Abstract:
A memory device is disclosed. The memory device includes a charge trapping layer, and a substrate underlying the charge trapping layer. The carriers are introduced into the charge trapping layer to make a first memory state, for example, when a positive voltage is applied to the gate. At least one of the carriers is released from the charge trapping layer to make a second memory state, for example, when a negative voltage is applied to the gate.
Abstract:
A method for operating a dielectric charge trapping memory cell as described herein includes applying an initial voltage from the gate to the substrate of the memory cell for a predetermined period of time to reduce the threshold voltage of the memory cell. The method includes applying a sequence of voltages from the gate to the substrate of the memory cell to further reduce the threshold voltage of the memory cell, wherein a subsequent voltage in the sequence of voltages has a lower magnitude from the gate to the substrate than that of a preceding voltage in the sequence of voltages.
Abstract:
A semiconductor device having a non-volatile memory and a method of manufacturing the same are provided. The semiconductor device includes a base material and a stack structure. The stack structure disposed on the base material at least includes a tunneling layer, a trapping layer and a dielectric layer. The trapping layer is disposed on the tunneling layer. The dielectric layer has a dielectric constant and is disposed on the trapping layer. The dielectric layer is transformed from a first solid state to a second solid state when the dielectric layer undergoes a process.
Abstract:
A blocking dielectric engineered, charge trapping memory cell includes a charge trapping element that is separated from a gate by a blocking dielectric including a buffer layer in contact with the charge trapping element, such as silicon dioxide which can be made with high-quality, and a second capping layer in contact with said one of the gate and the channel. The capping layer has a dielectric constant that is higher than that of the first layer, and preferably includes a high-κ material. The second layer also has a conduction band offset that is relatively high. A bandgap engineered tunneling layer between the channel and the charge trapping element is provided which, in combination with the multilayer blocking dielectric described herein, provides for high-speed erase operations by hole tunneling. In an alternative, a single layer tunneling layer is used.
Abstract:
A charge trapping memory cell is described, having pocket implants along the sides of the channel and having the same conductivity type as the channel, and which implants have a concentration of dopants higher than in the central region of the channel. This effectively disables the channel in the region of non-uniform charge trapping caused by a bird's beak or other anomaly in the charge trapping structure on the side of the channel. The pocket implant can be formed using a process compatible with standard shallow trench isolation processes.
Abstract:
A non-volatile memory located on a substrate is provided. The non-volatile memory includes a tunnel layer, a charge trapping composite layer, a gate and a source/drain region. The tunnel layer is located on the substrate, the charge trapping composite layer is located on the tunnel layer and the gate is located over the charge trapping composite layer. The source/drain region is located in the substrate on both sides of the tunnel layer. With the charge trapping composite layer, the non-volatile memory has relatively better programming and erasing performance and higher data retention ability. Furthermore, since there is no need to perform a thermal process in the formation of the charge trapping composite layer, thermal budget of the manufacturing process is low.
Abstract:
A method for programming and erasing charge-trapping memory device is provided. The method includes applying a first negative voltage to a gate causing a dynamic balance state (RESET\ERASE state). Next, a positive voltage is applied to the gate to program the device. Then, a second negative voltage is applied to the gate to restore the device to the RESET\ERASE state.
Abstract:
A non-volatile memory located on a substrate is provided. The non-volatile memory includes a tunnel layer, a charge trapping composite layer, a gate and a source/drain region. The tunnel layer is located on the substrate, the charge trapping composite layer is located on the tunnel layer and the gate is located over the charge trapping composite layer. The source/drain region is located in the substrate on both sides of the tunnel layer. With the charge trapping composite layer, the non-volatile memory has relatively better programming and erasing performance and higher data retention ability. Furthermore, since there is no need to perform a thermal process in the formation of the charge trapping composite layer, thermal budget of the manufacturing process is low.
Abstract:
A band gap engineered, charge trapping memory cell includes a charge trapping element that is separated from a gate by a blocking layer of metal doped silicon oxide material having a medium dielectric constant, such as aluminum doped silicon oxide, and separated from the semiconductor body including the channel by an engineered tunneling dielectric.
Abstract:
A programming method for a p-channel memory cell, the memory cell includes a source, a drain and a gate. The gate is applies with a first voltage, which results in Fowler-Nordheim (−FN) hole injection, thereby causing the memory cell to be in a programmed state.