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公开(公告)号：US10903410B2
公开(公告)日：2021-01-26
申请号：US16402582
申请日：2019-05-03
Applicant: LG INNOTEK CO., LTD.
Inventor： Yong Sang Cho , Sang Gon Kim , Sook Hyun Kim , Chae Hoon Kim , Myoung Lae Roh , Jong Bae Shin , Boone Won , Jong Min Lee
Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.
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公开(公告)号：US09947854B2
公开(公告)日：2018-04-17
申请号：US14913220
申请日：2014-08-20
Applicant: LG INNOTEK CO., LTD.
Inventor： Yong Sang Cho , Sang Gon Kim , Sook Hyun Kim , Chae Hoon Kim , Myoung Lae Roh , Jong Bae Shin , Boone Won , Jong Min Lee
CPC classification number: H01L35/325 , H01L35/30 , H01L35/32
Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.
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公开(公告)号：US10326070B2
公开(公告)日：2019-06-18
申请号：US15914116
申请日：2018-03-07
Applicant: LG INNOTEK CO., LTD.
Inventor： Yong Sang Cho , Sang Gon Kim , Sook Hyun Kim , Chae Hoon Kim , Myoung Lae Roh , Jong Bae Shin , Boone Won , Jong Min Lee
Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.
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4.发明申请Thermoelectric Element, Thermoelectric Module Comprising Same, and Heat Conversion Apparatus 审中-公开热电元件，包括其的热电模块和热转换装置公开(公告)号：US20160204325A1
公开(公告)日：2016-07-14
申请号：US14913530
申请日：2014-08-20
Applicant: LG INNOTEK CO., LTD.
Inventor： Yong Sang Cho , Sang Gon Kim , Sook Hyun Kim , Chae Hoon Kim , Myoung Lae Roh , Jong Bae Shin , Boone Won , Jong Min Lee
Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module, and may provide a thermoelectric element and a thermoelectric module having notably improved cooling capacity (Qc) and rate of temperature change (AT) to be provided by constructing the thermoelectric element by stacking unit members, each of which comprises a semiconductor layer on a substrate, thereby lowering thermal conductivity and raising electric conductivity.
Abstract translation: 本发明的实施例涉及一种热电元件和热电模块，并且可以提供一种热电元件和热电模块，其具有明显提高的冷却能力（Qc）和温度变化率（AT），其通过构造热电元件 通过堆叠单元构件，每个单元构件在衬底上包括半导体层，从而降低导热性并提高导电性。
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公开(公告)号：US20150333246A1
公开(公告)日：2015-11-19
申请号：US14710946
申请日：2015-05-13
Applicant: LG INNOTEK CO., LTD.
Inventor： Jong Min Lee , Sang Gon Kim , Sook Hyun Kim , Chae Hoon Kim , Myoung Lae Roh , Joong Hyun Park , Hyung Min Sohn , Jong Bae Shin , Boone Won , Yong Sang Cho , Yun Kyoung Jo
Abstract: Provided is a heat conversion device, including: a unit thermoelectric module including a first semiconductor element and a second semiconductor element; and a heat conversion module performing heat conversion by coming into contact with the unit thermoelectric module, wherein the heat conversion module includes: a heat conversion substrate coming into direct contact with at least any one of one end and the other end of the first semiconductor element or the second semiconductor element; and a radiating unit disposed on the heat conversion substrate.
Abstract translation: 提供一种热转换装置，包括：单元热电模块，包括第一半导体元件和第二半导体元件; 以及通过与所述单元热电模块接触来进行热转换的热转换模块，其中所述热转换模块包括：热转换衬底，其与所述第一半导体元件的一端和另一端中的至少任一个直接接触 或第二半导体元件; 以及设置在所述热转换基板上的辐射单元。
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Patent Agency Ranking
公开(公告)号：US12219875B2
公开(公告)日：2025-02-04
申请号：US17755820
申请日：2020-11-02
Applicant: LG INNOTEK CO., LTD.
