摘要:
A process for making a fluid ejector head for a micro-fluid ejection device. In one embodiment, the process comprises depositing a thin film resistive layer on a substrate to provide a plurality of thin film heaters. The thin film resistive layer comprises a tantalum-aluminum-nitride material consisting essentially of AlN, TaN, and TaAl alloys, and containing from about 30 to about 70 atomic % tantalum, from about 10 to about 40 atomic % aluminum and from about 5 to about 30 atomic % nitrogen.
摘要:
A semiconductor substrate for a micro-fluid ejection head. The substrate includes a plurality of fluid ejection actuators disposed on the substrate. Each of the fluid ejection actuators includes a thin heater stack comprising a thin film heater and one or more protective layers adjacent the heater. The thin film heater is made of a tantalum-aluminum-nitride thin film material having a nano-crystalline structure consisting essentially of AlN, TaN, and TaAl alloys, and has a sheet resistance ranging from about 30 to about 100 ohms per square. The thin film material contains from about 30 to about 70 atomic % tantalum, from about 10 to about 40 atomic % aluminum and from about 5 to about 30 atomic % nitrogen.
摘要:
An ink jet printer including a printer cartridge containing a printhead attached to a cartridge carriage for translation of the cartridge across a print media. The printer also includes an off carriage ink supply, a printer microprocessor, and a combined ink fill tube and electrical connection cable connected between the cartridge and the off carriage ink supply for providing refill ink to the ink cartridge and control of the carriage and printhead. Improvements to the printer enable low cost, high quality printing to be achieved.
摘要:
Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heater array and the second heater array, and a temperature sensing element operable to sense the temperature of the region, where the temperature sensing element is substantially centrally disposed with respect to the region. According to one embodiment of the invention, the temperature sensing element comprises a temperature sensing resistor.
摘要:
An inkjet printhead heater chip includes a resistor layer, a dielectric layer on the resistor layer and a cavitation layer on the dielectric layer. A grounded-gate MOSFET electrically attaches to the cavitation layer to protect the dielectric layer from breakdown during an electrostatic discharge (ESD) event. Protection typically embodies the safe distribution of ESD current to ground during user printhead installation. Locations of the grounded-gate MOSFET(s) include terminal ends of one or more columns of ink ejecting elements formed by the resistor layer. Also, the MOSFET source electrically connects to the gate while the drain attaches to the cavitation layer. The drain attaches via first and second metallization lines, including attachment generally above the cavitation layer. The dielectric layer is diamond like carbon layer and is about 2000 angstroms thick. Inkjet printheads and printers are also disclosed.
摘要:
Power is provided from one portion of a printer, such as a printer electronics module, to another portion of the printer, such as a printhead. Logic signals produced in a first electronic module of the printer are transmitted to a second electronics module of the printer. A power signal is derived from the logic signals without interfering with the magnitude or duration of logic signals, and the logic power signal is applied to power the second electronic module without having a separate dedicated power line.
摘要:
A semiconductor substrate for a micro-fluid ejecting device. The semiconductor substrate includes a plurality of fluid ejection devices disposed on the substrate. A plurality of driver transistors are disposed on the substrate for driving the plurality of fluid ejection devices. A programmable memory matrix containing embedded programmable memory devices is operatively connected to the micro-fluid ejecting device for collecting and storing information on the semiconductor substrate for operation of the micro-fluid ejecting device. The programmable memory matrix provides a high density of memory bits embedded on the substrate for storing information about the micro-fluid ejecting device.
摘要:
A micro-fluid ejecting device includes a semiconductor substrate, a plurality of fluid ejection elements formed on the semiconductor substrate, and a plurality of nonvolatile programmable memory devices for storing information related to the operation of the micro-fluid ejecting device. The programmable memory devices, which are at least partially embedded in the semiconductor substrate, each include a source region and a drain region formed in the semiconductor substrate. The source and drain regions have a conductivity type which is opposite the conductivity type of the semiconductor substrate. An insulative layer is formed on the semiconductor substrate over the source region and drain region. A floating gate region is formed on the insulative layer and is spatially disposed between the source region and drain region. The floating gate region is electrically insulated from the source and drain regions by the insulative layer. Electrical contacts are connected to the source region and the drain region. The programmable memory devices collectively provide a high density of memory bits embedded on the substrate for storing information about the micro-fluid ejecting device.
摘要:
Printheads configured to operate in accordance with a plurality of print modes. For example, one of the plurality of print modes can be selected in accordance with a bit of address data received by the printhead. In an exemplary embodiment, the selection of print mode can be accomplished by switching one or more actuator (e.g., heater) circuit addresses on the printhead.
摘要:
A heater chip that includes a circuit element, and a bus that can be used to power the circuit element. The heater chip also includes a feedback circuit that is coupled to the power bus. Particularly, the feedback circuit can be configured to indicate if the bus is powered the circuit element.