公开(公告)号：US20150333246A1

公开(公告)日：2015-11-19

申请号：US14710946

申请日：2015-05-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Min Lee ,  Sang Gon Kim ,  Sook Hyun Kim ,  Chae Hoon Kim ,  Myoung Lae Roh ,  Joong Hyun Park ,  Hyung Min Sohn ,  Jong Bae Shin ,  Boone Won ,  Yong Sang Cho ,  Yun Kyoung Jo

IPC: H01L35/32 ,  H01L35/30

CPC classification number: H01L35/30 ,  H01L35/32

Abstract: Provided is a heat conversion device, including: a unit thermoelectric module including a first semiconductor element and a second semiconductor element; and a heat conversion module performing heat conversion by coming into contact with the unit thermoelectric module, wherein the heat conversion module includes: a heat conversion substrate coming into direct contact with at least any one of one end and the other end of the first semiconductor element or the second semiconductor element; and a radiating unit disposed on the heat conversion substrate.

Abstract translation: 提供一种热转换装置，包括：单元热电模块，包括第一半导体元件和第二半导体元件; 以及通过与所述单元热电模块接触来进行热转换的热转换模块，其中所述热转换模块包括：热转换衬底，其与所述第一半导体元件的一端和另一端中的至少任一个直接接触 或第二半导体元件; 以及设置在所述热转换基板上的辐射单元。