到所述外部对象的装置,所述处理控制单元将智能引入到所述外部对象中,从而使所述外部对象执行智能功能。 处理控制单元优选地包括:(a)包围模块,其包括具有多个壁支撑件的主支撑底盘和用于在其中支撑计算机部件的多个连接中心容纳装置,动态背板,其提供连接外围设备和 其他计算组件直接连接到系统总线而不需要接口,用于封装主支撑底盘并提供对包装模块的内部部分的访问的装置; (b)一个或多个计算机处理部件,其布置在包装模块的连接中心内; 和(c)用于冷却包装模块的内部部分的装置。

    Non-peripherals processing control module having improved heat dissipating properties
    23.
    发明授权
    Non-peripherals processing control module having improved heat dissipating properties 有权
    具有改善的散热特性的非外围设备处理控制模块

    公开(公告)号:US08405969B2

    公开(公告)日:2013-03-26

    申请号:US12906836

    申请日:2010-10-18

    CPC classification number: H05K5/02 G06F1/16 G06F1/181 G06F1/20

    Abstract: The present invention features a non-peripherals-based processing control unit having an encasement module that is very small and durable compared to conventional computer encasement structures. The process control unit is capable of being incorporated into various devices and/or environments, of accepting applied and impact loads, of functioning as a load bearing structure, as well as being able to be processed coupled together with one or more processing control units to provide scaled processing power. The processing control unit of the present invention further features a unique method of cooling using natural convection, as well as utilizing known cooling means, such as liquid or thermoelectric cooling.

    Abstract translation: 本发明的特征在于一种非外围设备的处理控制单元,其具有与传统的计算机外壳结构相比非常小和耐用的封装模块。 过程控制单元能够被并入各种装置和/或环境中,以承受用作承载结构的应用和冲击载荷,并且能够被处理与一个或多个处理控制单元耦合在一起 提供缩放的处理能力。 本发明的处理控制单元进一步具有使用自然对流冷却的独特方法,以及利用已知的冷却装置,例如液体或热电冷却。

    SYSTEMS AND METHODS FOR PROVIDING A UNIVERSAL COMPUTING SYSTEM
    24.
    发明申请
    SYSTEMS AND METHODS FOR PROVIDING A UNIVERSAL COMPUTING SYSTEM 审中-公开
    提供通用计算系统的系统和方法

    公开(公告)号:US20120151098A1

    公开(公告)日:2012-06-14

    申请号:US13154325

    申请日:2011-06-06

    Abstract: The present invention relates to systems and methods for providing a universal computing system. Implementations include a modular motherboard having two or more electronic circuit boards that are connected to form a motherboard. The two or more electronic circuit boards each include a security key structure on a connector for providing a keyed connector therebetween. Computing components may be provided on two of the major surfaces of the first electronic circuit board circuit board. Components are disclosed in which the computing system will not turn on unless the first printed circuit board is electrically connected to the second printed circuit board. A heat sink is disclosed that may be used in the universal computing system. A customizable encasement is disclosed. An expandable memory device is disclosed.

    Abstract translation: 本发明涉及用于提供通用计算系统的系统和方法。 实现包括具有两个或多个连接以形成主板的电子电路板的模块化主板。 两个或更多个电子电路板各自包括用于在其间提供键控连接器的连接器上的安全密钥结构。 计算部件可以设置在第一电子电路板电路板的两个主表面上。 公开了其中计算系统将不会打开的组件,除非第一印刷电路板电连接到第二印刷电路板。 公开了可以在通用计算系统中使用的散热器。 公开了可定制的包装。 公开了一种可扩展存储器件。

    MINITURIZATION TECHNIQUES, SYSTEMS, AND APPARATUS RELATNG TO POWER SUPPLIES, MEMORY, INTERCONNECTIONS, AND LEDS
    25.
    发明申请
    MINITURIZATION TECHNIQUES, SYSTEMS, AND APPARATUS RELATNG TO POWER SUPPLIES, MEMORY, INTERCONNECTIONS, AND LEDS 审中-公开
    与电源,存储器,互连和LED相关的MINITURIZATION TECHNIQUES,SYSTEMS,AND APPARATUS RELATNG

    公开(公告)号:US20120002455A1

    公开(公告)日:2012-01-05

    申请号:US13153224

    申请日:2011-06-03

    Abstract: Miniaturization techniques, systems, and apparatus relating to power supplies, memory, interconnections, and LEDS are described herein. Specifically, some aspects of the invention relate to techniques for miniaturization of power supplies. Other aspects relate to systems and methods for optimizing memory performance in a computer device or system. Still further, some aspects relate to systems and methods for miniaturizing and optimizing memory layout on a circuit board. Other aspects relate to systems and methods for attaching an integrated circuit, which comprises an array of pins, to a circuit board through the use of an adaptor that comprises a BGA, and which is configured to electrically and physically attach to the circuit board. Furthermore, some aspects relate to systems and methods for achieving activation of at least one multi-color LED, such as a bi-color or tri-color LED, using multiple electrical ground outputs or signals intended to activate only a single unicolor LED.

