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公开(公告)号：US09947854B2
公开(公告)日：2018-04-17
申请号：US14913220
申请日：2014-08-20
Applicant: LG INNOTEK CO., LTD.
Inventor： Yong Sang Cho , Sang Gon Kim , Sook Hyun Kim , Chae Hoon Kim , Myoung Lae Roh , Jong Bae Shin , Boone Won , Jong Min Lee
CPC classification number: H01L35/325 , H01L35/30 , H01L35/32
Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.
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公开(公告)号：US20160218266A1
公开(公告)日：2016-07-28
申请号：US14917162
申请日：2014-09-04
Applicant: LG INNOTEK CO., LTD.
Inventor： Sang Gon Kim , Yong Sang Cho , Boone Won , Hyung Eui Lee
Abstract: Embodiments of the present invention relate to a thermoelectric module used for cooling, and provide a thermoelectric module comprising: substrates facing each other; and a first semiconductor element and a second semiconductor element arranged between the substrates and electrically connected to each other, wherein the first semiconductor element and the second semiconductor element have mutually different volumes. The present invention has a structure allowing the cooling effect to be raised by having, in a unit cell comprising thermoelectric semiconductor elements, any one from among the semiconductor elements facing each other to have a volume greater than the other to enhance the rise in electrical conductivity.
Abstract translation: 本发明的实施例涉及一种用于冷却的热电模块，并且提供一种热电模块，包括：彼此面对的基板; 以及布置在所述基板之间并彼此电连接的第一半导体元件和第二半导体元件，其中所述第一半导体元件和所述第二半导体元件具有相互不同的体积。 本发明具有通过在包含热电半导体元件的单电池中彼此面对的半导体元件中的任何一个具有大于另一个半导体元件的体积而增加导电性的升高的结构，从而提高冷却效果 。
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Patent Agency Ranking
公开(公告)号：US10903410B2
公开(公告)日：2021-01-26
申请号：US16402582
申请日：2019-05-03
Applicant: LG INNOTEK CO., LTD.
Inventor： Yong Sang Cho , Sang Gon Kim , Sook Hyun Kim , Chae Hoon Kim , Myoung Lae Roh , Jong Bae Shin , Boone Won , Jong Min Lee
Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.
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公开(公告)号：US10326070B2
公开(公告)日：2019-06-18
申请号：US15914116
申请日：2018-03-07
Applicant: LG INNOTEK CO., LTD.
Inventor： Yong Sang Cho , Sang Gon Kim , Sook Hyun Kim , Chae Hoon Kim , Myoung Lae Roh , Jong Bae Shin , Boone Won , Jong Min Lee
Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.
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公开(公告)号：US09595652B2
公开(公告)日：2017-03-14
申请号：US14607217
申请日：2015-01-28
Applicant: LG INNOTEK CO., LTD.
Inventor： Sang Gon Kim , Sook Hyun Kim , Jong Bae Shin , Boone Won , Yong Sang Cho , Hyung Eui Lee
CPC classification number: H01L35/16 , C22C1/0483 , C22C32/0015 , C22C32/0089 , H01L35/00 , H01L35/18 , H01L35/22
Abstract: Provided is a thermoelectric material including metal oxide powder and thermoelectric powder. Thus, an internal filling rate is improved so that a Peltier effect can be maximized according to the increase of electrical conductivity and a Seebeck coefficient and the reduction of thermal conductivity, thereby enabling the improvement of the figure of merit (ZT) of a thermoelectric element.
Abstract translation: 提供了包括金属氧化物粉末和热电粉末的热电材料。 因此，内部填充率提高，从而可以根据导电率和塞贝克系数的增加以及热导率的降低来最大化珀尔帖效应，从而能够提高热电元件的品质因数（ZT） 。
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6.发明申请Thermoelectric Element, Thermoelectric Module Comprising Same, and Heat Conversion Apparatus 审中-公开热电元件，包括其的热电模块和热转换装置公开(公告)号：US20160204325A1
公开(公告)日：2016-07-14
申请号：US14913530
申请日：2014-08-20
Applicant: LG INNOTEK CO., LTD.
Inventor： Yong Sang Cho , Sang Gon Kim , Sook Hyun Kim , Chae Hoon Kim , Myoung Lae Roh , Jong Bae Shin , Boone Won , Jong Min Lee
Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module, and may provide a thermoelectric element and a thermoelectric module having notably improved cooling capacity (Qc) and rate of temperature change (AT) to be provided by constructing the thermoelectric element by stacking unit members, each of which comprises a semiconductor layer on a substrate, thereby lowering thermal conductivity and raising electric conductivity.
Abstract translation: 本发明的实施例涉及一种热电元件和热电模块，并且可以提供一种热电元件和热电模块，其具有明显提高的冷却能力（Qc）和温度变化率（AT），其通过构造热电元件 通过堆叠单元构件，每个单元构件在衬底上包括半导体层，从而降低导热性并提高导电性。
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公开(公告)号：US20150333246A1
公开(公告)日：2015-11-19
申请号：US14710946
申请日：2015-05-13
Applicant: LG INNOTEK CO., LTD.
Inventor： Jong Min Lee , Sang Gon Kim , Sook Hyun Kim , Chae Hoon Kim , Myoung Lae Roh , Joong Hyun Park , Hyung Min Sohn , Jong Bae Shin , Boone Won , Yong Sang Cho , Yun Kyoung Jo
Abstract: Provided is a heat conversion device, including: a unit thermoelectric module including a first semiconductor element and a second semiconductor element; and a heat conversion module performing heat conversion by coming into contact with the unit thermoelectric module, wherein the heat conversion module includes: a heat conversion substrate coming into direct contact with at least any one of one end and the other end of the first semiconductor element or the second semiconductor element; and a radiating unit disposed on the heat conversion substrate.
Abstract translation: 提供一种热转换装置，包括：单元热电模块，包括第一半导体元件和第二半导体元件; 以及通过与所述单元热电模块接触来进行热转换的热转换模块，其中所述热转换模块包括：热转换衬底，其与所述第一半导体元件的一端和另一端中的至少任一个直接接触 或第二半导体元件; 以及设置在所述热转换基板上的辐射单元。
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