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21.发明申请Electronic device including conductive members between a first workpiece and second workpiece 失效电子设备包括在第一工件和第二工件之间的导电构件公开(公告)号：US20060273308A1
公开(公告)日：2006-12-07
申请号：US11270129
申请日：2005-11-09
IPC分类号： H01L29/08
CPC分类号： H01L27/3253 , H01L27/30 , H01L27/3211 , H01L27/3246 , H01L27/3276 , H01L51/0021 , H01L51/0024 , H01L51/5212 , H01L51/5284 , H01L51/56 , H01L2251/568 , Y02E10/549
摘要： An electronic device can include a first workpiece including at least 4,000 electronic components that each include a corresponding electrode and a second workpiece including at least one conductor. The electronic device can also include at least 4,000 conductive members that are substantially directly bonded to the corresponding electrodes and the at least one conductor.
摘要翻译： 电子设备可以包括第一工件，其包括至少4,000个电子部件，每个电子部件包括相应的电极和包括至少一个导体的第二工件。 电子设备还可以包括至少4,000个导电构件，其基本上直接接合到相应的电极和至少一个导体。
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22.发明授权Process for making an organic electronic device having a roughened surface heat sink 有权制造具有粗糙表面散热器的有机电子器件的方法公开(公告)号：US07135357B2
公开(公告)日：2006-11-14
申请号：US10683828
申请日：2003-10-10
CPC分类号： H01L51/529 , H01L23/3675 , H01L33/64 , H01L2924/0002 , H01L2924/00
摘要： An aspect of the present invention provides an organic electronic device includes a heat sink having a side with a roughened surface and/or a black surface and a process for forming devices having such heat sinks including forming a patterned electrically conductive layer includes an electrically conductive member. The process includes selectively forming spaced-apart members. The heat sink includes the spaced-apart members, which are spaced apart from each other and thermally coupled to the electrically conductive member.
摘要翻译： 本发明的一个方面提供了一种有机电子器件，其包括具有粗糙表面和/或黑色表面的侧面的散热器和用于形成具有这种散热器的器件的工艺，包括形成图案化的导电层，包括导电构件 。 该方法包括选择性地形成间隔开的构件。 散热器包括彼此间隔开并热耦合到导电构件的间隔开的构件。
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公开(公告)号：US20060119592A1
公开(公告)日：2006-06-08
申请号：US11005065
申请日：2004-12-06
申请人： Jian Wang , Weixiao Zhang , Gang Yu
发明人： Jian Wang , Weixiao Zhang , Gang Yu
IPC分类号： G09G5/00
CPC分类号： G09G3/3258 , G09G3/3216 , G09G2300/0842 , G09G2320/0242 , G09G2320/029 , G09G2320/043 , G09G2320/0606 , G09G2320/0626 , G09G2320/0693 , G09G2360/145
摘要： An electronic device includes a data processing system and a set of pixels that each include one or more radiation-emitting electronic components, one or more radiation-sensing electronic components, or any combination thereof. The data processing system that is configured to access data regarding the set of pixels and determine at least one calibration value corresponding to the data. The number of the calibration value(s) is less than the number of the pixels within the set. The data processing system is further configured to compare the calibration value(s) to another value and change at least one adjustment factor if the calibration value(s) differs from the other value by more than a predetermined amount. The number of the adjustment factor(s) is less than the number of the pixels within the set. Data processing system readable media and methods for using the electronic device are also described.