    Abstract translation: 本文描述了与电源,存储器,互连和LEDS有关的小型化技术,系统和装置。 具体地,本发明的一些方面涉及用于电源的小型化的技术。 其他方面涉及用于优化计算机设备或系统中的存储器性能的系统和方法。 此外,一些方面涉及用于小型化并优化电路板上的存储器布局的系统和方法。 其他方面涉及通过使用包括BGA的适配器将包括引脚阵列的集成电路连接到电路板的系统和方法,其被配置为电连接和物理地附接到电路板。 此外,一些方面涉及用于使用多个电接地输出或旨在激活单个单色LED的信号来实现至少一个多色LED(例如双色或三色LED)的激活的系统和方法。

    SYSTEMS AND METHODS FOR PROVIDING A ROBUST COMPUTER PROCESSING UNIT
    26.
    发明申请
    SYSTEMS AND METHODS FOR PROVIDING A ROBUST COMPUTER PROCESSING UNIT 有权
    提供强大的计算机处理单元的系统和方法

    公开(公告)号:US20110102991A1

    公开(公告)日:2011-05-05

    申请号:US12795439

    申请日:2010-06-07

    Abstract: The present invention features a robust customizable computing system comprising: a processing control unit; an external object; and means for operably connecting the processing control unit to the external object, the processing control unit introducing intelligence into the external object, thus causing the external object to perform smart functions. The processing control unit preferably comprises: (a) an encasement module comprising a main support chassis having a plurality of wall supports and a plurality of junction centers containing means for supporting a computer component therein, a dynamic back plane that provides support for connecting peripheral and other computing components directly to a system bus without requiring an interface, means for enclosing the main support chassis and providing access to an interior portion of the encasement module; (b) one or more computer processing components disposed within the junction centers of the encasement module; and (c) means for cooling the interior portion of the encasement module.

    Abstract translation: 本发明具有可靠的可定制计算系统,其包括:处理控制单元; 外部物体 以及用于将所述处理控制单元可操作地连接到所述外部对象的装置,所述处理控制单元将智能引入到所述外部对象中,从而使所述外部对象执行智能功能。 处理控制单元优选地包括:(a)包围模块,其包括具有多个壁支撑件的主支撑底盘和用于在其中支撑计算机部件的多个连接中心容纳装置,动态背板,其提供连接外围设备和 其他计算组件直接连接到系统总线而不需要接口,用于封装主支撑底盘并提供对包装模块的内部部分的访问的装置; (b)一个或多个计算机处理部件,其布置在包装模块的连接中心内; 和(c)用于冷却包装模块的内部部分的装置。

    NON-PERIPHERALS PROCESSING CONTROL MODULE HAVING IMPROVED HEAT DISSIPATING PROPERTIES
    27.
    发明申请
    NON-PERIPHERALS PROCESSING CONTROL MODULE HAVING IMPROVED HEAT DISSIPATING PROPERTIES 有权
    具有改进的热处理特性的非外围加工控制模块

    公开(公告)号:US20110090628A1

    公开(公告)日:2011-04-21

    申请号:US12906836

    申请日:2010-10-18

    CPC classification number: H05K5/02 G06F1/16 G06F1/181 G06F1/20

    Abstract: The present invention features a non-peripherals-based processing control unit having an encasement module that is very small and durable compared to conventional computer encasement structures. The process control unit is capable of being incorporated into various devices and/or environments, of accepting applied and impact loads, of functioning as a load bearing structure, as well as being able to be processed coupled together with one or more processing control units to provide scaled processing power. The processing control unit of the present invention further features a unique method of cooling using natural convection, as well as utilizing known cooling means, such as liquid or thermoelectric cooling.

