Inkjet printhead
    21.
    发明申请
    Inkjet printhead 审中-公开
    喷墨打印头

    公开(公告)号:US20070103498A1

    公开(公告)日:2007-05-10

    申请号:US11599104

    申请日:2006-11-14

    IPC分类号: B41J29/38

    摘要: Some embodiments of the present invention provide an inkjet print head having a housing defining an ink reservoir, a nozzle portion including a nozzle plate deforming an ink chamber in fluid communication with the ink reservoir, and forming a fluid flow path between the ink chamber and the ink reservoir, and a substrate coupled to the nozzle plate and having a surface substantially positioned over the nozzle plate. At least one heating element can be coupled to the substrate, and can be positioned adjacent the surface to heat a portion of the ink chamber. In some embodiments, the inkjet print head comprises a control circuit coupled to the at least one heating element for controlling the heating element, and a temperature sense element positioned substantially between the at least one heating element and the control circuit or in at least partially overlapping relationship with the heating element.

    摘要翻译: 本发明的一些实施例提供一种喷墨打印头,其具有限定墨水容器的壳体,喷嘴部分包括喷嘴板,该喷嘴板使与墨水储存器流体连通的墨水室变形,并且在墨水室和 墨水储存器和连接到喷嘴板并具有基本上位于喷嘴板上方的表面的基板。 至少一个加热元件可以联接到基底,并且可以邻近表面定位以加热墨水腔的一部分。 在一些实施例中,喷墨打印头包括耦合到至少一个加热元件以控制加热元件的控制电路和基本上位于至少一个加热元件和控制电路之间或至少部分重叠的温度感测元件 与加热元件的关系。

    Micro-Fluid Ejection Device Having High Resistance Heater Film
    22.
    发明申请
    Micro-Fluid Ejection Device Having High Resistance Heater Film 审中-公开
    具有高电阻加热膜的微流体喷射装置

    公开(公告)号:US20060197807A1

    公开(公告)日:2006-09-07

    申请号:US11383661

    申请日:2006-05-16

    IPC分类号: B41J2/05

    摘要: A process for making a fluid ejector head for a micro-fluid ejection device. In one embodiment, the process comprises depositing a thin film resistive layer on a substrate to provide a plurality of thin film heaters. The thin film resistive layer comprises a tantalum-aluminum-nitride material consisting essentially of AlN, TaN, and TaAl alloys, and containing from about 30 to about 70 atomic % tantalum, from about 10 to about 40 atomic % aluminum and from about 5 to about 30 atomic % nitrogen.

    摘要翻译: 一种用于制造微流体喷射装置的流体喷射头的方法。 在一个实施例中,该方法包括在衬底上沉积薄膜电阻层以提供多个薄膜加热器。 薄膜电阻层包括主要由AlN,TaN和TaAl合金组成的钽 - 氮化铝材料,并且含有约30至约70原子%的钽,约10至约40原子%的铝和约5至约 约30原子%的氮。

    Micro-fluid ejection device having high resistance heater film
    23.
    发明申请
    Micro-fluid ejection device having high resistance heater film 有权
    具有高电阻加热膜的微流体喷射装置

    公开(公告)号:US20050157089A1

    公开(公告)日:2005-07-21

    申请号:US10760726

    申请日:2004-01-20

    IPC分类号: B41J2/14 B41J2/05

    摘要: A semiconductor substrate for a micro-fluid ejection head. The substrate includes a plurality of fluid ejection actuators disposed on the substrate. Each of the fluid ejection actuators includes a thin heater stack comprising a thin film heater and one or more protective layers adjacent the heater. The thin film heater is made of a tantalum-aluminum-nitride thin film material having a nano-crystalline structure consisting essentially of AlN, TaN, and TaAl alloys, and has a sheet resistance ranging from about 30 to about 100 ohms per square. The thin film material contains from about 30 to about 70 atomic % tantalum, from about 10 to about 40 atomic % aluminum and from about 5 to about 30 atomic % nitrogen.

    摘要翻译: 一种用于微流体喷射头的半导体衬底。 衬底包括设置在衬底上的多个流体喷射致动器。 每个流体喷射致动器包括薄加热器堆叠,其包括薄膜加热器和与加热器相邻的一个或多个保护层。 薄膜加热器由具有主要由AlN,TaN和TaAl合金组成的纳米晶体结构的钽 - 氮化铝薄膜材料制成,并且具有约30至约100欧姆/平方的薄层电阻。 薄膜材料含有约30至约70原子%的钽,约10至约40原子%的铝和约5至约30原子%的氮。

    Microfluid ejection device having efficient logic and driver circuitry
    24.
    发明申请
    Microfluid ejection device having efficient logic and driver circuitry 有权
    具有高效逻辑和驱动电路的微流体排出装置

    公开(公告)号:US20050104928A1

    公开(公告)日:2005-05-19

    申请号:US10713483

    申请日:2003-11-14

    IPC分类号: B41J2/05 B41J2/14 B41J2/145

    摘要: A semiconductor substrate for a microfluid ejection head. The substrate includes a plurality of fluid ejection actuators disposed on the substrate. A plurality of driver transistors are disposed on the substrate for driving the plurality of fluid ejection actuators. Each of the driver transistors have an active area ranging from about 1000 to less than about 15,000 μm2. A plurality of logic circuits including at least one logic transistor are coupled to the driver transistors. The driver and logic transistors are provided by a high density array of MOS transistors wherein at least the logic transistors have a gate length of from about 0.1 to less than about 3 microns.

    摘要翻译: 一种用于微流体喷射头的半导体衬底。 衬底包括设置在衬底上的多个流体喷射致动器。 多个驱动晶体管设置在基板上用于驱动多个流体喷射致动器。 每个驱动晶体管具有约1000至小于约15,000mum 2的有效面积。 包括至少一个逻辑晶体管的多个逻辑电路耦合到驱动晶体管。 驱动器和逻辑晶体管由MOS晶体管的高密度阵列提供,其中至少逻辑晶体管具有约0.1至小于约3微米的栅极长度。