Solid Electrolytic Capacitor and Improved Method for Manufacturing a Solid Electrolytic Capacitor
    21.
    发明申请
    Solid Electrolytic Capacitor and Improved Method for Manufacturing a Solid Electrolytic Capacitor 有权
    固体电解电容器和改进的固体电解电容器制造方法

    公开(公告)号:US20140340819A1

    公开(公告)日:2014-11-20

    申请号:US13896672

    申请日:2013-05-17

    Abstract: An improved process for forming a capacitor, and improved capacitor formed thereby is described. The process includes: providing an anode comprising a dielectric thereon; applying a first layer of an intrinsically conducting polymer on the dielectric to form a capacitor precursor; applying at least one subsequent layer of an intrinsically conducting polymer on the first layer from a dispersion; and treating the capacitor precursor at a temperature of at least 50° C. no more than 200° C. at a relative humidity of at least 25% up to 100%, or fusing the layered structure by swelling the layered structure with a liquid and at least partially removing the liquid.

    Abstract translation: 描述了一种用于形成电容器的改进方法以及由此形成的改进的电容器。 该方法包括:在其上提供包含电介质的阳极; 将第一层本征导电聚合物施加在电介质上以形成电容器前体; 从分散体在第一层上施加至少一个本征导电聚合物的后续层; 并且在至少50℃至不超过200℃的温度下处理电容器前体,相对湿度至少为25%至100%,或者通过用液体使层状结构溶胀而使层状结构熔融, 至少部分地去除液体。

    Utilization of moisture in hermetically sealed solid electrolytic capacitors and capacitors made thereof

    公开(公告)号:USRE47373E1

    公开(公告)日:2019-04-30

    申请号:US14609591

    申请日:2015-01-30

    Abstract: A method for forming a hermetically sealed capacitor including: forming an anode; forming a dielectric on the anode; forming a conductive layer on the dielectric thereby forming a capacitive element; inserting the capacitive element into a casing; electrically connecting the anode to an exterior anode connection; electrically connecting the cathode to an exterior cathode connection; filling the casing with an atmosphere comprising a composition, based on 1 kg of atmosphere, of at least 175 g to no more than 245 g of oxygen, at least 7 g to no more than 11 g of water, at least 734 grams to no more than 818 grams of nitrogen and no more than 10 grams of a minor component; and hermetically sealing the casing with the atmosphere with the capacitive element contained in the casing.

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