公开(公告)号：US12253300B2

公开(公告)日：2025-03-18

申请号：US18034864

申请日：2021-11-01

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong Jung ,  Deokhyun Youn ,  Duchan Ki

IPC: F16L59/065 ,  F16L59/08 ,  F25D23/02 ,  F25D23/06

Abstract: A vacuum adiabatic body according to an embodiment may include a first plate, a second plate, and a seal that seals a gap between the first plate and the second plate. Optionally, the vacuum adiabatic body according to an embodiment may include a support that maintains a vacuum space. Optionally, the vacuum adiabatic body according to an embodiment may include a heat transfer resistor that reduces an amount of heat transfer between the first plate and the second plate. Optionally, the vacuum adiabatic body may include a component coupling portion connected to at least one of the first or second plate so that a component is coupled thereto. Accordingly, the vacuum adiabatic body may be improved in productivity.

公开(公告)号：US12253296B2

公开(公告)日：2025-03-18

申请号：US18415345

申请日：2024-01-17

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong Jung ,  Daewoong Kim ,  Hyeunsik Nam ,  Deokhyun Youn

IPC: F16L59/065 ,  F25D23/00 ,  F25D23/06 ,  F25D23/02 ,  F25D23/08

Abstract: A vacuum adiabatic body includes a heat exchange pipeline and a sealing assembly. The heat exchange pipeline includes at least two pipelines which pass through a first plate and a second plate to allow a refrigerant to move between inner and outer spaces. The sealing assembly allows the heat exchange pipeline to pass through the first plate and the second plate without contacting a vacuum space provided between the first and second plates.

公开(公告)号：US12247778B2

公开(公告)日：2025-03-11

申请号：US18034963

申请日：2021-11-01

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong Jung ,  Deokhyun Youn ,  Bongjin Kim ,  Jaehyun Bae

IPC: F16L59/065 ,  F25D23/06

Abstract: A vacuum adiabatic body of the present embodiment may include a first plate, a second plate, a seal configured to seal the first plate and the second plate to provide a vacuum space, and a support configured to maintain the vacuum space. Alternatively, the support may include a first support having a first support plate formed in a grid shape, and a plurality of spacer coupling portions configured to protrude from the first support plate. Alternatively, the support may include a second support having a second support plate formed in a grid shape, and a plurality of spacers protruding from the second support plate and coupled to each of the plurality of spacer coupling parts to form a plurality of bars together with the plurality of spacer coupling parts. Alternatively, the support may include a radiation resistance sheet supported by a portion of the plurality of bars and spaced apart from at least one of the first support plate and the second support plate. Alternatively, each of the support plates may include a plurality of through-holes. Alternatively, a plurality of distribution structures generated after injection molding the first and second supports and spaced apart from each other may be provided in some of the plurality of through-holes of each support plate.

公开(公告)号：US20250035369A1

公开(公告)日：2025-01-30

申请号：US18911421

申请日：2024-10-10

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong JUNG ,  Deokhyun Youn ,  Daewoong Kim

IPC: F25D23/06

Abstract: Provided is a vacuum adiabatic body. The vacuum adiabatic body includes a cover assembly configured to cover the conductive resistance sheet. The cover assembly includes an inner cover configured to protect an inside, an outer cover configured to protect an outside, and a front cover configured to a front side, and at least one of the inner cover or the outer cover extends toward the other end of at least one of the first plate or the second plate. According to the embodiments, an edge and a side surface of the vacuum adiabatic body may be protected together.

公开(公告)号：US12169094B2

公开(公告)日：2024-12-17

申请号：US17622497

申请日：2020-07-08

Applicant: LG ELECTRONICS INC.

Inventor： Bongjin Kim ,  Deokhyun Youn ,  Jangseok Lee

IPC: F25D23/06 ,  F25D23/08

Abstract: Provided is a vacuum adiabatic body. The vacuum adiabatic body includes a first plate configured to define at least a portion of a wall for a first space, a second plate configured to define at least a portion of a wall for a second space having a temperature different from that of the first space, a seal configured to seal the first plate and the second plate so as to provide a third space that has a temperature between a temperature of the first space and a temperature of the second space and is in a vacuum state, and a support configured to maintain the third space. Therefore, the vacuum adiabatic module that is thermally insulated with the vacuum, independently applied at various places, and conveniently used may be realized.

公开(公告)号：US20240361070A1

公开(公告)日：2024-10-31

申请号：US18762943

申请日：2024-07-03

Applicant: LG ELECTRONICS INC.

