HEAT CONVERSION DEVICE
    5.
    发明申请
    HEAT CONVERSION DEVICE 审中-公开
    热转换装置

    公开(公告)号:US20150333246A1

    公开(公告)日:2015-11-19

    申请号:US14710946

    申请日:2015-05-13

    CPC classification number: H01L35/30 H01L35/32

    Abstract: Provided is a heat conversion device, including: a unit thermoelectric module including a first semiconductor element and a second semiconductor element; and a heat conversion module performing heat conversion by coming into contact with the unit thermoelectric module, wherein the heat conversion module includes: a heat conversion substrate coming into direct contact with at least any one of one end and the other end of the first semiconductor element or the second semiconductor element; and a radiating unit disposed on the heat conversion substrate.

    Abstract translation: 提供一种热转换装置,包括:单元热电模块,包括第一半导体元件和第二半导体元件; 以及通过与所述单元热电模块接触来进行热转换的热转换模块,其中所述热转换模块包括:热转换衬底,其与所述第一半导体元件的一端和另一端中的至少任一个直接接触 或第二半导体元件; 以及设置在所述热转换基板上的辐射单元。

    Power-generating apparatus
    6.
    发明授权

    公开(公告)号:US12219875B2

    公开(公告)日:2025-02-04

    申请号:US17755820

    申请日:2020-11-02

    Abstract: A power-generating apparatus according to an embodiment of the present invention comprises: a housing in which a fluid flows along the interior thereof and at least a portion of the wall surface thereof includes a flat surface formed of metal; a thermoelectric module disposed on the flat surface of the housing; and an insulating member disposed on the flat surface of the housing so as to be beside the thermoelectric module.

    Thermoelectric element
    7.
    发明授权

    公开(公告)号:US12156470B2

    公开(公告)日:2024-11-26

    申请号:US17620442

    申请日:2020-06-17

    Abstract: A thermoelectric element according to one embodiment of the present disclosure includes a first substrate, a first insulating layer disposed on the first substrate, a second insulating layer disposed on the first insulating layer, a first electrode disposed on the second insulating layer, and a semiconductor structure disposed on the first electrode, wherein the first insulating layer includes an uneven portion, a partial region of the first electrode is buried in the second insulating layer, the second insulating layer includes a concave portion which is concave in a direction toward the first insulating layer from a side surface of the first electrode, and the concave portion vertically overlaps the uneven portion.

    Thermoelectric element
    8.
    发明授权

    公开(公告)号:US12063860B2

    公开(公告)日:2024-08-13

    申请号:US17041695

    申请日:2019-04-02

    CPC classification number: H10N10/17 H10N10/856

    Abstract: A thermoelectric element according to an embodiment of the present invention comprises: a first metal substrate; a first resin layer disposed on the first metal substrate and in direct contact with the first metal substrate; a plurality of first electrodes disposed on the first resin layer; a plurality of thermoelectric legs disposed on the plurality of first electrodes; a plurality of second electrodes disposed on the plurality of thermoelectric legs; a second resin layer disposed on the plurality of second electrodes; and a second metal substrate disposed on the second resin layer, wherein the first resin layer comprises a polymeric resin and an inorganic filler and at least a part of side surfaces of the plurality of first electrodes are embedded in the first resin layer.

    Thermoelectric element and manufacturing method thereof

    公开(公告)号:US11417816B2

    公开(公告)日:2022-08-16

    申请号:US16962606

    申请日:2019-01-22

    Abstract: A thermoelectric element according to an embodiment of the present invention comprises: a first metallic substrate; a first resin layer which is disposed on the first metallic substrate and comes in direct contact with the first metallic substrate; a plurality of first electrodes disposed on the first resin layer; a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the plurality of first electrodes; a plurality of second electrodes disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a second resin layer disposed on the plurality of second electrodes; and a second metallic substrate disposed on the second resin layer, wherein a surface of the first metallic substrate that faces the first resin layer comprises a first region and a second region disposed inside the first region, wherein a surface roughness of the second region is greater than a surface roughness of the first region, wherein the first resin layer is disposed on the second region.

    Thermoelectric module and heat conversion device using the same

    公开(公告)号:US09780282B2

    公开(公告)日:2017-10-03

    申请号:US14591226

    申请日:2015-01-07

    Inventor: Myoung Lae Roh

    CPC classification number: H01L35/32

    Abstract: Provided is a thermoelectric module capable of preventing the leakage of a current generated from a connection portion upon connecting a thermoelectric semiconductor element to an electrode by forming an insulating layer having a low heat conductivity on an external surface of the thermoelectric semiconductor element and improving performance of the thermoelectric element by controlling a heat transfer phenomenon from a heating part to a cooling part.

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