摘要翻译： 电子设备包括数据处理系统和一组像素，每个像素包括一个或多个辐射发射电子部件，一个或多个辐射感测电子部件或其任何组合。 所述数据处理系统被配置为访问关于所述像素集合的数据，并且确定与所述数据对应的至少一个校准值。 校准值的数量小于集合内的像素数。 数据处理系统还被配置为如果校准值与另一个值不同于预定量，则将校准值与另一个值进行比较，并改变至少一个调节因子。 调整因子的数量小于集合中像素的数量。 还描述了用于使用电子设备的数据处理系统可读介质和方法。
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公开(公告)号：US20050077615A1
公开(公告)日：2005-04-14
申请号：US10683829
申请日：2003-10-10
IPC分类号： H01L23/367 , H01L51/40 , H01L51/52 , H01L23/10
CPC分类号： H01L51/529 , H01L23/367 , H01L51/0001 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： An aspect of the present invention provides a heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink. The heat sink also has a thickness no greater than 9 mm. In another embodiment, a heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink. The heat sink also has a ratio of area:thickness, as seen from a plan view, of at least 500:1 when the area and thickness are expressed in units of mm2 and mm, respectively.
摘要翻译： 本发明的一个方面提供了一种具有至少部分地延伸穿过散热器的厚度的图案的侧面的散热器。 散热器也具有不大于9mm的厚度。 在另一个实施例中，散热器具有至少部分延伸通过散热器的厚度的图案的一侧。 当面积和厚度分别以mm 2和mm为单位表示时，散热器还具有至少500:1的面积比，从平面图可以看出的厚度比。
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25.发明授权Electronic device including conductive members between a first workpiece and second workpiece 失效电子设备包括在第一工件和第二工件之间的导电构件公开(公告)号：US07667229B2
公开(公告)日：2010-02-23
申请号：US11270129
申请日：2005-11-09
IPC分类号： H01L35/24
CPC分类号： H01L27/3253 , H01L27/30 , H01L27/3211 , H01L27/3246 , H01L27/3276 , H01L51/0021 , H01L51/0024 , H01L51/5212 , H01L51/5284 , H01L51/56 , H01L2251/568 , Y02E10/549
摘要： An electronic device can include a first workpiece including at least 4,000 electronic components that each include a corresponding electrode and a second workpiece including at least one conductor. The electronic device can also include at least 4,000 conductive members that are substantially directly bonded to the corresponding electrodes and the at least one conductor.
摘要翻译： 电子设备可以包括第一工件，其包括至少4,000个电子部件，每个电子部件包括相应的电极和包括至少一个导体的第二工件。 电子设备还可以包括至少4,000个导电构件，其基本上直接接合到相应的电极和至少一个导体。
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26.发明授权Electronic device having a temperature control system including a ductwork assembly 有权具有包括管道组件的温度控制系统的电子设备公开(公告)号：US07233493B2
公开(公告)日：2007-06-19
申请号：US10914871
申请日：2004-08-10
IPC分类号： H05K7/20
CPC分类号： H05K7/20145 , H05K7/20209
摘要： A ductwork assembly can be used with an electronic device wherein the electronic device includes a fan and the ductwork assembly is configured to receive a heat transfer fluid from the fan. A disperser lies within the ductwork assembly and is attached thereto in order to affect at least a portion of a flow of the heat transfer fluid. The ductwork assembly may also include a first channel and the first channel is characterized by a first average fluid velocity that is a highest average fluid velocity of all channels within the ductwork assembly. The ductwork assembly may include a second channel that is characterized by a second average fluid velocity that is a lowest average fluid velocity of all channels within the ductwork assembly. The second averaged fluid velocity may be no less than 90% of the first averaged fluid velocity.
摘要翻译： 管道组件可以与电子设备一起使用，其中电子设备包括风扇，并且管道组件被构造成从风扇接收传热流体。 分散器位于管道组件内并附接到其上以便影响传热流体的流动的至少一部分。 管道组件还可以包括第一通道，并且第一通道的特征在于第一平均流体速度，其是管道组件内的所有通道的最高平均流体速度。 管道组件可以包括第二通道，其特征在于第二平均流体速度，其是管道组件内的所有通道的最低平均流体速度。 第二平均流体速度可以不小于第一平均流体速度的90％。
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公开(公告)号：US20060276096A1
公开(公告)日：2006-12-07
申请号：US11270153
申请日：2005-11-09
IPC分类号： H01J9/50
CPC分类号： H01L27/3253 , H01L27/30 , H01L27/3211 , H01L27/3246 , H01L27/3276 , H01L51/0021 , H01L51/0024 , H01L51/5212 , H01L51/5284 , H01L51/56 , H01L2251/568 , Y02E10/549
摘要： A process for forming an electronic device can include fabricating an electronic device that comprises a first workpiece including a first electronic component that includes a first organic layer. The process can also include repairing the electronic device after fabricating the electronic device.