    Abstract translation: 本发明的特征在于一种非外围设备的处理控制单元,其具有与传统的计算机外壳结构相比非常小和耐用的封装模块。 过程控制单元能够被并入各种装置和/或环境中,以承受用作承载结构的应用和冲击载荷,并且能够被处理与一个或多个处理控制单元耦合在一起 提供缩放的处理能力。 本发明的处理控制单元进一步具有使用自然对流冷却的独特方法,以及利用已知的冷却装置,例如液体或热电冷却。

    Systems and methods for providing a dynamically modular processing unit
    28.
    发明授权
    Systems and methods for providing a dynamically modular processing unit 有权
    用于提供动态模块化处理单元的系统和方法

    公开(公告)号:US07764506B2

    公开(公告)日:2010-07-27

    申请号:US11483956

    申请日:2006-07-10

    Abstract: Systems and methods for providing a dynamically modular processing unit. A modular processing unit is provided as a platform that is lightweight, compact, and is configured to be selectively used alone or oriented with one or more additional processing units in an enterprise. In some implementations, a modular processing unit includes a non-peripheral based encasement, a cooling process (e.g., a thermodynamic convection cooling process, a forced air cooling process, and/or a liquid cooling process), an optimized circuit board configuration, optimized processing and memory ratios, and a dynamic back plane that provides increased flexibility and support to peripherals and applications. The modular processing unit is customizable and may be employed in association with all types of computer enterprises. The platform allows for a plethora of modifications that may be made with minimal impact to the dynamically modular unit, thereby enhancing the usefulness of the platform across all type of application.

    Abstract translation: 用于提供动态模块化处理单元的系统和方法。 提供了一种模块化处理单元作为轻量级,紧凑型的平台,并且被配置为单独选择性地使用或者与企业中的一个或多个附加处理单元定向。 在一些实施方式中,模块化处理单元包括非外围设备的包装,冷却过程(例如,热力对流冷却过程,强制空气冷却过程和/或液体冷却过程),优化的电路板配置,优化的 处理和内存比率以及动态背板,可为外围设备和应用提供更大的灵活性和支持。 模块化处理单元是可定制的,可以与所有类型的计算机企业结合使用。 该平台允许对动态模块化单元的最小影响进行大量的修改,从而增强平台跨所有类型应用的有用性。

    Systems and methods for providing a robust computer processing unit
    29.
    发明授权
    Systems and methods for providing a robust computer processing unit 有权
    用于提供强大的计算机处理单元的系统和方法

    公开(公告)号:US07733635B2

    公开(公告)日:2010-06-08

    申请号:US11827360

    申请日:2007-07-09

    Abstract: The present invention features a robust customizable computing system comprising: a processing control unit; an external object; and means for operably connecting the processing control unit to the external object, the processing control unit introducing intelligence into the external object, thus causing the external object to perform smart functions. The processing control unit preferably comprises: (a) an encasement module comprising a main support chassis having a plurality of wall supports and a plurality of junction centers containing means for supporting a computer component therein, a dynamic back plane that provides support for connecting peripheral and other computing components directly to a system bus without requiring an interface, means for enclosing the main support chassis and providing access to an interior portion of the encasement module; (b) one or more computer processing components disposed within the junction centers of the encasement module; and (c) means for cooling the interior portion of the encasement module.

    Abstract translation: 本发明具有可靠的可定制计算系统,其包括:处理控制单元; 外部物体 以及用于将所述处理控制单元可操作地连接到所述外部对象的装置,所述处理控制单元将智能引入到所述外部对象中,从而使所述外部对象执行智能功能。 处理控制单元优选地包括:(a)包围模块,其包括具有多个壁支撑件的主支撑底盘和用于在其中支撑计算机部件的多个连接中心容纳装置,动态背板,其提供连接外围设备和 其他计算组件直接连接到系统总线而不需要接口,用于封装主支撑底盘并提供对包装模块的内部部分的访问的装置; (b)一个或多个计算机处理部件,其布置在包装模块的连接中心内; 和(c)用于冷却包装模块的内部部分的装置。

    Systems and methods for providing a dynamically modular processing unit

    公开(公告)号:US07075784B2

    公开(公告)日:2006-07-11

    申请号:US10691114

    申请日:2003-10-22

    Abstract: Systems and methods for providing a dynamically modular processing unit. A modular processing unit is provided as a platform that is lightweight, compact, and is configured to be selectively used alone or oriented with one or more additional processing units in an enterprise. In some implementations, a modular processing unit includes a non-peripheral based encasement, a cooling process (e.g., a thermodynamic convection cooling process, a forced air cooling process, and/or a liquid cooling process), an optimized circuit board configuration, optimized processing and memory ratios, and a dynamic back plane that provides increased flexibility and support to peripherals and applications. The modular processing unit is customizable and may be employed in association with all types of computer enterprises. The platform allows for a plethora of modifications that may be made with minimal impact to the dynamically modular unit, thereby enhancing the usefulness of the platform across all type of application.

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