公开(公告)号：US20120199921A1

公开(公告)日：2012-08-09

申请号：US13502083

申请日：2010-10-13

申请人： Shuji Tanaka ,  Masayoshi Esashi ,  Masanori Muroyama ,  Sakae Matsuzaki ,  Mitsutoshi Makihata ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Takahiro Nakayama ,  Ui Yamaguchi ,  Hitoshi Yamada

发明人： Shuji Tanaka ,  Masayoshi Esashi ,  Masanori Muroyama ,  Sakae Matsuzaki ,  Mitsutoshi Makihata ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Takahiro Nakayama ,  Ui Yamaguchi ,  Hitoshi Yamada

IPC分类号： H01L29/84 ,  H01L21/50

CPC分类号： B81C1/00238 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C2201/019 ,  B81C2203/032 ,  B81C2203/0792 ,  G01L1/146 ,  G01L1/148 ,  G01L5/228 ,  H01L23/10 ,  H01L24/04 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/94 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/00

摘要： Provided is a technique for packaging a sensor structure having a contact sensing surface and a signal processing LSI that processes a sensor signal. The sensor structure has the contact sensing surface and sensor electrodes. The signal processing integrated circuit is embedded in a semiconductor substrate. The sensor structure and the semiconductor substrate are bonded by a bonding layer, forming a sensor device as a single chip. The sensor electrodes and the integrated circuit are sealed inside the sensor device, and the sensor electrodes and external terminals of the integrated circuit are led out to the back surface of the semiconductor substrate through a side surface of the semiconductor substrate.

摘要翻译： 提供了一种用于封装具有接触感测表面的传感器结构和处理传感器信号的信号处理LSI的技术。 传感器结构具有接触感应表面和传感器电极。 信号处理集成电路嵌入在半导体衬底中。 传感器结构和半导体衬底通过接合层粘接，形成传感器装置作为单个芯片。 传感器电极和集成电路密封在传感器装置的内部，并且集成电路的传感器电极和外部端子通过半导体衬底的侧表面被引出到半导体衬底的背面。