摘要翻译： 一种用于形成电子器件的方法可以包括制造包括第一工件的电子器件，所述第一工件包括包括第一有机层的第一电子部件。 该过程还可以包括在制造电子设备之后修复电子设备。
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公开(公告)号：US07109520B2
公开(公告)日：2006-09-19
申请号：US10683829
申请日：2003-10-10
IPC分类号： H01L35/241 , H01L51/00
CPC分类号： H01L51/529 , H01L23/367 , H01L51/0001 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： An aspect of the present invention provides a heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink. The heat sink also has a thickness no greater than 9 mm. In another embodiment, a heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink. The heat sink also has a ratio of area:thickness, as seen from a plan view, of at least 500:1 when the area and thickness are expressed in units of mm2 and mm, respectively.
摘要翻译： 本发明的一个方面提供了一种具有至少部分地延伸穿过散热器的厚度的图案的侧面的散热器。 散热器也具有不大于9mm的厚度。 在另一个实施例中，散热器具有至少部分延伸通过散热器的厚度的图案的一侧。 当面积和厚度分别以mm 2和mm的单位表示时，散热器还具有至少500:1的平面视图中的面积：厚度的比率。
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公开(公告)号：US20060138946A1
公开(公告)日：2006-06-29
申请号：US11025102
申请日：2004-12-29
申请人： Jian Wang , Runguang Sun , Gang Yu
发明人： Jian Wang , Runguang Sun , Gang Yu
CPC分类号： H01L51/5281
摘要： An electrical device has a substrate including a transmissive low reflectivity layer; a first conductor on the substrate; an active material on the first conductor; and a second conductor on the active material. The transmissive low reflectivity layer may be moisture penetrating. The substrate may be flexible or rigid.
摘要翻译： 电气装置具有包括透射低反射层的基板; 衬底上的第一导体; 第一导体上的活性材料; 和活性材料上的第二导体。 透射性低反射层可以是透湿的。 衬底可以是柔性的或刚性的。
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30.发明申请Electronic device having a temperature control system including a ductwork assembly 有权具有包括管道组件的温度控制系统的电子设备公开(公告)号：US20060034051A1
公开(公告)日：2006-02-16
申请号：US10914871
申请日：2004-08-10
IPC分类号： H05K7/20
CPC分类号： H05K7/20145 , H05K7/20209
摘要： A ductwork assembly can be used with an electronic device wherein the electronic device includes a fan and the ductwork assembly is configured to receive a heat transfer fluid from the fan. A disperser lies within the ductwork assembly and is attached thereto in order to affect at least a portion of a flow of the heat transfer fluid. The duckwork assembly may also include a first channel and the first channel is characterized by a first average fluid veloicty that is a hightest average fluid velocity of all channels within the ductwork assembly. The ductwork assembly may include a second channel that is characterized by a second average fluid veloicty that is a lowest average fluid velocity of all channels within the ductwork assembly. The second averaged fluid velocity may be no less than 90% of the first averaged fluid velocity.
摘要翻译： 管道组件可以与电子设备一起使用，其中电子设备包括风扇，并且管道组件被构造成从风扇接收传热流体。 分散器位于管道组件内并附接到其上以便影响传热流体的流动的至少一部分。 鸭组件还可以包括第一通道，第一通道的特征在于第一平均流体质量，其是管道组件内所有通道的平均流体速度的最高平均值。 管道组件可以包括第二通道，其特征在于第二平均流体涡轮机，其是管道组件内的所有通道的最低平均流体速度。 第二平均流体速度可以不小于第一平均流体速度的90％。
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