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公开(公告)号：US08262873B2
公开(公告)日：2012-09-11
申请号：US12665687
申请日：2008-06-20
Applicant: Jörg Wurm , Stephane Menard , Lothar Schneider
Inventor： Jörg Wurm , Stephane Menard , Lothar Schneider
CPC classification number: C25D17/10 , C25D17/008 , C25D17/12
Abstract: The invention relates to an anode assembly for electroplating comprising (a) an anode body comprising soluble anode material and (b) a shielding covering at least part of the anode body and comprising a self-passivating metal electrically connected to the anode body and allowing electrolyte transport therethrough. The shielding comprises at least one layer of self-passivating metal having no openings larger than 2 mm, preferably 1 mm, in width or the shielding comprises at least two layers of self-passivating metal wherein the openings of at least one layer are at least partially covered by the metal of another layer. The invention also relates to a shielded anode basket, a method for electroplating and the use of the anode assembly and the shielded anode basket.
Abstract translation: 本发明涉及一种用于电镀的阳极组件，其包括（a）包含可溶性阳极材料的阳极体和（b）覆盖阳极体的至少一部分的屏蔽层，并且包括与阳极体电连接并允许电解质的自钝化金属 运输通过。 该屏蔽包括至少一层自身钝化金属层，其宽度不大于2mm，优选1mm的开口，或屏蔽层包括至少两层自钝化金属，其中至少一层的开口至少为 部分被另一层的金属覆盖。 本发明还涉及屏蔽阳极筐，电镀方法以及阳极组件和屏蔽阳极筐的使用。
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公开(公告)号：US20060124454A1
公开(公告)日：2006-06-15
申请号：US10540232
申请日：2003-12-23
Applicant: Jorg Wurm , Stephane Menard
Inventor： Jorg Wurm , Stephane Menard
IPC: B23H3/04
CPC classification number: C25D17/10
Abstract: The present invention relates to an anode for electroplating, which has an anode base and a shield and is characterized in that additive degradation is reduced when it is used in electroplating.
Abstract translation: 本发明涉及一种用于电镀的阳极，其具有阳极基底和屏蔽层，其特征在于当用于电镀时，添加剂降解降低。
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公开(公告)号：US6071398A
公开(公告)日：2000-06-06
申请号：US944753
申请日：1997-10-06
Applicant: James L. Martin , Stephane Menard , David N. Michelen
Inventor： James L. Martin , Stephane Menard , David N. Michelen
CPC classification number: C25D3/38 , C25D5/18 , H05K3/241 , H05K3/423 , Y10S205/92
Abstract: The present invention relates to a method of electrodepositing metal onto a substrate, which comprises applying a pulsed periodic reverse current across the electrodes of a plating cell utilizing a peak reverse current density and peak forward current density; and varying the ratio of peak reverse current density to peak forward current density in periodic cycles to provide metal deposits of uniform thickness and appearance upon the substrate. The invention also relates to a process for improving the properties of an electrodeposit, particularly on substrates having uneven surfaces or apertures, by using programmed pulse periodic reverse current modulation. More particularly, it involves varying the anodic to cathodic current density ratio, in order to improve the surface uniformity appearance, grain structure and levelling of the deposit while maintaining high current density throwing power.
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