Inventor： Myoung Lae Roh , Seung Yong Lee , Hyung Eui Lee
Abstract: A power-generating apparatus according to an embodiment of the present invention comprises: a housing in which a fluid flows along the interior thereof and at least a portion of the wall surface thereof includes a flat surface formed of metal; a thermoelectric module disposed on the flat surface of the housing; and an insulating member disposed on the flat surface of the housing so as to be beside the thermoelectric module.
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公开(公告)号：US12156470B2
公开(公告)日：2024-11-26
申请号：US17620442
申请日：2020-06-17
Applicant: LG INNOTEK CO., LTD.
Inventor： Myoung Lae Roh , Jin Gyeong Park , Yong Sang Cho
Abstract: A thermoelectric element according to one embodiment of the present disclosure includes a first substrate, a first insulating layer disposed on the first substrate, a second insulating layer disposed on the first insulating layer, a first electrode disposed on the second insulating layer, and a semiconductor structure disposed on the first electrode, wherein the first insulating layer includes an uneven portion, a partial region of the first electrode is buried in the second insulating layer, the second insulating layer includes a concave portion which is concave in a direction toward the first insulating layer from a side surface of the first electrode, and the concave portion vertically overlaps the uneven portion.
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公开(公告)号：US12063860B2
公开(公告)日：2024-08-13
申请号：US17041695
申请日：2019-04-02
Applicant: LG INNOTEK CO., LTD.
Inventor： Myoung Lae Roh , Jong Min Lee , Yong Sang Cho
IPC: H10N10/856 , H10N10/17 , H10N10/817
CPC classification number: H10N10/17 , H10N10/856
Abstract: A thermoelectric element according to an embodiment of the present invention comprises: a first metal substrate; a first resin layer disposed on the first metal substrate and in direct contact with the first metal substrate; a plurality of first electrodes disposed on the first resin layer; a plurality of thermoelectric legs disposed on the plurality of first electrodes; a plurality of second electrodes disposed on the plurality of thermoelectric legs; a second resin layer disposed on the plurality of second electrodes; and a second metal substrate disposed on the second resin layer, wherein the first resin layer comprises a polymeric resin and an inorganic filler and at least a part of side surfaces of the plurality of first electrodes are embedded in the first resin layer.
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公开(公告)号：US11417816B2
公开(公告)日：2022-08-16
申请号：US16962606
申请日：2019-01-22
Applicant: LG INNOTEK CO., LTD.
Inventor： Myoung Lae Roh , Jong Min Lee , Yong Sang Cho
Abstract: A thermoelectric element according to an embodiment of the present invention comprises: a first metallic substrate; a first resin layer which is disposed on the first metallic substrate and comes in direct contact with the first metallic substrate; a plurality of first electrodes disposed on the first resin layer; a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the plurality of first electrodes; a plurality of second electrodes disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a second resin layer disposed on the plurality of second electrodes; and a second metallic substrate disposed on the second resin layer, wherein a surface of the first metallic substrate that faces the first resin layer comprises a first region and a second region disposed inside the first region, wherein a surface roughness of the second region is greater than a surface roughness of the first region, wherein the first resin layer is disposed on the second region.
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公开(公告)号：US09780282B2
公开(公告)日：2017-10-03
申请号：US14591226
申请日：2015-01-07
Applicant: LG INNOTEK CO., LTD.
Inventor： Myoung Lae Roh
CPC classification number: H01L35/32
Abstract: Provided is a thermoelectric module capable of preventing the leakage of a current generated from a connection portion upon connecting a thermoelectric semiconductor element to an electrode by forming an insulating layer having a low heat conductivity on an external surface of the thermoelectric semiconductor element and improving performance of the thermoelectric element by controlling a heat transfer phenomenon from a heating part to a cooling part.
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