Inventor： Jaehyun Bae ,  Wonyeong Jung ,  Deokhyun Youn

IPC: F25D23/06 ,  F25D11/02 ,  F25D23/02 ,  F25D23/08

CPC classification number: F25D23/068 ,  F25D11/02 ,  F25D23/028 ,  F25D23/063 ,  F25D23/087 ,  F25D2201/14

Abstract: Provided is a vacuum adiabatic body. The vacuum adiabatic body includes a thin pipe passing through the main body to connect an inside of the accommodation space to an outside of the accommodation portion, a drain pipe provided inside the thin pipe to discharge the defrosting water, and an adiabatic material having an extension extending along the drain pipe to block heat transfer between the drain pipe and the thin pipe and a head provided at one side of both sides of the extension, which is close to the accommodation space.

公开(公告)号：US12078409B2

公开(公告)日：2024-09-03

申请号：US16710720

申请日：2019-12-11

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong Jung ,  Deokhyun Youn ,  Daewoong Kim

IPC: F25B13/00 ,  F25D23/02 ,  F25D23/06 ,  F25D23/08

CPC classification number: F25D23/066 ,  F25B13/00 ,  F25D23/02 ,  F25D23/028 ,  F25D23/06 ,  F25D23/087 ,  F25D2201/14

Abstract: A vacuum adiabatic body includes a first plate; a second plate; a seal; a support; a heat resistance unit; and an exhaust port, wherein the heat resistance unit includes a conductive resistance sheet connected to the first plate, the conductive resistance sheet resisting heat conduction flowing along a wall for the third space, the conductive resistance sheet includes a shielding part for heat-insulating the conductive resistance sheet by shielding a first surface of the conductive resistance sheet, and a second surface of the conductive resistance sheet is heat-insulated by the third space.

公开(公告)号：US11959693B2

公开(公告)日：2024-04-16

申请号：US17043333

申请日：2019-06-26

Applicant: LG ELECTRONICS INC.

Inventor： Sol Han ,  Hyeunsik Nam ,  Wonyeong Jung ,  Deokhyun Youn

IPC: F25D11/02 ,  F16L59/02 ,  F16L59/065 ,  F25D23/06

CPC classification number: F25D23/065 ,  F16L59/02 ,  F16L59/065 ,  F25D11/02 ,  F25D2201/00 ,  F25D2201/14 ,  F25D2317/043

Abstract: A vacuum adiabatic body includes a first plate configured to define at least a portion of a wall for a first space, a second plate configured to define at least a portion of a wall for a second space having a temperature different from that of the first space, and a support configured to maintain the third space. The support includes a coupling mechanism by which a first support plate and a second support plate are coupled to each other and integrated with each other and a seating mechanism configured to maintain a gap between the first support plate and the second support plate at points at which the first support plate and the second support plate contact each other. The seating mechanisms are spaced apart from the coupling mechanism.

公开(公告)号：US11926000B2

公开(公告)日：2024-03-12

申请号：US17209776

申请日：2021-03-23

Applicant: LG ELECTRONICS INC. ,  UNIST ACADEMY-INDUSTRY RESEARCH CORPORATION

Inventor： Wonyeong Jung ,  Deokhyun Youn ,  Jangseok Lee ,  Hyungson Ki

IPC: B23K26/08 ,  B23K26/12 ,  B23K26/20 ,  B23K26/244 ,  B23K26/28 ,  B23K37/04 ,  B23K101/12 ,  F25D23/06

CPC classification number: B23K26/08 ,  B23K26/123 ,  B23K26/127 ,  B23K26/206 ,  B23K26/244 ,  B23K26/28 ,  B23K37/0435 ,  F25D23/06 ,  B23K2101/12 ,  F25D2201/14 ,  F25D2500/02

Abstract: A refrigerator includes a vacuum adiabatic body including a conductive resistance sheet providing a vacuum space that has a temperature between a temperature of an internal space and a temperature of an external space and is in a vacuum state, the conductive resistance sheet capable of resisting heat conduction between a first plate and a second plate, wherein at least one of the conductive resistance sheet and each of the first and second plates are welded to each other to create a welding part, wherein a plurality of regular beads are provided to a surface of the welding part, and wherein the plurality of regular beads includes: a parabolic inflection region provided at a center portion; linear regions respectively provided at both outsides of the inflection region; and edge regions respectively provided at outsides of the linear regions.

公开(公告)号：US11598476B2

公开(公告)日：2023-03-07

申请号：US16977583

申请日：2019-06-26

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong Jung ,  Deokhyun Youn ,  Jangseok Lee

IPC: F25D19/00 ,  F16L59/065 ,  F25D23/00 ,  F25D23/06 ,  F25D23/08

Abstract: A vacuum adiabatic body includes a heat exchange pipeline and a sealing plug. The heat exchange pipeline includes at least two pipelines which pass through a first plate and a second plate to allow a refrigerant to move between inner and outer spaces. The sealing plug allows the heat exchange pipeline to pass through a first point of the first plate and a second point of the second plate without contacting a third space.